CN-110739258-B - Wafer taking and separating device and method

CN110739258BCN 110739258 BCN110739258 BCN 110739258BCN-110739258-B

Abstract

The invention relates to the technical field of solar cell manufacturing equipment, in particular to a wafer taking and separating device and a wafer taking and separating method. The device comprises a driving assembly, a separating assembly, a motion controller, a movable controller and a movable arm, wherein the driving assembly is connected with the separating assembly, the separating assembly is fixedly provided with an adsorption plate, a reversible adsorption arm and the adsorption plate which are arranged on one side of the adsorption plate can be respectively adsorbed on the lower surface of a substrate and the upper surface of a film, so that a wafer can be clamped between the adsorption plate and the adsorption arm and can be synchronously moved under the driving action of the driving assembly to take out the wafer from a carrier, the motion controller is connected with the adsorption arm, and when the driving assembly drives the adsorption plate to contact and vacuum adsorb the adsorption arm on the lower surface of the substrate, the motion controller can drive the adsorption arm to vertically move so as to enable the adsorption arm to contact and vacuum adsorb the film, and can also drive the adsorption arm to laterally overturn so that the adsorption arm drives the film to be separated from the substrate, thereby realizing rapid taking of the wafer and rapid separation of the substrate and the film, and greatly improving productivity.

Inventors

ZOU JINCHENG
WEI MIN
SHEN BINGBING
Cust Sorabji
Eric Sanford
Steven ejda
Raj Vilka
HE GAN
ARCHER MELISSA

Assignees

紫石能源有限公司
东泰高科装备科技有限公司
奥塔装置公司

Dates

Publication Date: 20260421
Application Date: 20180720
Priority Date: 20180720

Claims (18)

1. The wafer taking and separating device is characterized by comprising a separating assembly and a driving assembly, wherein a wafer comprises a substrate and a film arranged on the substrate, the driving assembly is connected with the separating assembly, an adsorption plate is fixed on the separating assembly and is used for adsorbing and fixing the substrate, a reversible adsorption arm is arranged on one side of the adsorption plate, the adsorption plate and the adsorption arm can be adsorbed on the lower surface of the substrate and the upper surface of the film respectively, so that the wafer is clamped between the adsorption plate and the adsorption arm, and under the driving action of the driving assembly, the adsorption arm and the adsorption plate can synchronously move so as to take out the wafer from a carrier; The adsorption arm is connected with a motion controller, and when the driving component drives the adsorption plate to contact and vacuum adsorb the lower surface of the substrate, the motion controller can drive the adsorption arm to vertically move so as to enable the adsorption arm to contact and vacuum adsorb the film; The motion controller comprises a rotating mechanism and a sliding control mechanism, the sliding control mechanism is connected with the adsorption arm through the rotating mechanism, under the driving action of the sliding control mechanism, the rotating mechanism and the adsorption arm can synchronously slide vertically, and the rotating mechanism can drive the adsorption arm to turn sideways; The rotary mechanism comprises a belt transmission mechanism, wherein a driving wheel of the belt transmission mechanism is connected with a servo motor through a rotary coupler, and any driven wheel of the belt transmission mechanism is connected with the adsorption arm through a rotating shaft; The adsorption arm comprises a central shaft and vacuum adsorption sheets, the rotating mechanism and the vacuum adsorption sheets are respectively connected to two ends of the central shaft, the central shaft and the vacuum adsorption sheets are arranged in a non-coaxial mode, and under the driving of the sliding control mechanism, the central shaft can drive the vacuum adsorption sheets to vertically slide and drive the vacuum adsorption sheets to laterally overturn around the central shaft.
2. The wafer taking and separating device according to claim 1, wherein the slide control mechanism includes: The rotary sliding plate is connected with a guide rail through a sliding block, the sliding block is used for driving the rotary sliding plate to vertically slide along the guide rail, and the rotary coupler and the rotary shaft are respectively fixed on the rotary sliding plate; The cylinder is vertically connected to the rotary slide plate and can drive the rotary slide plate to slide when the cylinder stretches; and the limiting unit is arranged on the rotary slide plate and is used for limiting the highest point and the lowest point of the sliding stroke of the rotary slide plate respectively.
3. The wafer taking and separating device according to claim 2, wherein the limiting unit comprises limiting fixed blocks and limiting sleeve members, wherein the limiting fixed blocks are respectively arranged at the highest position and the lowest position of the sliding stroke of the rotary sliding plate, limiting tables are respectively arranged at two sides of the rotary sliding plate, one limiting table is arranged opposite to the limiting fixed block arranged at the highest position, the other limiting table is arranged opposite to the limiting fixed block arranged at the lowest position, and the limiting sleeve members are arranged on any pair of limiting tables and limiting fixed blocks.
4. A wafer taking and separating device according to claim 3, wherein the limit kit comprises a limit bolt and a limit nut which are arranged in a matched manner.
5. The wafer taking and separating device according to claim 2, wherein two ends of the rotating shaft are respectively connected with the rotating slide plate through bearing fixing seats.
6. The wafer taking and separating device according to claim 1, wherein the adsorption arm further comprises a stepped shaft, one end of the stepped shaft is connected with the central shaft, the other end of the stepped shaft is provided with a connecting arm, the stepped shaft is connected with the vacuum adsorption sheet through the connecting arm, the connecting arm and the central shaft are arranged in a non-coaxial manner, and when the central shaft rotates, the connecting arm can drive the vacuum adsorption sheet to turn from one side of the central shaft to the other side under the rotation action of the stepped shaft, so that the vacuum adsorption sheet turns around the central shaft in a lateral direction.
7. The wafer pickup and separation apparatus according to claim 1, wherein the vacuum suction sheet is turned sideways around the central axis by an angle ranging from 0 ° to 360 °.
8. The wafer lift and lower separation apparatus of claim 1, wherein the suction arm further comprises a vacuum generator coupled to the vacuum suction plate.
9. The wafer taking and separating device according to claim 1, wherein the separating assembly further comprises a carrying table, the adsorption plate is fixed on the carrying table, the adsorption arm is installed on the carrying table through a motion controller, the carrying table is connected to the driving assembly, and under the driving of the driving assembly, the carrying table can drive the adsorption plate and the adsorption arm to move synchronously.
10. The wafer taking and separating device according to claim 9, wherein the carrying table comprises a fixed bottom plate and a fixed side plate, the fixed side plate stands on the fixed bottom plate, the motion controller is installed on one side of the fixed side plate, a fixed arm is outwards extended from the end of the fixed bottom plate, the fixed arm is correspondingly arranged on one side of the motion controller, and the extended end of the fixed arm is connected with the adsorption plate.
11. The wafer taking and separating device according to any one of claims 1 to 10, wherein a separating unit is composed of one reversible adsorption arm and one adsorption plate, the separating unit comprises a forward separating unit and a reverse separating unit, the adsorption arm of the forward separating unit is arranged on the outer side of the adsorption plate, the adsorption arm of the reverse separating unit is arranged on the inner side of the adsorption plate, the forward separating unit and the reverse separating unit are arranged at intervals, and the turnover directions of the two adsorption arms in the adjacent forward separating unit and the adjacent reverse separating unit are opposite.
12. The wafer take-off and separation device of any one of claims 1-10, wherein the drive assembly comprises: the X-axis driver is connected with the separation assembly to drive the adsorption plate and the adsorption arm to synchronously move horizontally; And the Y-axis driver is connected with the X-axis driver and used for driving the X-axis driver to vertically move.
13. The wafer taking and separating device according to claim 12, wherein the driving assembly further comprises a connecting mechanism, the X-axis driver is fixed on the connecting mechanism, the Y-axis driver is connected with the connecting mechanism, and the connecting mechanism can drive the X-axis driver to move vertically under the driving action of the Y-axis driver.
14. The wafer taking and separating device according to claim 13, wherein the connecting mechanism comprises a connecting bottom plate and a connecting side plate, the X-axis driver is fixed on the connecting bottom plate, the connecting bottom plate is fixed on the connecting side plate, the connecting side plate is connected with the Y-axis driver, and the connecting side plate can drive the connecting bottom plate to move vertically under the driving of the Y-axis driver.
15. The wafer taking and separating device according to claim 14, wherein the X-axis driver comprises an X-axis driving motor, a synchronous pulley and a horizontal sliding rail, the horizontal sliding rail is laid on the connecting base plate, a slidable horizontal sliding block is arranged on the horizontal sliding rail, the separating assembly is fixedly connected to the horizontal sliding block, and the X-axis driving motor drives the horizontal sliding block to horizontally move along the horizontal sliding rail through the synchronous pulley so that the horizontal sliding block drives the separating assembly to horizontally move.
16. The wafer taking and separating device according to claim 14, wherein the Y-axis driver comprises a Y-axis driving motor and a vertical sliding rail, a movable vertical sliding block is arranged on the vertical sliding rail, the vertical sliding block is connected with the Y-axis driving motor and can vertically move along the vertical sliding rail under the driving of the Y-axis driving motor, the connecting side plate is fixedly connected to the vertical sliding block, and the connecting side plate drives the connecting bottom plate to vertically move under the driving of the vertical sliding block so as to drive the X-axis driver to vertically move.
17. The wafer taking and separating device according to claim 16, wherein the vertical sliding rail is a screw rod, the screw rod is connected with the Y-axis driving motor through a driving coupler, the vertical sliding block is sleeved on the screw rod, and the Y-axis driving motor drives the screw rod to rotate through the driving coupler so as to drive the vertical sliding block to vertically move along the screw rod.
18. A wafer taking and separating method, characterized in that the method is based on a wafer taking and separating device according to any one of claims 1-17, the method comprising the steps of: the driving assembly drives the adsorption plate to contact and adsorb on the lower surface of the substrate in vacuum, and drives the adsorption arm to turn sideways through the motion controller, so that the adsorption arm turns to the upper side of the substrate, and a gap is reserved between the adsorption arm and the adsorption plate; the motion controller drives the adsorption arm to vertically slide so that the adsorption arm contacts and vacuum adsorbs the film on the substrate; The driving assembly drives the adsorption plate and the adsorption arm to synchronously move so as to synchronously take out the substrate and the film from the carrier; and keeping the adsorption plate fixed, and driving the adsorption arm to laterally overturn through the motion controller so that the adsorption arm drives the film to be separated from the substrate.

Description

Wafer taking and separating device and method Technical Field The invention relates to the technical field of solar cell manufacturing equipment, in particular to a wafer taking and separating device and a wafer taking and separating method. Background Thin film solar cells are novel photovoltaic devices that alleviate energy crisis. The thin film solar cell can be manufactured by using different materials such as ceramics, graphite, metal sheets and the like with low price as a substrate, so that the consumption of raw materials can be greatly reduced compared with the silicon substrate solar cell under the same light receiving area, the thickness of the thin film capable of generating voltage is only required to be a few micrometers, and the thin film has good conversion efficiency. Besides the plane, the thin film battery solar cell has flexibility, can be manufactured into a non-plane structure, has wide application range, can be combined with a building or becomes a part of the building, and has very wide application. In the fabrication of thin film solar cells, a square substrate with a solar thin film is placed in a carrier by surface tension bonding after an etching process. To meet the requirements of the subsequent production process, the substrates need to be taken out of the carrier one by one, and then the substrates are separated from the thin film. In the prior art, only one substrate can be taken out at a time, and after the substrate is taken out, the substrate is required to be put into another separation assembly to be separated from the film, so that a group of separation procedures of the substrate and the film can be realized at a time, the substrate taking and the separation are divided into two procedures in sequence, different equipment is required to be used for completion, the separation procedure is longer, and the productivity is greatly influenced. Disclosure of Invention First, the technical problem to be solved The invention provides a wafer taking and separating device and a wafer taking and separating method, which can not only realize the rapid taking of a substrate, but also realize the rapid separation of the substrate and a film, thereby improving the productivity. (II) technical scheme In order to solve the technical problems, the invention provides a wafer taking and separating device, which comprises a separating component and a driving component, wherein a wafer comprises a substrate and a film arranged on the substrate, the driving component is connected with the separating component, an adsorption plate is fixed on the separating component and is used for adsorbing and fixing the substrate, one side of the adsorption plate is provided with a reversible adsorption arm, the adsorption plate and the adsorption arm can be adsorbed on the lower surface of the substrate and the upper surface of the film respectively, so that the wafer is clamped between the adsorption plate and the adsorption arm, and the adsorption arm and the adsorption plate can synchronously move under the driving action of the driving component so as to take out the wafer from a carrier; the adsorption arm is connected with a motion controller, the motion controller can drive the adsorption arm to vertically move when the driving component drives the adsorption plate to contact and vacuum adsorb the lower surface of the substrate so as to enable the adsorption arm to contact and vacuum adsorb the film, and the motion controller can also drive the adsorption arm to laterally overturn so as to enable the adsorption arm to drive the film to be separated from the substrate. Preferably, the motion controller comprises a rotating mechanism and a sliding control mechanism, the sliding control mechanism is connected with the adsorption arm through the rotating mechanism, under the driving action of the sliding control mechanism, the rotating mechanism and the adsorption arm can synchronously slide vertically, and the rotating mechanism can drive the adsorption arm to turn sideways. Preferably, the rotating mechanism comprises a belt transmission mechanism, a driving wheel of the belt transmission mechanism is connected with a servo motor through a rotating coupler, any driven wheel of the belt transmission mechanism is connected with the adsorption arm through a rotating shaft, and the rotating coupler and the rotating shaft are respectively connected with the sliding control mechanism. Preferably, the slide control mechanism includes: The rotary sliding plate is connected with a guide rail through a sliding block, the sliding block is used for driving the rotary sliding plate to vertically slide along the guide rail, and the rotary coupler and the rotary shaft are respectively fixed on the rotary sliding plate; The cylinder is vertically connected to the rotary slide plate and can drive the rotary slide plate to slide when the cylinder stretches; and the limiting unit is arranged on the rotary slide plate