CN-113263644-B - Cutting device and cutting method

Abstract

The invention provides a cutting device and a cutting method, which solve the problems generated in a holding table made of porous materials by adopting a new structure on the holding surface of the holding table. A cutting device (2) cuts a workpiece (wafer (10)) having a line (13) for cutting, the cutting device (2) comprising a holding table (27) for holding the workpiece by suction and moving the workpiece in a machining feed direction (K), the holding table (27) comprising a holding member (74), the holding member (74) comprising a holding surface (74 c) formed with a suction groove (77) for holding the workpiece by suction, and a cutting unit (46) comprising a cutting tool (B1) for cutting the workpiece held by the holding table (27), the suction groove (77) being set to extend in a direction offset from the machining feed direction (K) by a predetermined angle (θ).

Inventors

• Kubo Atsutsugu
• Koh Yoshimasa

Assignees

• 株式会社迪思科

Dates

Publication Date

20260512

Application Date

20210207

Priority Date

20200214

Claims (8)

1. 1. A cutting device for cutting an object to be processed having a line to cut, wherein, The cutting device comprises: A holding table having a holding member having a holding surface formed with a linear suction groove for sucking and holding a workpiece; a cutting unit having a cutting tool for cutting the workpiece held by the holding table, and A machining feed mechanism for relatively moving the holding table with respect to the cutting unit in a machining feed direction, The linear suction groove is set to extend in a direction deviated from the machining feed direction by a predetermined angle, The linear suction grooves are formed only by two vertical linear suction grooves passing through the center of the holding surface, An annular suction groove is provided on the holding surface at a position outside the workpiece in a state where the workpiece is held, The linear suction groove is communicated with the annular suction groove, The linear suction groove and the annular suction groove are concave grooves formed on the surface of the holding surface and open upward, The holding member is composed of a transparent member, and the surface of the holding surface is flat except for the two linear suction grooves and the annular suction groove.
2. 2. The cutting device according to claim 1, wherein, The annular suction grooves are concentrically provided.
3. 3. Cutting device according to claim 1 or 2, characterized in that, The holding member is formed of glass and is, The cutting device further includes an imaging camera for imaging the surface to be held of the workpiece via the holding member.
4. 4. Cutting device according to claim 1 or 2, characterized in that, A groove of the cut workpiece is photographed, When the linear groove exists at the photographed coordinate position, information of the linear groove is displayed superimposed on the photographed image.
5. 5. A cutting method for cutting an object to be processed having a line to be cut by a cutting tool, wherein, The cutting method comprises the following steps: A holding step of holding the workpiece by a holding table having a holding member having a holding surface formed with a linear suction groove for sucking and holding the workpiece, and A cutting step of relatively moving the holding table with respect to the cutting tool in a machining feed direction, cutting the predetermined line of the workpiece with the cutting tool, The linear suction groove is set to extend in a direction deviated from the machining feed direction by a predetermined angle, The linear suction grooves are formed only by two vertical linear suction grooves passing through the center of the holding surface, An annular suction groove is provided on the holding surface at a position outside the workpiece in a state where the workpiece is held, The linear suction groove is communicated with the annular suction groove, The linear suction groove and the annular suction groove are concave grooves formed on the surface of the holding surface and open upward, The holding member is composed of a transparent member, and the surface of the holding surface is flat except for the two linear suction grooves and the annular suction groove.
6. 6. The cutting method according to claim 5, wherein, The annular suction grooves are concentrically provided.
7. 7. The cutting method according to claim 5 or 6, wherein, The holding member is formed of glass and is, The cutting method further includes a step of photographing the surface to be held of the workpiece with a photographing camera through the holding member after the holding step is performed.
8. 8. The cutting method according to claim 5 or 6, wherein, The cutting method further has a groove confirmation step of photographing the groove after the cutting step is performed, In the groove confirmation step, when the linear groove exists at the photographed coordinate position, information of the linear groove is displayed superimposed on the photographed image.

Description

Cutting device and cutting method Technical Field The present invention relates to a cutting device and a cutting method for cutting a workpiece having a line to be cut by a cutting tool. Background Conventionally, as disclosed in patent document 1, for example, there is known a cutting device in which a holding table is made of a porous material such as a porous ceramic containing alumina ceramic or zirconia as a main component, and a workpiece is sucked and held by the holding table. In cutting, the lower surface of the workpiece is supported by the holding surface, and a cutting tool is cut into the workpiece to form a cutting groove. Patent document 1 Japanese patent application laid-open No. 2008-62476 The holding surface of the holding table made of a porous material has minute concave portions and convex portions. Further, the held surface (lower surface) of the workpiece is not supported at the concave portion. When full-cut is performed in the above-described state, in which the workpiece is completely cut in the thickness direction by the cutting tool, a large notch may be generated in the workpiece holding surface in the region corresponding to the concave portion. In addition, even when half-cutting is performed in which a workpiece is cut into the workpiece at a predetermined depth by a cutting tool to form a half-cut groove, a crack may occur from the bottom of the half-cut groove in a region corresponding to the concave portion. In addition, in the holding table made of a porous material, the concave portions appear randomly, and the occurrence of the notches or cracks in the workpiece also becomes random, which is not predicted. Disclosure of Invention The present invention aims to solve the above-described problems occurring in a holding table made of a porous material by adopting a new structure on a holding surface of the holding table. According to one embodiment of the present invention, there is provided a cutting device for cutting an object to be machined having a line to be cut, the cutting device including a holding table having a holding member having a holding surface formed with a suction groove for suction-holding the object to be machined, a cutting unit having a cutting tool for cutting the object to be machined held by the holding table, and a machining feed mechanism for relatively moving the holding table relative to the cutting unit in a machining feed direction, the suction groove being set to extend in a direction deviated from the machining feed direction by a predetermined angle. In addition, according to one embodiment of the present invention, the suction groove is configured to include at least two suction grooves perpendicular to each other. In addition, according to one aspect of the present invention, the holding member is made of glass, and the cutting device further includes an imaging camera that images the held surface of the workpiece with the holding member interposed therebetween. Further, according to one aspect of the present invention, there is provided a cutting method for cutting a workpiece having a line to be cut by a cutting tool, the cutting method including a holding step of holding the workpiece by a holding table having a holding member having a holding surface formed with an attraction groove for attracting and holding the workpiece, and a cutting step of relatively moving the holding table in a machining feed direction with respect to the cutting tool, the line to be cut by the cutting tool, the attraction groove being set to extend in a direction deviated from the machining feed direction by a predetermined angle. In addition, according to one embodiment of the present invention, the suction groove is configured to include at least two suction grooves perpendicular to each other. In one embodiment of the present invention, the holding member is made of glass, and the cutting method further includes an imaging step of imaging the surface to be held of the workpiece with the imaging camera interposed therebetween after the holding step is performed. According to one aspect of the present invention, the workpiece can be held by the holding member having the flat holding surface, and occurrence of chipping and cracking can be reduced as compared with the case where the holding member is made of a porous material in which concave portions and convex portions are present at random, and improvement in processing quality can be achieved. In addition, since the line to cut and the suction groove are not parallel, the overlapping area of the line to cut and the suction groove can be reduced, and deterioration of the machining quality in the workpiece can be suppressed. Further, according to one aspect of the present invention, the workpiece can be reliably sucked and held over a wide range by the suction groove. Further, according to one aspect of the present invention, the workpiece can be photographed from the lower side, and the line to be cut can