CN-114008524-B - Holes for flat optical devices

Abstract

Various embodiments described herein relate to methods for manufacturing optical devices. The methods described herein enable one or more optical devices to be fabricated on a substrate having an aperture surrounding each optical device, the optical devices having a plurality of structures. One embodiment of the method described herein includes disposing a layer of hole material on a surface of a substrate, disposing a layer of structural material over the holes and the surface of the substrate, disposing a hardmask over the holes and the layer of structural material, disposing a patterned photoresist over the hardmask, the patterned photoresist defining exposed hardmask portions, removing the exposed hardmask portions to expose structural portions of the layer of structural material, and removing the structural portions to form a plurality of structures between the holes over a region of the surface of the substrate.

Inventors

• Saijie tok Garrett dosha
• Roger Meyer Timmerman dijason
• Ludovic Goddy
• CHEN JIANAN
• Pinkersh Rochet Shah

Assignees

• 应用材料公司

Dates

Publication Date

20260512

Application Date

20200518

Priority Date

20190605

Claims (19)

1. 1. A method of manufacturing a planar optical device, comprising the steps of: providing a hole material layer on the surface of the transparent substrate; Patterning the hole material layer to form holes over a region of the surface of the transparent substrate corresponding to one of: A first space defined by adjacent optical devices, and A second space defined by one of the adjacent optical devices and an outer periphery of the transparent substrate; Disposing a layer of structural material over the aperture and the surface of the transparent substrate; Disposing a hard mold over the hole and the layer of structural material; Disposing a patterned photoresist over the hardmask, the patterned photoresist defining exposed hardmask portions; Removing the exposed hard mold portion to expose a structural portion of the structural material layer, and The structural portions are removed to form a plurality of structures of a metasurface of the planar optical device between the apertures over a region of the surface of the transparent substrate, wherein the apertures are opaque.
2. 2. The method of claim 1, wherein the patterned photoresist and the hardmask are removed after the plurality of structures are formed.
3. 3. The method of claim 2, wherein removing the patterned photoresist comprises at least one of a photolithographic process or an etching process.
4. 4. The method of claim 1, wherein the porous material layer comprises one or more of chromium (Cr), titanium nitride (TiN), amorphous silicon (a-Si), titanium (Ti), and aluminum (Al) containing materials.
5. 5. The method of claim 1, wherein the material of the aperture prevents light having a wavelength in the range of 100 nanometers to 3000 nanometers from transmitting through the aperture.
6. 6. The method of claim 1, wherein the hard mold comprises one or more of a chromium (Cr), silver (Ag), silicon nitride (Si 3 N 4 ), silicon oxide (SiO 2 ), tiN, and carbon (C) containing material.
7. 7. The method of claim 1, wherein the disposing the hard mold comprises one or more of a liquid material mold casting process, a spin coating process, a liquid spray coating process, a dry powder coating process, a screen printing process, a doctor blade coating process, a PVD process, a CVD process, a PECVD process, a FCVD process, and an ALD process.
8. 8. The method of claim 1, wherein the hardmask has a greater etch selectivity than the structural material layer.
9. 9. The method of claim 1, wherein each structure of the plurality of structures is a nanostructure having a size less than 1000 nanometers (nm).
10. 10. A method of manufacturing a planar optical device, comprising the steps of: disposing a layer of structural material on a surface of a transparent substrate; providing a layer of hole material over the layer of structural material; Patterning the hole material layer to form holes over a region of the surface of the transparent substrate corresponding to one of: A first space defined by adjacent optical devices, and A second space defined by one of the adjacent optical devices and an outer periphery of the transparent substrate; Providing an Organic Planarizing Layer (OPL) over the holes and the layer of structural material; disposing a patterned photoresist over the OPL, the patterned photoresist defining exposed OPL portions; removing the exposed OPL portion to expose a structural portion of the structural material layer, and The structural portions are removed to form a plurality of structures of a metasurface of the planar optical device between the apertures over a region of the surface of the transparent substrate, wherein the apertures are opaque.
11. 11. The method of claim 10, wherein a hard die is disposed between the layer of structural material and the layer of pore material.
12. 12. The method of claim 11, wherein the structural material layer is an amorphous silicon (a-Si) containing layer, the hardmask is a silicon nitride (Si 3 N 4 ) containing layer, and the pore material layer is a chromium (Cr) containing layer.
13. 13. The method of claim 12, wherein the a-Si-containing layer has a first thickness of 450 nanometers (nm) to 650 nm a, the Si 3 N 4 -containing layer has a second thickness of 10 nm to 200 nm a, and the Cr-containing layer has a third thickness of 10 nm to 200 nm a.
14. 14. The method of claim 10, wherein the patterned photoresist and the OPL are removed after forming the plurality of structures.
15. 15. A method of manufacturing a planar optical device, comprising the steps of: Providing a layer of structural material on a surface of a transparent substrate, the layer of structural material being disposed between regions of the surface of the transparent substrate corresponding to one of: A first space defined by adjacent optical devices, and A second space defined by one of the adjacent optical devices and an outer periphery of the transparent substrate; Providing a hard mould above the layer of structural material; Disposing a patterned photoresist over the hardmask, the patterned photoresist defining exposed hardmask portions; removing the exposed hard mask portion to expose a structural portion of the structural material layer; removing the structural portions to form a plurality of structures of the metasurface of the planar optical device between the regions of the surface of the transparent substrate, and Forming an aperture over the region, wherein the aperture is opaque.
16. 16. The method of claim 15, wherein said forming said hole over said region comprises: disposing an encapsulation layer over the plurality of structures and the region; providing a layer of hole material over the encapsulation layer; providing a patterned etch layer over the regions to expose portions of the layer of hole material over the plurality of structures; removing the portion of the layer of pore material over the plurality of structures, and And removing the patterned etching layer.
17. 17. The method of claim 16, wherein the encapsulation layer comprises one or more of a silicon nitride (Si 3 N 4 ), silicon oxide (SiO 2 ), a fluoropolymer, a hydrogel, and a photoresist-containing material.
18. 18. The method of claim 15, wherein said forming said aperture over said region comprises masking said plurality of structures to expose said region.
19. 19. The method of claim 15, wherein said forming said hole over said region comprises: disposing a gap filling material over the plurality of structures between the regions; providing a layer of hole material over the gap filling material and the region; Removing the layer of hole material over the gap filling material, and And removing the gap filling material.

Description

Holes for flat optical devices Background FIELD Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein provide for the fabrication of one or more optical devices having an aperture (aperture) surrounding each optical device. Background The optical system may be used to manipulate the propagation of light through spatially varying structural parameters (e.g., shape, size, orientation) of the structure. One example of an optical device is a planar optical device. Flat optical devices in the visible and near infrared spectrum may require transparent substrates with structures such as nanostructures disposed on the substrate. However, as an emerging technology, processing transparent substrates to form optical devices is both complex and challenging. For example, a beam incident on one of the one or more optical devices of the optical system may be larger in diameter than the desired optical device or not perfectly aligned with the desired optical device. Stray light larger in diameter than the incident beam of the optical device may reduce the function and efficiency of the optical system and may optically interact with the substrate and unwanted adjacent optical devices. Accordingly, there is a need in the art for a method that can fabricate one or more optical devices on a substrate having an aperture surrounding each optical device. Disclosure of Invention In one embodiment, a method is provided. The method includes providing a layer of hole material on a surface of a substrate, patterning the layer of hole material to form holes over regions of the surface of the substrate corresponding to one of a first space defined by adjacent ones of the optical devices and a second space defined by one of the optical devices and an outer periphery of the substrate, providing a layer of structural material over the holes and the surface of the substrate, providing a hardmask over the holes and the layer of structural material, providing a patterned photoresist over the hardmask, the patterned photoresist defining exposed hardmask portions, removing the exposed hardmask portions to expose structural portions of the layer of structural material, and removing the structural portions to form a plurality of structures between the holes over regions of the surface of the substrate. In another embodiment, a method is provided. The method includes disposing a layer of structural material on a surface of a substrate, disposing a layer of hole material over the layer of structural material, patterning the layer of hole material to form a hole over a region of the surface of the substrate corresponding to one of a first space defined by adjacent ones of the optical devices and a second space defined by one of the adjacent optical devices and an outer periphery of the substrate, disposing an Organic Planarizing Layer (OPL) over the hole and the layer of structural material, disposing a patterned photoresist over the OPL, the patterned photoresist defining exposed OPL portions, removing the exposed OPL portions to expose structural portions of the layer of structural material, and removing the structural portions to form a plurality of structures between the hole over the region of the surface of the substrate. In yet another embodiment, a method is provided. The method includes disposing a layer of structural material on a surface of a substrate, the layer of structural material disposed between regions of the surface of the substrate corresponding to one of a first space defined by adjacent ones of the optical devices and a second space defined by one of the optical devices and an outer periphery of the substrate, disposing a hardmask over the layer of structural material, disposing a patterned photoresist over the hardmask, the patterned photoresist defining exposed hardmask portions, removing the exposed hardmask portions to expose structural portions of the layer of structural material, removing the structural portions to form a plurality of structures between the regions of the surface of the substrate, and forming apertures over the regions. Drawings So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this disclosure and are therefore not to be considered limiting of its scope, for the disclosure may admit to other equally effective embodiments. FIG. 1A is a top view of a substrate having one or more optical devices formed thereon, according to one embodiment. Fig. 1B is a cross-sectional view of one of the optical devices according to one embodiment. FIG. 2 is a flowchart illustrating the operation of a method for manufacturing an optical d