CN-113533932-B - Thermal test head for integrated circuit devices

Abstract

A thermal test head for an integrated circuit device includes a heat exchanger assembly, a contact assembly configured to contact an integrated circuit, and a thermal control assembly disposed between the heat exchanger assembly and the contact assembly. The thermal control assembly includes a Peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the contact assembly, and a spacer in physical contact with opposing surfaces of the heat exchanger assembly and the contact assembly.

Inventors

• CHEN XIREN
• WANG ZHAOMENG
• MAI YAOKUN
• Murari Krishna Govinda nases Karan

Assignees

• 永科新加坡有限公司

Dates

Publication Date

20260508

Application Date

20210419

Priority Date

20200420

Claims (18)

1. 1. A thermal test head for an integrated circuit device, the integrated circuit device comprising a chip mounted on a substrate, the thermal test head comprising: a heat exchanger assembly; A chip contact member configured to contact the chip, and A thermal control assembly disposed between the heat exchanger assembly and the chip contact member, the thermal control assembly comprising: a Peltier device in thermal contact with opposite surfaces of the heat exchanger assembly and the chip contact member, and A spacer in physical contact with the opposing surfaces of the heat exchanger assembly and the chip contact member; A tilt adjustment device coupled to a surface of the heat exchanger assembly and disposed opposite the thermal control assembly, wherein the tilt adjustment device comprises: an alignment plate coupled to a surface of the heat exchanger assembly; A locking plate disposed above the alignment plate and configured to move toward or away from the alignment plate, and A plurality of springs disposed between the locking plate and the alignment plate; wherein the plurality of springs bias the locking plate away from the alignment plate; Wherein the tilt adjustment device further comprises one or more springs disposed between the alignment plate and the heat exchanger assembly and configured to bias the alignment plate away from the heat exchanger assembly; A substrate contact member and at least one support member connecting the substrate contact member to the alignment plate, the substrate contact member configured to contact and apply pressure to a substrate.
2. 2. The thermal test head of claim 1, wherein the spacer is disposed at least partially around the peltier device.
3. 3. The thermal test head of claim 1 or 2, wherein the heat exchanger assembly is configured to circulate fluid therethrough.
4. 4. A thermal test head according to claim 3, wherein the heat exchanger assembly comprises: a manifold defining a cavity; A cold plate comprising micro fins on a first surface of the cold plate, and A channel body defining a fluid flow channel, the micro-fins and the channel body disposed in the cavity of the manifold; The cold plate comprises a heat conductive metal, and/or The manifold comprises a plastic material, and/or The channel body comprises one of a metal or a plastic material.
5. 5. The thermal test head of claim 4, wherein the one or more springs between the alignment plate and the heat exchanger assembly are disposed in one or more grooves on a surface of the manifold.
6. 6. A thermal test head according to claim 1 or 2, wherein the spacer has an annular structure defining a central opening, and the peltier device is disposed in the central opening of the spacer.
7. 7. The thermal test head of claim 6, wherein the spacer comprises a body having at least one channel for extending a respective electrical lead of the peltier device through a respective channel of the at least one channel when the peltier device is located in the central opening of the spacer.
8. 8. A thermal test head according to claim 1 or claim 2, wherein the spacer comprises a plastics or ceramic material.
9. 9. The thermal test head of claim 1 or 2, further comprising: a first layer of thermal interface material disposed between the Peltier device and the chip contact member, and A second layer of thermal interface material disposed between the Peltier device and the heat exchanger assembly, Wherein the height of the spacer is equal to the sum of the height of the peltier device, the height of the first layer of thermal interface material and the height of the second layer of thermal interface material.
10. 10. The thermal test head of claim 9, wherein the first layer of thermal interface material is in physical contact with the peltier device and the chip contact member, and the second layer of thermal interface material is in physical contact with the peltier device and the heat exchanger assembly.
11. 11. The thermal test head of claim 1, wherein the alignment plate includes a convex protrusion extending toward the latch plate, the plurality of springs of the tilt adjustment device being disposed about the convex protrusion.
12. 12. The thermal test head of claim 1 or 11, wherein the tilt adjustment device is configured to change the angular alignment of the contact surfaces of the chip contact members; Wherein the contact surface is configured to contact the chip.
13. 13. The thermal test head of claim 1, wherein the thermal test head comprises a plurality of thermal probes, The chip contact member includes a base extending through an opening in the substrate contact member, the base having a contact surface configured to contact the chip, and The substrate contact member includes a flange extending at least partially around the opening, the flange having a contact surface configured to contact the substrate.
14. 14. The thermal test head of claim 13, wherein the flange is shaped to form a square or rectangular annulus.
15. 15. The thermal test head of claim 13 or 14, wherein the thermal test head comprises a thermally conductive material, The chip contact member includes one or more guide pins configured to fit into corresponding one or more grooves in the substrate contact member when the chip contact member is moved closer to the substrate contact member, and The substrate contact member includes one or more locating pins configured to fit into corresponding one or more locating holes of the integrated circuit device when the substrate contact member is moved closer to the integrated circuit device.
16. 16. A thermal test head according to claim 1 or 2, wherein, The tilt adjustment device is configured such that initial movement of the tilt adjustment device toward the integrated circuit device causes the chip contact member to contact the chip, and further movement of the tilt adjustment device toward the integrated circuit device causes the substrate contact member to contact the substrate.
17. 17. The thermal test head of claim 1 or 2, wherein the effective stiffness of the one or more springs between the alignment plate and the heat exchanger assembly is greater than the effective stiffness of the plurality of springs between the locking plate and the alignment plate.
18. 18. The thermal test head of claim 1 or 2, wherein the chip contact member comprises one or more temperature sensors configured to monitor a temperature of the integrated circuit device.

Description

Thermal test head for integrated circuit devices Technical Field The present invention relates generally to thermal test heads for maintaining the temperature of an integrated circuit (INTEGRATED CIRCUIT, simply "IC") device under test (Device Under Test, simply "DUT"). Background Typically, the IC devices are tested (e.g., functional testing) at a specified temperature before they are shipped to a customer. For example, microprocessor devices are often subjected to class testing to determine the effective operating speed of the device. During such testing, the device under test (often referred to as a DUT) is maintained at a fixed temperature (or a prescribed temperature) while the device is being tested. In order to maintain the DUT at a prescribed temperature during testing, a thermal test head (sometimes referred to as a thermal control unit) is typically employed. The thermal test head is configured to heat or cool the DUT to a prescribed temperature during testing and to maintain the device at that temperature. Such thermal test heads often use a thermoelectric heat pump in the form of a peltier device to heat or cool the DUT to a desired temperature. A peltier device is a solid-state heat pump that transfers heat from one side of the device to the other depending on the direction of current through the device. In general, to efficiently transfer heat out of or to the DUT, it is helpful to maintain good thermal contact between the peltier device and other components of the thermal test head. In some applications, a larger force is used to press the components of the thermal test head against the DUT to reduce the thermal resistance of the interface and achieve good thermal contact between the components. However, repeated application of greater forces using the thermal test head may reduce the thermal conductivity of the thermal test head. The present disclosure is directed to overcoming at least some of the problems set forth above. The scope of the present disclosure is not limited in its ability to solve any specific problem. Disclosure of Invention In one aspect, a thermal test head for an integrated circuit device is disclosed. An integrated circuit device includes a chip mounted on a substrate. The test head may include a heat exchanger assembly, a chip contact member configured to contact the chip, and a thermal control assembly disposed between the heat exchanger assembly and the chip contact member. The thermal control assembly may include a peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the chip contact member, and a spacer in physical contact with opposing surfaces of the heat exchanger assembly and the chip contact member. In another aspect, a thermal test head for an integrated circuit device is disclosed. An integrated circuit device includes a chip mounted on a substrate. The test head may include a heat exchanger assembly configured to circulate a fluid therethrough, a chip contact member including a contact surface, and a thermal control assembly disposed between the heat exchanger assembly and the chip contact member. The contact surface of the chip contact member may be configured to contact the chip. The thermal control assembly may include a peltier device in thermal contact with opposing surfaces of the heat exchanger assembly and the chip contact member, and one or more spacers disposed at least partially around the peltier device. One or more spacers may be in physical contact with opposing surfaces of the heat exchanger assembly and the chip contact member. The test head may further include a tilt adjustment device coupled to the heat exchanger assembly and disposed opposite the thermal control assembly. The tilt adjustment device may be configured to change the angular alignment of the contact surfaces of the chip contact members when the contact surfaces contact the chip. In another aspect, a thermal test head for an integrated circuit device is disclosed. An integrated circuit device includes a chip mounted on a substrate. The thermal test head may include a heat exchanger assembly configured to circulate a fluid therethrough, and a thermally conductive chip contact member including a contact surface. The contact surface may be configured to contact the chip. The test head may include a thermal control assembly disposed between the first surface of the chip contact member and the second surface of the heat exchanger assembly. The thermal control assembly may include a peltier device, a first layer of thermal interface material disposed between and in physical contact with the peltier device and the first surface of the chip contact member, a second layer of thermal interface material disposed between and in physical contact with the peltier device and the second surface of the heat exchanger assembly, and one or more spacers disposed at least partially around the peltier device and in physical contact with the first surface of th