CN-112447892-B - Light-emitting element and method for manufacturing same

CN112447892BCN 112447892 BCN112447892 BCN 112447892BCN-112447892-B

Abstract

The invention discloses a light-emitting element and a manufacturing method thereof, wherein the light-emitting element comprises a first edge, a second edge opposite to the first edge, a substrate, a plurality of light-emitting units arranged in N rows on the upper surface, a plurality of conductive structures and a plurality of conductive structures, wherein the N rows comprise a first light-emitting unit row on the first edge and an N-th light-emitting unit row on the second edge, the conductive structures are arranged on the light-emitting units and are electrically connected with the light-emitting units, the first light-emitting unit row comprises a first light-emitting unit, the first light-emitting unit comprises a notch, and the notch is arranged on the first edge and has a bottom exposed upper surface.

Inventors

CHEN ZHENGYU
YE HUIJUN
SHEN JIANFU

Assignees

晶元光电股份有限公司

Dates

Publication Date: 20260508
Application Date: 20200828
Priority Date: 20190830

Claims (12)

1.A light-emitting element, comprising: a first edge and a second edge opposite to the first edge; a substrate comprising an upper surface; The light emitting units are arranged in N rows and are positioned on the upper surface, wherein the N rows comprise a first light emitting unit row positioned on the first edge and an Nth light emitting unit row positioned on the second edge; And The conductive structures are positioned on the light-emitting units and are electrically connected with the light-emitting units; Wherein the first light-emitting unit row comprises a first light-emitting unit, and the Nth light-emitting unit row comprises a second light-emitting unit and a third light-emitting unit; A groove between the second light emitting unit and the third light emitting unit; The first light-emitting unit comprises a notch which is positioned at the first edge and is recessed inwards from the first edge, the notch is positioned on the extension line of the groove, and the bottom of the notch exposes the upper surface.
2. The light emitting device of claim 1, wherein the first light emitting unit comprises a first sidewall at the first edge, and the substrate comprises a second sidewall at the first edge, the first sidewall being connected to the second sidewall and coplanar.
3. The light emitting device of claim 2, wherein the first sidewall is connected to the recess.
4. The light emitting device of claim 2, wherein the recess comprises a third sidewall having an included angle with the upper surface that is smaller than an included angle of the first sidewall with the upper surface.
5. The light emitting device of claim 1, wherein a difference between a maximum bottom width of the recess and a minimum bottom width of the trench is less than 20%.
6. The light emitting device of claim 1, wherein the recess comprises a third sidewall and the trench comprises a fourth sidewall, the third sidewall having an included angle with the upper surface that differs from the fourth sidewall having an included angle with the upper surface by less than 10%.
7. The light emitting device of claim 1, wherein the second light emitting unit comprises a fourth sidewall at the second edge, the substrate comprises a fifth sidewall at the second edge, and the fourth sidewall is connected to the fifth sidewall and coplanar.
8. The light-emitting device according to claim 1, wherein the first light-emitting unit comprises a first semiconductor layer, an active layer, and a second semiconductor layer sequentially formed on the upper surface, and The recess is located in the first semiconductor layer.
9. A method of manufacturing a plurality of light emitting elements, comprising: forming a semiconductor stack on an upper surface of a substrate; Forming a trench in the semiconductor stack, and defining the semiconductor stack into a plurality of light emitting units, each light emitting element including a portion of the light emitting units; Wherein: the adjacent light-emitting elements comprise a first light-emitting element and a second light-emitting element, and the light-emitting units comprise a first light-emitting unit, a second light-emitting unit and a third light-emitting unit; The first light-emitting element comprises the first light-emitting unit, and the second light-emitting element comprises the second light-emitting unit and the third light-emitting unit; The second light-emitting unit and the third light-emitting unit are adjacent to the first light-emitting unit; The semiconductor stack between the second light emitting unit, the third light emitting unit and the first light emitting unit has a portion connected to each other, and The groove between the second light-emitting unit and the third light-emitting unit extends into the first light-emitting unit, and Performing a dicing step to divide the semiconductor stack of the connected portion; wherein the groove extending into the first light emitting unit forms a recess in the first light emitting unit.
10. The method of claim 9, wherein forming said trench comprises removing a portion of said semiconductor stack to expose said upper surface.
11. The method of claim 9, wherein the recess is located at an edge of the first light emitting element and has a bottom exposing the upper surface.
12. The method of claim 9, wherein performing the dicing step further comprises dividing the substrate into a plurality of portions corresponding to the light emitting elements; The first light-emitting unit comprises a first side wall; One of the portions corresponding to the first light emitting unit includes a second sidewall, and The first side wall and the second side wall are connected.

Description

Light-emitting element and method for manufacturing same Technical Field The present invention relates to a light emitting device, and more particularly, to a light emitting device including a plurality of light emitting units. Background Light Emitting Diodes (LEDs) among solid state light emitting devices have low power consumption, low heat generation, long life, small size, fast reaction speed, and good photoelectric characteristics, such as stable light emission wavelength, and thus have been widely used in home appliances, lighting devices, indicator lamps, and photoelectric products. With the development of photoelectric technology, solid-state light-emitting elements have made considerable progress in light-emitting efficiency, operating life, and luminance. The conventional led chip includes a substrate, an n-type semiconductor layer, an active layer, and a p-type semiconductor layer formed on the substrate, and p-and n-electrodes formed on the p-type/n-type semiconductor layer, respectively. When the light emitting diode chip is energized through the electrode and forward biased at a specific value, holes from the p-type semiconductor layer and electrons from the n-type semiconductor layer combine within the active layer to emit light. The high-voltage light-emitting diode chip is formed by dividing the area of the light-emitting diode chip into a plurality of light-emitting units on a single substrate and then connecting the light-emitting units in series. Compared with the traditional single light-emitting diode chip, the high-voltage light-emitting diode chip can work under low current and high voltage and has larger output power under the same chip size. The high-voltage light-emitting diode chip can determine the number and the size of the light-emitting units according to the requirements of different input voltages, can be optimized for each light-emitting unit, and has the advantages of high voltage operation, small volume, excellent application elasticity for packaging and optical design, and the like. Disclosure of Invention A light-emitting element comprises a first edge, a second edge opposite to the first edge, a substrate, a plurality of light-emitting units, a plurality of conductive structures and a plurality of light-emitting structures, wherein the substrate comprises an upper surface, the light-emitting units are arranged in N rows and are positioned on the upper surface, the N rows comprise a first light-emitting unit row which is positioned on the first edge and an N-th light-emitting unit row which is positioned on the second edge, the conductive structures are positioned on the light-emitting units and are electrically connected with the light-emitting units, the first light-emitting unit row comprises a first light-emitting unit, and the first light-emitting unit comprises a notch which is positioned on the first edge and has a bottom exposed upper surface. A light-emitting element comprises a first edge, a second edge opposite to the first edge, a substrate, a plurality of light-emitting units, a substrate, a plurality of conductive structures and a plurality of grooves, wherein the substrate comprises an upper surface, the light-emitting units are arranged in N rows and are located on the upper surface, the N rows of light-emitting units comprise a first row of light-emitting units and an N row of light-emitting units are located on the second edge, the conductive structures are located on the light-emitting units and are electrically connected with the light-emitting units, the first row of light-emitting units comprises a first light-emitting unit, the first light-emitting unit comprises a notch, the N row of light-emitting units comprises a second light-emitting unit, a third light-emitting unit and a groove which is located between the second light-emitting unit and the third light-emitting unit, and the notch is located on an extension line of the groove. Drawings Fig. 1A to 1E are top views showing steps in a method for manufacturing a light emitting device 1 according to an embodiment of the present invention; Fig. 2A to 2F are sectional views showing steps in a method for manufacturing the light emitting device 1 according to an embodiment of the present invention; Fig. 3 is a top view of a light emitting device 1 according to an embodiment of the present invention; FIG. 4A is an enlarged view of a portion of FIG. 1E; fig. 4B is a partially enlarged top view of a method for manufacturing a light-emitting element in the comparative example; FIG. 5 is a scanning electron microscope (Scanning Electron Microscope; SEM) image of a light-emitting device 1 according to an embodiment of the present invention; Fig. 6A is a top view of a light emitting element 2 according to another embodiment of the present invention; fig. 6B is a top view showing a method of manufacturing a light emitting element 2 according to another embodiment of the present invention; Fig. 6C is a par