CN-114114841-B - Photosensitive resin laminate and method for forming resist pattern

Abstract

A photosensitive resin laminate and a method for forming a resist pattern. The object is to provide a photosensitive resin laminate excellent in at least one of minimum development time, resolution, undercut (SE) amount, contrast and exudation. A photosensitive resin laminate comprising a support and a photosensitive resin composition layer formed on the support using a photosensitive resin composition, wherein the photosensitive resin composition comprises (A) an alkali-soluble resin, (B) a photopolymerizable compound having an ethylenically unsaturated bond, (C) a photopolymerization initiator, (D) a compound having an increased absorbance at a wavelength of 550 to 700nm, and (E) an organic developer, and the photosensitive resin composition layer has a film thickness of more than 0 and 10 [ mu ] m or less.

Inventors

• Sakurai Taka

Assignees

• 旭化成株式会社

Dates

Publication Date

20260512

Application Date

20210831

Priority Date

20200831

Claims (20)

1. 1. A photosensitive resin laminate is characterized by comprising: A support body, and A photosensitive resin composition layer formed on the support using the photosensitive resin composition, The photosensitive resin composition comprises the following components: (A) Alkali-soluble resin, (B) A photopolymerizable compound having an ethylenically unsaturated bond, (C) A photopolymerization initiator, (D) Compounds with increased absorbance at light wavelengths of 550-700 nm, and (E) An organic color-developing agent is used for developing the color-developing agent, The film thickness of the photosensitive resin composition layer exceeds 0 and is less than 10 mu m, The organic color-developing agent (E) is a photoacid generator capable of generating an acid by light irradiation, and is at least one compound selected from the group consisting of oxime sulfonate compounds and triarylsulfonium salts.
2. 2. A photosensitive resin laminate is characterized by comprising: A support body, and A photosensitive resin composition layer formed on the support using the photosensitive resin composition, The photosensitive resin composition comprises the following components: (A) Alkali-soluble resin, (B) A photopolymerizable compound having an ethylenically unsaturated bond, (C) A photopolymerization initiator, (D) Compounds with increased absorbance at light wavelengths of 550-700 nm, and (E) An organic color-developing agent is used for developing the color-developing agent, The product of the film thickness of the photosensitive resin composition layer formed on the support and the content of the component (E) relative to the total amount of the photosensitive resin composition exceeds 0 and is 5.0 or less, the film thickness is in [ mu ] m, the content is in mass%, The organic color-developing agent (E) is a photoacid generator capable of generating an acid by light irradiation, and is at least one compound selected from the group consisting of oxime sulfonate compounds and triarylsulfonium salts.
3. 3. The photosensitive resin laminate according to claim 1 or 2, wherein an absorbance of the acetonitrile solution of 0.01mg/ml of the component (E) at 330nm or 405nm is 0.1 or more and less than 1.0.
4. 4. The photosensitive resin laminate according to claim 1 or 2, wherein the (E) organic color-developing agent is selected from oxime sulfonate compounds.
5. 5. The photosensitive resin laminate according to claim 1 or 2, wherein the component (C) contains a base dimer of a roursoid.
6. 6. The photosensitive resin laminate according to claim 5, wherein the base dimer of roux is a 2- (o-chlorophenyl) -4, 5-diphenylimidazole dimer.
7. 7. The photosensitive resin laminate according to claim 1 or 2, wherein the component (D) comprises a compound having a triarylmethane skeleton.
8. 8. The photosensitive resin laminate according to claim 7, wherein the compound having a triarylmethane skeleton is malachite green or basic violet 3.
9. 9. The photosensitive resin laminate according to claim 1 or 2, wherein the weight average molecular weight of the component (a) is 5000 or more and less than 55000.
10. 10. The photosensitive resin laminate according to claim 1 or 2, wherein the weight average molecular weight of the component (a) is 23000 to 50000.
11. 11. The photosensitive resin laminate according to claim 1 or 2, wherein the acid value of the component (a) exceeds 0mgKOH/g and is 200mgKOH/g or less.
12. 12. The photosensitive resin laminate according to claim 1 or 2, wherein the content of the (a) component is 10 mass% to 90 mass% relative to the total amount of the photosensitive resin composition.
13. 13. The photosensitive resin laminate according to claim 1 or 2, wherein the content of the component (B) is 5 mass% to 70 mass% relative to the total amount of the photosensitive resin composition.
14. 14. The photosensitive resin laminate according to claim 1 or 2, wherein the content of the component (B) is 30 mass% to 50 mass% relative to the total amount of the photosensitive resin composition.
15. 15. The photosensitive resin laminate according to claim 1 or 2, wherein the content of the (C) component is 0.01 mass% to 20 mass% relative to the total amount of the photosensitive resin composition.
16. 16. The photosensitive resin laminate according to claim 1 or 2, wherein the content of the (D) component is 0.001 mass% to 3 mass% relative to the total amount of the photosensitive resin composition.
17. 17. The photosensitive resin laminate according to claim 1 or 2, wherein the content of the (E) component exceeds 0 and 3.5 mass% or less relative to the total amount of the photosensitive resin composition.
18. 18. The photosensitive resin laminate according to claim 1 or 2, wherein the content of the (E) component is 0.5 mass% to 0.9 mass% relative to the total amount of the photosensitive resin composition.
19. 19. The photosensitive resin laminate according to claim 1 or 2, wherein the content of the (E) component exceeds 0 and is 2.5 mass% or less relative to the total amount of the (a) component.
20. 20. The photosensitive resin laminate according to claim 1 or 2, wherein the (a) component comprises an aromatic monomer component.

Description

Photosensitive resin laminate and method for forming resist pattern Technical Field The present invention relates to a photosensitive resin laminate and a method for forming a resist pattern. Background Conventionally, manufacturing of printed circuit boards, precision machining of metals, and the like have been performed by photolithography. Photosensitive resin compositions used in photolithography are classified into negative type compositions for dissolving and removing unexposed portions and positive type compositions for dissolving and removing exposed portions. In the photolithography, when the photosensitive resin composition is coated on a substrate, any of the following methods may be used: (1) A method of applying a photoresist solution to a substrate and drying it, and (2) A method of laminating a photosensitive resin layer on a substrate using a photosensitive resin laminate in which a support, a layer containing a photosensitive resin composition (hereinafter also referred to as a "photosensitive resin layer"), and, if necessary, a protective layer are laminated in this order. In the manufacture of printed circuit boards, the latter method is mostly used. Hereinafter, a method of forming a pattern using the photosensitive resin laminate will be described in brief. First, the protective layer is peeled from the photosensitive resin laminate. Next, a laminator is used to laminate the photosensitive resin layer and the support on the substrate such as the copper-clad laminate and the copper-sputtered film in this order. Then, the photosensitive resin layer is exposed to light through a photomask having a desired wiring pattern. Then, the support is peeled from the laminate after exposure, and the non-pattern portion is dissolved or dispersed by a developer, thereby forming a resist pattern on the substrate. Further, the wiring pattern can be obtained by subjecting the substrate provided with the resist pattern to etching treatment, plating treatment such as copper plating and tin plating. Various photosensitive resin compositions have been studied for forming resist patterns and wiring patterns. For example, patent document 1 discloses a photosensitive film including a photosensitive resin layer containing a binder polymer, a photopolymerizable compound, a leuco dye, and a compound that generates an acid by light or heat. The photosensitive film can be sufficiently cured in a desired shape by exposing the photosensitive resin layer before development, and thereafter, a colored pattern having a desired optical density can be formed by irradiating light and/or applying heat. Patent document 2 describes a photosensitive resin composition using a radical polymerizable polymer containing a structural unit formed of an unsaturated double bond-containing compound having a bond that can be decomposed by the action of an acid and/or heat at 130 to 250 ℃. The photosensitive resin composition is subjected to photo-curing and development, and then the bond is cleaved by an acid and/or heat of 130-250 ℃ before or simultaneously with the stripping, thereby generating phenolic hydroxyl groups and/or carboxylic acids, and improving the stripping property of the photosensitive resin composition to an alkaline stripping solution. However, in recent years, demand for touch panel type displays has increased due to popularization of smartphones (registered trademark) and the like. In the production of wiring portions in the sensor of the touch panel, a photosensitive resin laminate is often used. In the case of a touch panel sensor, various characteristics such as high definition and high density are often required for wiring produced through an etching process. Prior art literature Patent literature Patent document 1 International publication No. 2020/031379 Patent document 2 Japanese patent application laid-open No. 2009-3000 Disclosure of Invention Problems to be solved by the invention However, sufficient characteristics have not been obtained for minimum development time, resolution, amount of undercut (SE), contrast, and exudation. Further, there are combinations of these characteristics that are considered to be difficult to achieve, and thus it is desirable to achieve the combination of various characteristics. The present invention has been made in view of such conventional circumstances, and an object of the present invention is to provide a photosensitive resin laminate and a method for forming a resist pattern, which are excellent in at least one of minimum development time, resolution, undercut (SE) amount, contrast and exudation. Solution for solving the problem [1] A photosensitive resin laminate is characterized by comprising: A support body, and A photosensitive resin composition layer formed on the support using the photosensitive resin composition, The photosensitive resin composition comprises the following components: (A) Alkali-soluble resin, (B) A photopolymerizable compound having an ethylenic