CN-113666089-B - Holding mechanism

CN113666089BCN 113666089 BCN113666089 BCN 113666089BCN-113666089-B

Abstract

The invention provides a holding mechanism which uses a Bernoulli pad to attract and hold a plate-shaped object without damaging the plate-shaped object. The holding mechanism includes a Bernoulli pad for holding the plate-like object by an action of a negative pressure generated by blowing air to the plate-like object, and includes a hand portion to which the Bernoulli pad is disposed, a sensor disposed in the hand portion for detecting that the plate-like object is sucked and held by the Bernoulli pad, a lateral movement restricting portion disposed in the hand portion for restricting lateral movement of the plate-like object, a pipe for connecting an air source for supplying air to the Bernoulli pad, an adjustment valve disposed in the pipe for adjusting a flow rate of the air supplied to the Bernoulli pad, and a control portion for controlling an operation of the adjustment valve, wherein the control portion gradually increases the flow rate of the air supplied from the adjustment valve to the Bernoulli pad, and when the sensor detects that the plate-like object is sucked and held by the Bernoulli pad by the action of the negative pressure.

Inventors

KAKINUMA YOSHINORI
Right mountain Fang state
SAITO YOSHINOBU
Liu Congxuan

Assignees

株式会社迪思科

Dates

Publication Date: 20260508
Application Date: 20210510
Priority Date: 20200513

Claims (3)

1. A holding mechanism having a Bernoulli pad for holding a plate-like object by an action of a negative pressure generated by blowing air to the plate-like object, characterized in that, The holding mechanism includes: A hand, the Bernoulli pad being disposed on the hand; A sensor disposed on the hand for detecting that the plate-like object is attracted and held by the Bernoulli pad; A lateral movement restriction portion disposed on the hand portion and restricting lateral movement of the plate-like object; a tube connecting an air source that provides air to the bernoulli pad with the bernoulli pad; an adjusting valve disposed in the pipe for adjusting the flow rate of air supplied to the Bernoulli pad, and A control part for controlling the operation of the regulating valve, The control unit gradually increases the flow rate of the air supplied from the regulator valve to the Bernoulli pad, and when the sensor detects that the plate-like object is sucked and held by the Bernoulli pad by the action of the negative pressure, the control unit fixes the flow rate of the air.
2. The holding mechanism according to claim 1, wherein, The sensor is a proximity sensor that is configured to detect, When the sensor detects that the distance between the sensor and the plate-like object is a predetermined length, the control unit determines that the plate-like object is sucked and held by the Bernoulli pad, and fixes the flow rate of the air supplied from the regulator valve to the Bernoulli pad.
3. The holding mechanism according to claim 1, wherein, The sensor is a vibration sensor, When the sensor detects that the amplitude of the vibration of the plate-like object gradually increasing with the increase of the flow rate of the air becomes a predetermined amount, the control unit determines that the plate-like object is sucked and held by the Bernoulli pad, and fixes the flow rate of the air supplied from the regulator valve to the Bernoulli pad.

Description

Holding mechanism Technical Field The present invention relates to a holding mechanism having a bernoulli pad that holds a plate-like object by the action of negative pressure generated by blowing air to the plate-like object. Background Electronic devices such as mobile phones and personal computers are equipped with device chips. The device chip is obtained, for example, by thinning the entire back surface side of a wafer having a plurality of devices such as ICs (INTEGRATED CIRCUIT: integrated circuits) and LSIs (LARGE SCALE Integration) formed on the front surface side by a grinding device, and dividing the thinned wafer by a dicing device or a laser processing device. A plurality of lines to be divided are set in a lattice shape on the front surface of the wafer before division, and the devices are formed in a plurality of regions divided by the lines to be divided, respectively. An annular peripheral remaining region where no device is formed exists around a device region where a plurality of devices are formed in the front side of the wafer. In addition, in manufacturing a device chip, there is a method of forming a recess by thinning the back surface side by grinding the center portion of the back surface side corresponding to the device region without grinding the outer peripheral portion of the back surface side corresponding to the outer peripheral remaining region. In this case, the outer peripheral portion functions as a thick reinforcing portion, and therefore, effects such as reducing warpage of the wafer and improving strength of the wafer can be obtained. However, when the thickness of the wafer at the portion corresponding to the device region is reduced to, for example, about 30 μm, the wafer may be damaged when the suction pad is brought into contact with the device region and transported. Accordingly, a holding mechanism having a bernoulli pad for holding a wafer in a non-contact manner with a device region has been developed (for example, refer to patent document 1). Patent document 1 Japanese patent laid-open publication No. 2005-142462 The bernoulli pad attracts and holds the wafer by negative pressure generated by blowing air to the wafer. The higher the pressure of the supplied air, the higher the negative pressure can be generated, but the higher the pressure of the air, the higher the impact force of the air blown to the wafer on the wafer is, and the wafer is vibrated and broken. In addition, the problem of breakage due to vibration of the wafer may occur in a normal wafer in which a recess is not formed on the back surface side. Disclosure of Invention The present invention has been made in view of the above-described problems, and an object of the present invention is to, when holding a plate-like object such as a wafer using a bernoulli pad, hold the plate-like object by suction without damaging the plate-like object. According to one embodiment of the present invention, there is provided a holding mechanism including a Bernoulli pad for holding a plate-like object by an action of a negative pressure generated by blowing air to the plate-like object, the holding mechanism including a hand portion to which the Bernoulli pad is disposed, a sensor disposed to the hand portion for detecting that the plate-like object is held by suction by the Bernoulli pad, a lateral movement restricting portion disposed to the hand portion for restricting lateral movement of the plate-like object, a pipe for connecting an air source for supplying air to the Bernoulli pad, an adjustment valve disposed to the pipe for adjusting a flow rate of air supplied to the Bernoulli pad, and a control portion for controlling an operation of the adjustment valve, the control portion gradually increasing a flow rate of air supplied from the adjustment valve to the Bernoulli pad, and fixing the flow rate of air when the sensor detects that the plate-like object is held by suction by the Bernoulli pad by the action of the negative pressure. Preferably, the sensor is a proximity sensor, and the control unit determines that the plate-like object is sucked and held by the bernoulli pad and fixes the flow rate of the air supplied from the adjustment valve to the bernoulli pad when the sensor detects that the distance between the sensor and the plate-like object is a predetermined length. Preferably, the sensor is a vibration sensor, and when the sensor detects that the amplitude of the vibration of the plate-like object gradually increasing with an increase in the flow rate of air becomes a predetermined amount, the control unit determines that the plate-like object is sucked and held by the bernoulli pad, and fixes the flow rate of air supplied from the adjustment valve to the bernoulli pad. In the holding mechanism according to one aspect of the present invention, the control unit gradually increases the flow rate of the air supplied from the adjustment valve to the bernoulli pad, and fixes the flow rate of the ai