CN-113801583-B - Adhesive sheet

Abstract

The adhesive sheet comprises a resin composition having a thermosetting resin, wherein the sheet of the resin composition having a thickness of 20 [ mu ] m after thermosetting has a parallel light transmittance of 80% or more at a wavelength of 350 nm.

Inventors

• OONISHI KENJI
• KIMURA TAKEHIRO
• SHISHIDO YUICHIRO
• TAKAMOTO NAOHIDE

Assignees

• 日东电工株式会社

Dates

Publication Date

20260508

Application Date

20210609

Priority Date

20200615

Claims (5)

1. 1. An adhesive sheet comprising a resin composition, The resin composition has a thermosetting resin and an inorganic filler, The thermosetting resin contains an acrylic resin having an epoxy group, The content of the inorganic filler is 15-50 mass%, The D50 of the inorganic filler is 5-30 nm, The sheet of the resin composition after heat curing has a parallel light transmittance of 80% or more at a wavelength of 350nm, and the adhesive sheet has a tensile storage modulus of 10 to 3,000MPa at 25 ℃ before heat curing.
2. 2. The adhesive sheet according to claim 1, which has a shear storage modulus of 5kpa to 800kpa at 100 ℃ before heat curing.
3. 3. The adhesive sheet according to claim 1, wherein the adhesive force of the resin composition after heat curing to a Si wafer at 120 ℃ is 0.5MPa or more.
4. 4. The adhesive sheet according to claim 1, wherein the tensile loss modulus at 120 ℃ after heat curing is 0.1mpa to 5mpa.
5. 5. The adhesive sheet according to claim 1, wherein the tensile storage modulus at 250 ℃ after heat curing is 0.5 to 150mpa.

Description

Adhesive sheet Technical Field The present invention relates to an adhesive sheet. Background An adhesive sheet containing an epoxy resin and an acrylic resin is used for the adhesion of glass members to each other or the like (for example, patent document 1). Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2015-140408 Disclosure of Invention Problems to be solved by the invention However, when the glass member in the ultraviolet sensor is bonded to another member, an adhesive sheet is used, but the adhesive sheet affects the sensitivity of the ultraviolet sensor depending on the location where the adhesive sheet is used. Therefore, an adhesive sheet excellent in ultraviolet ray transmittance is demanded. Accordingly, an object of the present invention is to provide an adhesive sheet excellent in ultraviolet ray transmittance after heat curing. Solution for solving the problem The adhesive sheet of the present invention is an adhesive sheet comprising a resin composition, The aforementioned resin composition has a thermosetting resin, The sheet of the resin composition after heat curing has a parallel light transmittance of 80% or more at a wavelength of 350 nm. Detailed Description An embodiment of the adhesive sheet of the present invention will be described below. The adhesive sheet of the present embodiment is composed of a resin composition. The resin composition includes an organic component including a thermosetting resin. The adhesive sheet of the present embodiment may further include an inorganic component including an inorganic filler. The adhesive sheet of the present embodiment has a single-layer structure composed of a resin composition. The organic component has a thermosetting resin. In addition, the organic component may contain an antioxidant. The organic component may further contain a silane coupling agent. In the adhesive sheet of the present embodiment, it is important that the sheet of the resin composition having a thickness of 20 μm after heat curing has a parallel light transmittance of 80% or more, preferably 82% or more, more preferably 85% or more, and even more preferably 90% or more, under light having a wavelength of 350 nm. The upper limit value of the parallel ray transmittance was 100%. The parallel light transmittance can be calculated by measuring the total light transmittance and the diffuse transmittance by the following equation. Parallel light transmittance (%) =total light transmittance (%) -diffuse transmittance (%) The total light transmittance and the diffuse transmittance were measured on a specimen having a thickness of 20 μm, which is a sheet of the resin composition after curing, based on JIS K7105 (old; now obsolete) (ISO 13468-2:1999), and can be measured as follows. That is, a device is prepared in which an entrance opening and an exit opening for passing light are provided in an integrating sphere, a sample is provided in the entrance opening, and a reflecting plate is attached to the exit opening, whereby all light incident on the sample in the thickness direction of the sample and emitted from the sample can be detected by the integrating sphere. Then, the reflection plate at the outlet opening is removed, and light other than the light advancing direction is detected from all the light rays which are incident on the sample in the thickness direction of the sample and are emitted from the sample. Next, the ratio (detected light intensity/incident light intensity) of the detected light intensity to the intensity of the light incident on the sample (incident light intensity) was obtained. The ratio (detected light intensity/incident light intensity) was used as the diffuse transmittance. The reflection plate at the outlet opening is not removed, and all light incident on the sample in the thickness direction of the sample and emitted from the sample is detected. Next, the ratio (detected light intensity/incident light intensity) of the detected light intensity to the intensity of the light incident on the sample (incident light intensity) was obtained. The ratio (detected light intensity/incident light intensity) was taken as the total light transmittance. For example, the total light transmittance and the diffuse transmittance can be measured by V-670DS (manufactured by JASCO Co.). The thermosetting resin preferably contains an acrylic resin having an epoxy group. The organic component preferably contains 90 to 100% by mass, more preferably 95 to 100% by mass of the acrylic resin. In the adhesive sheet of the present embodiment, the organic component is contained in an amount of 90 mass% or more of the acrylic resin, so that the adhesive sheet is excellent in ultraviolet ray transmittance after heat curing. In addition, since the acrylic resin of the present embodiment has an epoxy group, the acrylic resins can undergo a curing reaction with the epoxy group by heating, and as a result, the adhesive sheet