CN-111837235-B - Three-dimensional electronic device distribution through geodetic facets

Abstract

In one embodiment, the flexible circuit board includes a plurality of facet locations, each facet location corresponding to a particular rigid sensor facet of the plurality of rigid sensor facets and a particular rigid display facet of the plurality of rigid display facets. The flexible circuit board also includes a plurality of wiring traces that connect the plurality of facet locations in series. The facet locations are arranged in a plurality of facet columns. When the flexible circuit board is flat, at least some of the facet locations are separated from one or more adjacent facet locations by a plurality of gaps. When the flexible circuit board is formed into a three-dimensional shape, the plurality of gaps are substantially eliminated, thereby allowing the plurality of rigid sensor facets to form a continuous sensing surface and the plurality of rigid display facets to form a continuous display surface.

Inventors

• M. A. ramkin
• K. M. lingenberg
• J. D. ramkin

Assignees

• 洛克希德·马丁公司

Dates

Publication Date

20260505

Application Date

20190123

Priority Date

20180207

Claims (20)

1. 1. An electronic assembly, comprising: Flexible circuit board A first plurality of facets coupled to a first side of the flexible circuit board, each of the first plurality of facets being rigid and including a first plurality of pixels; Wherein: Each facet of the plurality of facets has a polygonal shape; The flexible circuit board includes a plurality of facet locations, each facet location corresponding to one of the facets, the plurality of facet locations arranged in a plurality of facet columns; At least some of the facet locations are separated from one or more adjacent facet locations by a plurality of gaps when the flexible circuit board is planar, and When the flexible circuit board is formed into a three-dimensional shape, the plurality of gaps are substantially eliminated, thereby forming a continuous surface across at least some of the plurality of facets.
2. 2. The electronic assembly of claim 1, wherein the three-dimensional shape comprises a hemispherical shape.
3. 3. The electronic assembly of claim 1, wherein the polygon comprises a quadrilateral, pentagon, hexagon, heptagon, or octagon.
4. 4. The electronic assembly of claim 1, wherein: the first plurality of facets is sensor facets and the plurality of pixels of the first plurality of facets is sensor pixels, or The first plurality of facets is a display facet and the plurality of pixels of the first plurality of facets is display pixels.
5. 5. The electronic assembly of claim 1, further comprising: A second plurality of facets coupled to a second side of the flexible circuit board opposite the first side, each of the second plurality of facets being rigid and including a second plurality of pixels.
6. 6. The electronic assembly of claim 5, wherein: The first plurality of facets are sensor facets; The second plurality of facets being display facets, and Each particular facet location is configured to transmit a signal between a particular sensor facet coupled to the particular facet location and a particular display facet coupled to the particular facet location, thereby displaying light from the particular display facet corresponding to light captured by the particular sensor facet.
7. 7. The electronic assembly of claim 1, further comprising a plurality of logic facets, each logic facet being rigid and having a polygonal shape.
8. 8. A flexible circuit board, comprising: A plurality of facet locations, each facet location corresponding to: a particular rigid sensor facet of the plurality of rigid sensor facets, and A particular rigid display facet of the plurality of rigid display facets, and A plurality of wiring traces connecting the plurality of facet locations in series; Wherein: The plurality of facet locations are arranged in a plurality of facet columns; At least some of the facet locations are separated from one or more adjacent facet locations by a plurality of gaps when the flexible circuit board is planar, and When the flexible circuit board is formed into a three-dimensional shape, the plurality of gaps are substantially eliminated, thereby allowing: the plurality of rigid sensor facets forming a continuous sensing surface, and The plurality of rigid display facets form a continuous display surface.
9. 9. The flexible circuit board of claim 8, wherein the three-dimensional shape comprises a spherical or hemispherical shape.
10. 10. The flexible circuit board of claim 8, wherein the plurality of rigid sensor facets and the plurality of rigid display facets have a polygonal shape.
11. 11. The flexible circuit board of claim 10, wherein the polygon comprises a quadrilateral, pentagon, hexagon, heptagon, or octagon.
12. 12. The flexible circuit board of claim 8, wherein each facet location further corresponds to one of a plurality of logical facets, each logical facet being rigid and having a polygonal shape.
13. 13. The flexible circuit board of claim 8, wherein each particular facet location is configured to transmit a signal between a particular sensor facet electrically coupled to the particular facet location and a particular display facet electrically coupled to the particular facet location, thereby displaying light from the particular display facet corresponding to light captured by the particular sensor facet.
14. 14. A method of manufacturing an electronic assembly, comprising: Forming a plurality of facet locations on the flexible circuit board, each facet location corresponding to one of a plurality of sensor facets and one of a plurality of display facets, the plurality of facet locations arranged in a plurality of facet columns; Cutting the flexible circuit board into a pattern that allows the flexible circuit board to be formed into a three-dimensional shape after cutting, wherein: when the flexible circuit is planar, at least some of the facet locations are separated from one or more adjacent facet locations by a plurality of gaps, and When the flexible circuit board is formed into a three-dimensional shape, the plurality of gaps are substantially eliminated; Assembling the electronic assembly by coupling a first plurality of rigid facets to a first side of a flexible circuit board, each rigid facet coupled to a respective one of the facet locations, and The assembled electronic component is formed into a three-dimensional shape.
15. 15. The method of manufacturing an electronic assembly of claim 14, wherein each rigid facet comprises a logic unit.
16. 16. The method of manufacturing an electronic assembly of claim 14, further comprising printing a flexible circuit board.
17. 17. The method of manufacturing an electronic assembly of claim 14, wherein the three-dimensional shape comprises a spherical or hemispherical shape.
18. 18. The method of manufacturing an electronic assembly of claim 14, wherein the first plurality of rigid facets have a polygonal shape.
19. 19. The method of manufacturing an electronic component of claim 18, wherein the polygon comprises a triangle, a quadrilateral, a pentagon, a hexagon, a heptagon, or an octagon.
20. 20. The method of manufacturing an electronic assembly of claim 14, wherein: the first plurality of rigid facets are rigid sensor facets; The method further includes coupling a plurality of rigid display facets to a second side of the flexible circuit board opposite the first side, each rigid display facet coupled to a respective one of the facet locations, and Each particular facet location is configured to transmit a signal between a particular rigid sensor facet electrically coupled to the particular facet location and a particular rigid display facet electrically coupled to the particular facet location, thereby displaying light from the particular rigid display facet corresponding to light captured by the particular rigid sensor facet.

Description

Three-dimensional electronic device distribution through geodetic facets Technical Field The present disclosure relates generally to light field displays and cameras, and more particularly to three-dimensional electronic device distribution through geodetic facets (geodesic faceting). Background Electronic displays are used in a variety of applications. For example, displays are used in smart phones, laptop computers, and digital cameras. In addition to electronic displays, some devices (such as smartphones and digital cameras) may also include image sensors. Although some cameras and electronic displays capture and reproduce light fields separately, light field displays and light field cameras are typically not integrated with each other. Disclosure of Invention In one embodiment, the flexible circuit board includes a plurality of facet (facet) locations, each facet location corresponding to a particular rigid sensor facet of the plurality of rigid sensor facets and a particular rigid display facet of the plurality of rigid display facets. The flexible circuit board also includes a plurality of wiring traces that connect the plurality of facet locations in series. The facet locations are arranged in a plurality of facet columns. When the flexible circuit board is flat, at least some of the facet locations are separated from one or more adjacent facet locations by a plurality of gaps. When the flexible circuit board is formed into a three-dimensional shape, the plurality of gaps are substantially eliminated, thereby allowing the plurality of rigid sensor facets to form a continuous sensing surface and the plurality of rigid display facets to form a continuous display surface. The present disclosure provides several technical advantages. Some embodiments provide for complete and accurate re-creation of the target light field while remaining lightweight and comfortable to wear by the user. Some embodiments provide a thin electronic system that provides both opacity and controllable one-way simulated transparency, as well as digital display capabilities such as Virtual Reality (VR), augmented Reality (AR), and Mixed Reality (MR). Some embodiments provide a direct sensor to display system that uses direct correlation of input pixels to corresponding output pixels to avoid the need for image conversion. For some systems, this reduces complexity, cost, and power requirements. Some embodiments provide an intra-layer signal processing structure that provides locally distributed processing of large amounts of data (e.g., 160k of image data or more), thereby avoiding bottlenecks and performance, power and transmission line problems associated with existing solutions. Some embodiments accurately capture and display a quantity of light to a viewer using a microlens layer with an array of all-optical cells. All-optical cells include opaque cell walls to eliminate optical crosstalk between cells, thereby improving the accuracy of the replicated light field. Some embodiments provide three-dimensional electronics through geodetic facets. In such embodiments, the flexible circuit board having an array of small rigid surfaces (e.g., display and/or sensor facets) may be formed in any 3D shape that is particularly helpful in accommodating the narrow radius of curvature (e.g., 30-60 mm) required for a head-mounted near-eye surrounding display. Some embodiments provide a distributed multi-screen array for a high density display. In such an embodiment, an array of small high resolution microdisplays (e.g., display facets) of custom size and shape are formed and then assembled on a larger flexible circuit board, which can then be formed into a 3D shape (e.g., hemispherical surface). Each micro-display can operate independently of any other display, thereby providing a large array of many high resolution displays with unique content on each such that the entire assembly together forms essentially a single very high resolution display. Some embodiments provide a distributed multi-aperture camera array. Such an embodiment provides an array of custom sized and shaped small image sensors (e.g., sensor facets), all assembled on a larger flexible circuit board that is then formed into a 3D (e.g., hemispherical) shape. Each discrete image sensor may operate independently of any other image sensor to provide a large array of many apertures, capturing unique content on each aperture, such that the entire assembly becomes a very high resolution multi-node camera that is seamless in nature. Other technical advantages will be readily apparent to one skilled in the art from figures 1A through 42, descriptions thereof, and claims. Furthermore, while specific advantages have been enumerated above, various embodiments may include all, some, or none of the enumerated advantages. Drawings For a more complete understanding of the present disclosure and the advantages thereof, reference is now made to the following descriptions taken in conjunction wi