CN-112602377-B - Light emitting device, light emitting module, electronic apparatus, and method for manufacturing light emitting device

Abstract

Provided is a light-emitting device capable of displaying for a long time in a bent state. Provided is a light-emitting device which can be repeatedly bent with a small radius of curvature. The invention relates to a light-emitting device which has flexibility and comprises a light-emitting element, a first inorganic insulating layer, a second inorganic insulating layer and a first organic insulating layer. The first organic insulating layer is located on the first inorganic insulating layer. The light emitting element is located on the first inorganic insulating layer through the first organic insulating layer. The second inorganic insulating layer is located on the light emitting element. The end portions of the first inorganic insulating layer and the end portions of the second inorganic insulating layer are located inside the end portions of the first organic insulating layer. The end portion of the first organic insulating layer is exposed at the side surface of the light emitting device. The first inorganic insulating layer and the second inorganic insulating layer are preferably in contact with each other outside the end portion of the light emitting element.

Inventors

• An won soon
• Shunping in the valley
• SATO MASATAKA

Assignees

• 株式会社半导体能源研究所

Dates

Publication Date

20260505

Application Date

20190808

Priority Date

20180824

Claims (16)

1. 1. A light emitting device, comprising: a first substrate; A light emitting portion on the first substrate; a second substrate on the light emitting portion; a first region, and A second region of the substrate is provided with a second region, Wherein the first region comprises a first end of the light emitting device, The second region includes a second end of the light emitting device, The first ends of the first and second substrates overlap each other at the first end of the light emitting device, The second ends of the first and second substrates overlap each other at the second ends of the light emitting devices, The inorganic film extending from the light emitting portion is not provided in the first region and the second region, The light emitting portion is between the first region and the second region, The light emitting portion, the first region, and the second region are flexible.
2. 2. The light-emitting device according to claim 1, Wherein the light emitting device is bendable along a line passing through a portion of the light emitting portion, a portion of the first region, and a portion of the second region.
3. 3. The light-emitting device according to claim 1 or 2, further comprising: External connection terminal, and A wiring portion provided in the substrate, Wherein the wiring portion is between the light emitting portion and the external connection terminal, The inorganic film extending from the wiring portion is not provided in the first region and the second region, The wiring portion is between the first region and the second region, The wiring portion has flexibility.
4. 4. The light-emitting device according to claim 1 or 2, further comprising: An external connection terminal; a wiring section; A third region, and A fourth region of the substrate is provided with a third region, Wherein the third region comprises a third end of the light emitting device, The fourth region includes a fourth end of the light emitting device, The inorganic film extending from the wiring portion is not provided in the third region and the fourth region, The wiring portion is between the third region and the fourth region, The wiring portion, the third region, and the fourth region have flexibility.
5. 5. The light-emitting device according to claim 4, Wherein the light emitting device is bendable along a line passing through a portion of the wiring portion, a portion of the third region, and a portion of the fourth region.
6. 6. A flexible light emitting device comprising: a first substrate; A light emitting element; A first inorganic insulating layer; a second inorganic insulating layer; A first organic insulating layer, and A second substrate having a second surface on which a second substrate, Wherein the first inorganic insulating layer is on the first substrate, The first organic insulating layer is on the first inorganic insulating layer, The light emitting element is on the first inorganic insulating layer through the first organic insulating layer, The second inorganic insulating layer is on the light emitting element, The second substrate is on the second inorganic insulating layer, The end portions of the first inorganic insulating layer and the end portions of the second inorganic insulating layer are both inside the end portions of the first organic insulating layer, The end portion of the first organic insulating layer is exposed at the side of the flexible light emitting device, And, the end portion of the first substrate and the end portion of the second substrate overlap each other at the side surface of the flexible light emitting device.
7. 7. The flexible lighting device of claim 6, Wherein the first inorganic insulating layer and the second inorganic insulating layer are in contact with each other outside an end portion of the light emitting element.
8. 8. The flexible lighting device of claim 7, Wherein the first organic insulating layer includes an opening outside an end portion of the light emitting element, And, the first inorganic insulating layer and the second inorganic insulating layer are in contact with each other in the opening.
9. 9. The flexible lighting device of claim 6, further comprising: A second organic insulating layer is provided over the first organic insulating layer, Wherein the first organic insulating layer comprises a different material than the second organic insulating layer, The first organic insulating layer is on the second organic insulating layer, The second organic insulating layer covers an end portion of the first inorganic insulating layer, And, an end portion of the second organic insulating layer is exposed at a side surface of the flexible light emitting device.
10. 10. A method of manufacturing a light emitting device, manufacturing a plurality of light emitting devices and dividing the plurality of light emitting devices into individual light emitting devices, comprising: Forming a peeling layer over a first substrate; forming a first inorganic insulating layer on the peeling layer; Forming a first opening in the first inorganic insulating layer; Forming a first organic insulating layer on the first inorganic insulating layer; forming a light emitting element on the first organic insulating layer; forming a second inorganic insulating layer over the light emitting element; attaching a second substrate on the second inorganic insulating layer; Separating the first substrate and the first inorganic insulating layer from each other; attaching a third substrate to overlap the second substrate with the first inorganic insulating layer interposed therebetween, and The plurality of light emitting devices are divided into the respective light emitting devices in such a manner that the first opening is included in the dividing portion.
11. 11. The method for manufacturing a light-emitting device according to claim 10, Wherein the first organic insulating layer forms a second opening inside the first opening, And, the second inorganic insulating layer is formed inside the second opening.
12. 12. The method for manufacturing a light-emitting device according to claim 10, Wherein the peeling layer includes a metal oxide layer and a resin layer on the metal oxide layer.
13. 13. The method for manufacturing a light-emitting device according to claim 10, Wherein the peeling layer includes a resin layer.
14. 14. The method for manufacturing a light-emitting device according to claim 10, Wherein the stripping layer comprises a metal layer and an oxide insulating layer on the metal layer, The metal layer includes a third opening overlapping the first opening, The oxide insulating layer includes a fourth opening overlapping both the first opening and the third opening, And, at a portion where the first opening, the third opening, and the fourth opening overlap each other, the first substrate and the first organic insulating layer are in contact with each other.
15. 15. The method for manufacturing a light-emitting device according to claim 10, Wherein a second organic insulating layer is formed using a material different from the first organic insulating layer before the first organic insulating layer is formed, The peeling layer comprises a metal layer and an oxide insulating layer on the metal layer, The metal layer includes a third opening overlapping the first opening, The oxide insulating layer includes a fourth opening overlapping both the first opening and the third opening, And the second organic insulating layer is in contact with the first substrate through the first opening, the third opening, and the fourth opening.
16. 16. The method for manufacturing a light-emitting device according to claim 10, Wherein the peeling layer comprises a first metal layer, an oxide insulating layer on the first metal layer, and a second metal layer on the oxide insulating layer, And, the first opening overlaps the second metal layer.

Description

Light emitting device, light emitting module, electronic apparatus, and method for manufacturing light emitting device Technical Field One embodiment of the present invention relates to a light emitting device, a light emitting module, and an electronic apparatus. One embodiment of the present invention relates to a method for manufacturing a light-emitting device. In particular, one embodiment of the present invention relates to a light emitting device having flexibility and a method of manufacturing the same. Note that one embodiment of the present invention is not limited to the above-described technical field. Examples of the technical field of one embodiment of the present invention include a semiconductor device, a display device, a light-emitting device, a power storage device, a storage device, an electronic device, a lighting device, an input device (for example, a touch sensor or the like), an input/output device (for example, a touch panel or the like), a driving method of these devices, and a manufacturing method of these devices. Background A light-emitting element (also referred to as an "EL element") using Electroluminescence (EL) has characteristics that it is easy to realize thin and light weight, that it can respond to an input signal at high speed, that it can be driven using a dc low-voltage power supply, and the like, and is expected to be applied to a display device or a lighting device. Further, development of a flexible device in which a functional element such as a semiconductor element, a display element, or a light-emitting element is provided over a flexible substrate (hereinafter also referred to as a "flexible substrate") has been advanced. Typical examples of the flexible device include various semiconductor circuits including semiconductor elements such as transistors, in addition to an illumination device and an image display device. Patent document 1 discloses a flexible light emitting device using an organic EL element. [ Prior Art literature ] [ Patent literature ] [ Patent document 1] Japanese patent application laid-open No. 2014-197522 Disclosure of Invention Technical problem to be solved by the invention A light-emitting device using an EL element is expected to be applied to, for example, an electronic device having a curved display portion, an electronic device capable of folding a display portion, or the like. Therefore, improvement of bending resistance of the light emitting device is important. A light emitting device having a curved surface needs to display in a curved state for a long time. Further, the foldable light emitting device needs to be able to withstand repeated bending (specifically, repeated bending 5 ten thousand times or more and repeated bending 10 ten thousand times or more). Patent document 1 has studied a method of peeling a semiconductor element, a light-emitting element, or the like formed over a glass substrate with a peeling layer interposed therebetween and transposing the peeled semiconductor element, the light-emitting element, or the like onto a flexible substrate. By adopting this method, the formation temperature of the semiconductor element can be increased, and a light-emitting device with extremely high reliability can be manufactured. In order to realize practical use, a flexible light emitting device needs to be manufactured with high yield. An object of one embodiment of the present invention is to provide a light-emitting device capable of displaying for a long time in a bent state. An object of one embodiment of the present invention is to provide a light emitting device capable of being repeatedly bent with a small radius of curvature. An object of one embodiment of the present invention is to provide a light-emitting device with high reliability. It is an object of one embodiment of the present invention to provide a light emitting device which is not easily damaged. One of the objects of the present invention is to reduce the thickness and weight of a light-emitting device. An object of one embodiment of the present invention is to provide an electronic device including a display portion having flexibility or a display portion having a curved surface. An object of one embodiment of the present invention is to provide a method for manufacturing a light-emitting device with high yield. An object of one embodiment of the present invention is to provide a method for manufacturing a light-emitting device with high productivity. An object of one embodiment of the present invention is to provide a method for manufacturing a light-emitting device at low cost. Note that the description of these objects does not hinder the existence of other objects. Not all of the above objects need be achieved in one embodiment of the present invention. Other objects than the above objects can be extracted from the description of the specification, drawings, and claims. Means for solving the technical problems One embodiment of the present invent