Search

BR-112021010603-B1 - Rack-mountable enclosure and heat-emitting device system.

BR112021010603B1BR 112021010603 B1BR112021010603 B1BR 112021010603B1BR-112021010603-B1

Abstract

Rack-mountable enclosure for a heat-emitting device. The present invention relates to a rack-mountable enclosure (1'') for a heat-emitting device, wherein the rack-mountable enclosure (1'') comprises: an enclosure (3') forming a heat-emitting device chamber, and a heat-emitting device containment structure (77) disposed within the heat-emitting device chamber and configured to support a heat-emitting device, a cold air inlet (71) disposed vertically below the heat-emitting device containment structure (77), configured to allow cold air to flow into the heat-emitting device chamber, the heat-emitting device containment structure (77) being configured to allow cold air to flow vertically through the heat-emitting device containment structure (77), wherein the enclosure (3') has a wall (3d') provided with a hot air outlet (73) disposed vertically above the heat-emitting device containment structure (77) to allow heated air introduced into the heat-emitting device chamber as cold air through the inlet. cold air (71) exit the heat-emitting device chamber, where the (...).

Inventors

  • Sumon Bishwas

Assignees

  • HYMETH APS

Dates

Publication Date
20260310
Application Date
20190923
Priority Date
20181220

Claims (13)

  1. 1. Rack-mount box assembly comprising a first rack-mount box (1") and a second rack-mount box (1"), each for a heat-emitting device, characterized in that each rack-mount box (1") comprises: an enclosure (3') forming a heat-emitting device chamber, and a heat-emitting device containment structure (77) disposed within the heat-emitting device chamber and configured to support a heat-emitting device, the heat-emitting device containment structure (77) comprising a tray and a rail assembly configured to support or suspend the tray, the tray being configured to slide along the rail assembly such that the tray can slide out of the enclosure (3'), or a rail assembly upon which the heat-emitting device can be placed or suspended directly from it, a cold air inlet (71) disposed vertically below the heat-emitting device containment structure (77), configured to allow cold air to flow into the heat-emitting device chamber, the structure of containment of heat-emitting device (77) being configured to allow cold air to flow vertically through the containment structure of heat-emitting device (77), wherein the enclosure (3') has a wall (3a'; 3b'; 3c'; 3d') provided with a hot air outlet (73) arranged vertically above the containment structure of heat-emitting device (77) to allow heated air introduced into the heat-emitting device chamber as cold air through the cold air inlet (71) exits the heat-emitting device chamber, wherein the enclosure (3') has a roof structure (79) extending into the heat-emitting chamber, the roof structure (79) being configured to direct heated air in the heat-emitting device chamber to the hot air outlet (73), wherein the first and second rack-mount boxes (1") are arranged side-by-side, and wherein the side walls between the first rack-mount box and the second rack-mount box have been removed, in whereby the heat-emitting device chamber of the first rack-mount box (1") and the heat-emitting device chamber of the second rack-mount box (1") are opened towards each other, thereby forming a single common heat-emitting device chamber.
  2. 2. Rack-mounted box assembly according to claim 1, characterized in that the roof structure (79) is pyramid-shaped, V-shaped, or has the shape of a right triangle.
  3. 3. Rack-mount box assembly, according to claim 1 or 2, characterized in that the roof structure has a sloped surface configured to direct heated air to the hot air outlet (73).
  4. 4. Rack-mountable enclosure assembly, according to any of the preceding claims, characterized in that the roof structure (79) is pyramid-shaped, and in that several non-parallel walls (3a'; 3b'; 3c'; 3d') of the enclosure (3') are provided with a hot air outlet, the pyramid-shaped roof structure (79) being configured to direct the heated air to the hot air outlets (73).
  5. 5. Rack-mountable enclosure assembly, according to any of the preceding claims, characterized in that only one wall (3a'; 3b'; 3c'; 3d') of the enclosure (3') is provided with a hot air outlet (73), and in that the roof structure (79) has the form of a right triangle having its inclined surface (79a) in the form of a hypotenuse surface facing the hot air outlet (73).
  6. 6. Rack-mountable enclosure assembly, according to any of the preceding claims, characterized in that the cold air inlet (71) is disposed on a lower side of the enclosure (3') or is provided in a wall of the enclosure.
  7. 7. Rack-mountable box assembly according to claim 6, characterized in that the cold air inlet (71) is provided in the wall (3a'; 3b'; 3c'; 3d'), and the wall (3a'; 3b'; 3c'; 3d') is a front wall (3c'), a rear wall (3d') or a side wall (3a', 3b').
  8. 8. Rack-mountable enclosure assembly according to claim 6 or 7, characterized in that the cold air inlet (71) and the hot air outlet (73) are provided on opposite walls (3a', 3b'; 3c', 3d') of the enclosure (3').
  9. 9. Rack-mountable enclosure assembly, according to any of the preceding claims, characterized in that the enclosure (3') is made of a thermal insulating material comprising polymer or wood.
  10. 10. Heat-emitting device system, characterized in that it comprises: the rack-mounting box assembly, as defined in any one of claims 1 to 9, and for each rack-mounting box (1'), a heat-emitting device supported by or suspended from the heat-emitting device containment structure (7).
  11. 11. Heat-emitting device system according to claim 10, characterized in that the heat-emitting device system is a high-pressure electrolyzer system, and the heat-emitting device is a high-pressure electrolytic cell (9).
  12. 12. Heat-emitting device system according to claim 11, characterized in that the electrolytic cell (9) comprises a plurality of electrolytic cells, each electrolytic cell comprising two electrode plates (23), wherein each electrode plate (23) has a perimeter (41) provided with heat fins (43).
  13. 13. Heat-emitting device system according to any one of claims 10 and 12, characterized in that the electrolytic cell (9) has an electrolyzer cooling channel inlet (47a) and an electrolyzer cooling channel outlet (47b).

Description

FIELD OF TECHNIQUE [001] The present invention relates to the cooling of heat-emitting devices, such as high-pressure electrolyzers. BACKGROUND OF THE INVENTION [002] The electrolysis of water is a process in which water molecules are broken down, forming hydrogen gas and oxygen gas. This process occurs as a result of an electric current flowing between two electrodes submerged in water. [003] For certain applications, it may be desirable to compress the hydrogen gas and oxygen gas generated in the electrolysis process. Traditionally, this gas compression is done as soon as the gas is discharged from the electrolyzer system. [004] More recently, it has been proposed to perform gas compression during electrolysis. An example of a high-pressure electrolyzer system is presented in U.S. Patent No. 20050072688 A1. The system includes a pump to pump water to the electrolytic cells, a check valve that prevents a backflow of water to the pump, and an electrolyzer stack comprising the electrolytic cells. [005] Due to the high pressure in the electrolyzer, there will be the development of additional heat within the electrolyzer. The electrical resistivity is therefore increased, resulting in a loss of efficiency of the electrolyzer. SUMMARY OF THE INVENTION [006] In some applications, rack mounting of an electrolyzer may be desirable. A rack-mounted electrolyzer may need to meet certain standard dimensions. For example, the electrolyzer may need to have a width dimension that fits into a standard 19-inch rack. This small size may present challenges with cooling the electrolyzer. [007] In view of the foregoing, a general objective of the present invention is to provide a rack-mountable enclosure for a heat-emitting device that solves or at least mitigates the problems of the prior art. [008] It is, therefore, according to a first aspect of the present invention, provided a rack-mountable enclosure for a heat-emitting device, which rack-mountable enclosure comprises: an enclosure that forms a heat-emitting device chamber, and a heat-emitting device containment structure disposed in the heat-emitting device chamber and configured so as to support a heat-emitting device, a cold air inlet disposed vertically below the heat-emitting device containment structure configured so as to allow cold air to flow into the heat-emitting device chamber, a tray that is configured so as to allow cold air to flow vertically through the heat-emitting device containment structure, the enclosure having a wall provided with a hot air outlet disposed vertically above the heat-emitting device containment structure in order to allow the heated air introduced into the heat-emitting device chamber as cold air through the cold air inlet to exit the heat-emitting device chamber, the enclosure having a roof structure that extends into the heat-emitting chamber, a The ceiling structure is configured to direct the heated air from the heat-emitting device chamber to the hot air outlet. [009] Ambient air is therefore used to cool the external surfaces of the heat-emitting device located inside the rack-mount enclosure. Due to the continuous circulation of cool air through the enclosure, no cooling done with motors, such as fans, will be necessary. Cooling can therefore consume less energy and be less noisy. In addition, the rack-mount enclosure can be more compact and easier to maintain, since fans remove dust and an enclosure equipped with fans would require cleaning and would be more economical. [0010] The heat-emitting device may be, for example, a high-pressure electrolyzing cell, a power supply unit for a high-pressure electrolyzing cell, or a pump. [0011] Depending on the design, the roof structure is pyramid-shaped, V-shaped, or shaped like a right triangle. [0012] According to one embodiment, the roof structure has a sloped surface configured so as to direct heated air to the hot air outlet. [0013] The pyramid-shaped ceiling structure, the V-shaped ceiling structure, or the right-angled triangle ceiling structure, therefore, have an inclined surface that is configured so as to direct heated air to the hot air outlet. The inclined surface may be inclined with respect to a horizontal plane defined by the heat-emitting device containment structure or to a plane defined by an external flat ceiling of the enclosure. [0014] The containment structure of a heat-emitting device may comprise a tray and a rail assembly that supports the tray. The tray may be configured so as to slide along the rail assembly in such a way that the tray can slide out of the enclosure. [0015] The rack-mount enclosure may include supports. The rail assembly may be provided with a support wheel to support the rail assembly when the tray is slid out of the enclosure. The support wheel may be centrally arranged along a median plane with respect to the sides or side walls of the rack-mount enclosure. [0016] Alternatively, the containment structure of the heat-emitting device may c