CN-114097311-B - Cooling system for electronic modules

CN114097311BCN 114097311 BCN114097311 BCN 114097311BCN-114097311-B

Abstract

Systems and methods for cooling a plurality of electronic devices housed in a housing of an electronic module. The system includes a first cooling circulation arrangement configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system also includes a second cooling circulation arrangement configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant. The first cooling circulation arrangement and the second cooling circulation arrangement are thermally coupled at least via the heat exchanger such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger.

Inventors

Neil Edmonds
Jason Mattson
Natan Longhurst
DAVID AMOS

Assignees

爱思欧托普集团有限公司
爱思欧托普集团有限公司

Dates

Publication Date: 20260421
Application Date: 20200521
Priority Date: 20190521

Claims (20)

1. A system for cooling a plurality of electronic devices housed in a housing of an electronic module, the system comprising: A first cooling circulation arrangement configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, a housing of the electronic module containing the first liquid coolant, the first electronic device being in contact with the first liquid coolant such that heat is transferred from a surface of the first electronic device in contact with the first liquid coolant to the first liquid coolant, and A second cooling circulation arrangement configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant; Wherein the first cooling circulation arrangement and the second cooling circulation arrangement are thermally coupled at least via the heat exchanger such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger, and Wherein the heat exchanger comprises at least a first and a second chamber separated by a thermal interface, wherein the heat exchanger is configured to flow the first liquid coolant through at least the first chamber such that heat is transferred from the first liquid coolant to the second liquid coolant through the thermal interface.
2. The system of claim 1, wherein the second cooling circulation arrangement further comprises a cooling system, wherein the second cooling circulation arrangement is configured to circulate the second liquid coolant between the second electronic devices of the plurality of electronic devices, the heat exchanger, and the cooling system, wherein heat is removed from the second liquid coolant by the cooling system.
3. The system of claim 1, wherein the second cooling circulation arrangement is connected to a second liquid coolant source, wherein the second cooling circulation arrangement is configured to circulate the second liquid coolant received from the second liquid coolant source between the second electronic device of the plurality of electronic devices and the heat exchanger and returned to the second liquid coolant source.
4. A system according to any one of claims 1 to 3, wherein the heat exchanger is arranged within a housing of the electronic module.
5. A system according to any one of claims 1 to 3, wherein the first electronic device is at least partially immersed in the first liquid coolant.
6. The system of claim 5, wherein the first cooling cycle arrangement further comprises a weir comprising: A base and a retaining wall extending from the base, the base and the retaining wall defining a volume for retaining some of the first liquid coolant; An inlet through which the first liquid coolant flows into the volume; wherein sufficient flow of the first liquid coolant into the volume through the inlet causes the first liquid coolant to overflow the barrier wall to contact a surface of the first electronic device such that heat is transferred to the first liquid coolant such that the overflowed first liquid coolant is collected with the first liquid coolant contained in the housing of the electronic module and outside the weir for recirculation within the first cooling circulation arrangement.
7. The system of claim 6, wherein the inlet further comprises a nozzle arrangement for directing the flow of the first liquid coolant into the volume.
8. The system of claim 6, wherein the weir further comprises a protrusion extending from the base and/or the retaining wall within the volume of the weir.
9. The system of claim 6, wherein the weir is coupled to a surface of the first electronic device to act as a heat sink.
10. The system of claim 6, wherein the first cooling cycle arrangement further comprises: a pump configured to circulate the first liquid coolant within the first cooling circulation arrangement.
11. The system of claim 10, wherein the first cooling cycle arrangement further comprises a pump inlet arranged to receive the first liquid coolant contained in a housing of the electronic module and outside the weir.
12. The system of claim 10, wherein the first cooling cycle arrangement further comprises: at least a first conduit and a second conduit are arranged to convey the first liquid coolant from the pump to the heat exchanger and from the heat exchanger to an inlet of the weir, respectively.
13. The system of claim 2, the second cooling circulation arrangement further comprising a cooling module configured to thermally couple the second electronic device to the second liquid coolant.
14. The system of claim 13, wherein the cooling module comprises a cold plate comprising: A cold plate housing, a surface of the cold plate housing arranged to provide a thermal interface for cooling the second electronic device, the second electronic device being thermally coupled to the surface of the cold plate housing, and At least one channel within the cold plate housing and proximate to a surface of the cold plate housing, the at least one channel arranged to flow the second liquid coolant through the at least one channel such that heat received from the second electronic device through the surface of the cold plate housing is transferred to the second liquid coolant.
15. The system of claim 14, the second cooling cycle arrangement further comprising a plurality of conduits arranged to convey the second liquid coolant between the cold plate, the heat exchanger, and the cooling system.
16. A method for cooling a plurality of electronic devices housed in a housing of an electronic module, the method comprising: Circulating a first liquid coolant within a first cooling circulation arrangement, including circulating a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, a housing of the electronic module containing the first liquid coolant, the first electronic device being in contact with the first liquid coolant such that heat is transferred to the first liquid coolant from a surface of the first electronic device in contact with the first liquid coolant, and Circulating a second liquid coolant within a second cooling circulation arrangement, including circulating a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant; Wherein the first cooling circulation arrangement and the second cooling circulation arrangement are thermally coupled at least via the heat exchanger such that heat is transferred from the first liquid coolant to the second liquid coolant via the heat exchanger, and Wherein the heat exchanger comprises at least a first and a second chamber separated by a thermal interface, wherein the heat exchanger is configured to flow the first liquid coolant through at least the first chamber such that heat is transferred from the first liquid coolant to the second liquid coolant through the thermal interface.
17. The method of claim 16, wherein the second cooling circulation arrangement further comprises a cooling system, wherein circulating the second liquid coolant within the second cooling circulation arrangement comprises circulating the second liquid coolant between the second electronic devices of the plurality of electronic devices, the heat exchanger, and the cooling system, wherein heat is removed from the second liquid coolant by the cooling system.
18. The method of claim 16, wherein the second cooling circulation arrangement further comprises a second liquid coolant source, wherein circulating the second liquid coolant within the second cooling circulation arrangement comprises receiving the second liquid coolant from the second liquid coolant source, circulating the second liquid coolant between the second electronic devices of the plurality of electronic devices and the heat exchanger, and returning to the second liquid coolant source.
19. The method of any one of claims 16 to 18, wherein the heat exchanger is configured to flow the second liquid coolant through at least the second chamber.
20. The method of any of claims 16 to 18, wherein the heat exchanger is disposed within a housing of the electronic module.

Description

Cooling system for electronic modules Technical Field The present disclosure relates to a system for cooling a plurality of electronic devices housed in an electronic module. The system comprises a first cooling circulation arrangement arranged to cool a first electronic device within the electronic module and a second cooling circulation arrangement arranged to cool a second electronic device within the electronic module. The coolant circulating in the first cooling circulation arrangement is cooled by transferring heat via the heat exchanger to the coolant circulating in the second cooling circulation arrangement. Methods for cooling a plurality of electronic devices housed in an electronic module are also described. The present disclosure also relates to a system for cooling an electronic module configured for mounting into a rack. The present disclosure also contemplates a method of installation of a liquid cooling system for an electronic module, and a kit for the installation method. Background Within a computer, server, or other device for data processing (known as IT or information technology), there are many electronic devices known as integrated circuits (INTEGRATED CIRCUIT, ICs). The electronics within the integrated Circuit may include a central processing unit (central processing unit, CPU), application SPECIFIC INTEGRATED Circuit (ASIC), graphics processing unit (GRAPHICAL PROCESSING UNIT, GPU), random access memory (Random Access Memory, RAM), and the like. Each of these devices generates heat when in use. In order to maintain the device at an optimal temperature for proper operation, it is important to transfer heat away from the device. As the processing power of IT increases and thus the number of computers, servers, or other electronic devices within IT increases, the challenge of removing enough heat generated by the electronic devices increases. Electronic devices, which are typically mounted on printed circuit boards (printed circuit board, PCBs), are typically housed or encapsulated within a housing or chassis to form an electronic module. For example, computer servers typically include a plurality of electronic modules that are mounted in racks and connected together to provide the required IT facilities. Methods for removing heat from each enclosure or chassis are needed to maintain the electronics within the chassis at the proper temperature. The electronic modules are typically cooled by passing air through or through each housing or chassis. The flow of air may be sufficient to remove some heat from the interior of the enclosure to the surrounding environment. Until recently, this cooling method was almost exclusively used for mass-produced IT and server devices. However, it has been found that as technology sizes for the same performance decrease, heat generated by electronic devices increases even when the occupied area decreases. Also, peak performance of IT systems is limited due to limitations in cooling electronic modules using air-cooled systems. Accordingly, more complex systems and methods for cooling electronic modules have been proposed. In some cases, liquid cooling has been used, wherein a liquid coolant flows through or near a heat sink coupled to the electronic device. Heat may then be transferred from the electronic device to a region or element where the heat may be removed from the liquid coolant. In some cases, liquid cooling may more effectively remove heat from electronic devices or components and thus provide more cooling power than air cooling systems. However, prior art liquid cooling systems typically require custom systems that are complex and expensive to install. It is therefore an object of the present invention to provide a system for cooling an electronic module, and a method of cooling such a system, which overcomes these drawbacks of the prior art systems. Disclosure of Invention In this context, a system and method for cooling a plurality of electronic devices housed in a housing of an electronic module is provided. In particular, the system comprises a first cooling circulation arrangement and a second cooling circulation arrangement, or a first cooling circuit and a second cooling circuit, each circulating a respective first liquid coolant and second liquid coolant. Each cooling circulation system is used for cooling electronic equipment in a plurality of equipment in the electronic module. However, the second cooling circulation arrangement is also configured to cool the coolant circulating in the first cooling circulation system by exchanging heat between the first liquid coolant and the second liquid coolant via the heat exchanger. The first cooling circulation arrangement and the second cooling circulation arrangement may have different efficiencies, and thus the more efficient cooling provided by the second cooling circulation arrangement may be used to cool the first liquid coolant. Furthermore, a more efficient second cooling cycle arran