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CN-114208409-B - Size limited device faraday cage

CN114208409BCN 114208409 BCN114208409 BCN 114208409BCN-114208409-B

Abstract

The present description relates to devices, such as computing devices that may include shielded circuit board assemblies that are limited in size. One example may include a circuit board that includes an upwardly extending rail. The example may also include a heat generating component positioned within the enclosure and a thermal module defining a major planar surface positioned over the heat generating component. The thermal module may include a downwardly extending frame overlapping the rail. The gasket may be compressed between the rail and the frame in a direction parallel to the major planar surface.

Inventors

  • PLEAKE TODD DAVID
  • J Tepusima
  • K shah
  • D.C. Van der Woolt
  • K. W. Katz

Assignees

  • 微软技术许可有限责任公司

Dates

Publication Date
20260505
Application Date
20200619
Priority Date
20190809

Claims (20)

  1. 1. An apparatus, comprising: a circuit board extending along a first horizontal plane, the circuit board including a rail extending upwardly from the first horizontal plane defining a first perimeter; a heat generating component positioned within the first perimeter; A thermal module positioned above the heat generating component, the thermal module including a frame defining a second perimeter different from the first perimeter and extending downward to the first horizontal plane such that the frame overlaps the rail and a space exists between the overlapped frame and rail, and A gasket that does not belong to the rail or the frame, the gasket extending parallel to a second horizontal plane between the rail and the frame and being compressed between the rail and the frame to create a bias parallel to the second horizontal plane and forcing the gasket against the rail and the frame to fill the space, thereby blocking radio frequency energy between the rail and the frame to complete a faraday cage around the heat generating assembly.
  2. 2. The apparatus of claim 1, wherein the circuit board further comprises a conductive structure positioned below the first perimeter and electrically coupled to the rail.
  3. 3. The device of claim 2, wherein the conductive structure is integrated into the circuit board, or wherein the conductive structure is external to the circuit board.
  4. 4. The apparatus of claim 2, wherein the conductive structure, the rail, the frame, the gasket, and the thermal module form the faraday cage around the heat generating component.
  5. 5. The apparatus of claim 1, wherein the heat generating component comprises a processor and/or a memory.
  6. 6. The apparatus of claim 1, wherein the thermal module comprises a vapor chamber, a heat pipe, a heat spreader, or a heat sink.
  7. 7. The apparatus of claim 1, wherein the thermal module comprises a planar surface, and wherein the bias is parallel to the planar surface.
  8. 8. The apparatus of claim 7, wherein the gasket extends between the rail and the thermic module, or wherein the gasket does not extend between the rail and the thermic module.
  9. 9. The apparatus of claim 1, wherein the gasket is at least partially made of metal.
  10. 10. The apparatus of claim 9, wherein the gasket is made of spring steel.
  11. 11. The apparatus of claim 1, wherein the heat generating component comprises a plurality of heat generating components, and wherein the first perimeter defined by the rail comprises a plurality of first perimeters, and wherein individual heat generating components are positioned in individual first perimeters.
  12. 12. The apparatus of claim 11, wherein the frame defines a plurality of second perimeters, and wherein the plurality of first perimeters, the plurality of second perimeters, and the gasket form a plurality of faraday cages around the plurality of heat generating components to shield individual heat generating components from one another.
  13. 13. An apparatus, comprising: a circuit board extending along a first horizontal plane, the circuit board including a rail extending upwardly from the first horizontal plane; A heat generating component secured within the enclosure relative to the circuit board; a thermal module defining a major planar surface, the thermal module being parallel to the first horizontal plane and biased against the heat generating component to form a heat receiving relationship, the thermal module including a downwardly extending frame overlapping the rail such that a space exists between the overlapping frame and rail, and A gasket that does not belong to the rail or the frame, the gasket extending parallel to a second horizontal plane between the rail and the frame and being compressed between the rail and the frame to create a bias parallel to the second horizontal plane and forcing the gasket against the rail and the frame to fill the space to prevent the passage of radio frequency energy between the rail and the frame.
  14. 14. The apparatus of claim 13, wherein the circuit board, the thermal module, the rail, the frame, and the gasket form a faraday cage around the heat generating component.
  15. 15. The apparatus of claim 13, wherein the washer is sinusoidal in shape between the frame and the rail, or wherein the washer includes a plurality of teeth extending between the frame and the rail.
  16. 16. The apparatus of claim 13, wherein the gasket extends between the rail and the thermal module, or wherein the rail contacts the thermal module.
  17. 17. The apparatus of claim 13, wherein the gasket includes an alignment feature to maintain alignment of the gasket with the rail and/or wherein the gasket includes an alignment feature to maintain alignment of the gasket with the rail and the frame.
  18. 18. The apparatus of claim 13, wherein the frame provides structural integrity to the thermal module to maintain planarity of the major planar surface.
  19. 19. An apparatus, comprising: a circuit board extending along a first horizontal plane, the circuit board including a rail extending upwardly from the first horizontal plane; A heat generating component secured within the enclosure relative to the circuit board; A thermal module parallel to the first horizontal plane and biased against the heat generating component to form a heat receiving relationship, the thermal module comprising a downwardly extending frame offset from the rail such that the frame overlaps the rail and a space exists between the overlapped frame and rail, and A gasket extending parallel to a second horizontal plane between the rail and the frame but not over the heat generating component, the gasket not belonging to the rail or the frame and being compressed between the rail and the frame to create a bias parallel to the second horizontal plane and forcing the gasket against the rail and the frame to fill the space, thereby blocking radio frequency energy between the rail and the frame to complete a faraday cage around the heat generating component.
  20. 20. The apparatus of claim 19, wherein the thermal module is positioned above the heat generating component in direct contact with the heat generating component, and wherein the thermal module is biased directly toward the heat generating component without a cover.

Description

Size limited device faraday cage Background The description relates to a size-constrained device having a heat-generating component, and to cooling the heat-generating component while providing electromagnetic shielding (e.g., RF shielding). Drawings The drawings illustrate the implementation of the concepts conveyed herein. Features of the illustrated implementations may be more readily understood by reference to the following description taken in conjunction with the accompanying drawings. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same elements. Further, the leftmost digit(s) of each reference number communicates with the figure in which the reference number is first introduced and the associated discussion. Fig. 1 is a partially cut-away perspective view of an example apparatus that may include an implementation of the present size limited shield circuit board assembly in accordance with the concepts of the present invention. Fig. 2A-2D are exploded perspective views of portions of the example size limited shield circuit board assembly of fig. 1. Fig. 2E is a perspective view of a portion of the example size limited shield circuit board assembly of fig. 1. Fig. 2F and 2G are cross-sectional views of a portion of an example size limited shield circuit board assembly as indicated in fig. 2E. Fig. 3 and 4 are cross-sectional views of examples of alternative size limited shield circuit board assemblies according to some implementations of the inventive concept. Fig. 5 is an exploded perspective view of an example of an alternate size limited shield circuit board assembly in accordance with some implementations of the inventive concept. Description of the invention The present inventive concept relates to devices, such as computing devices. For many form factors, such as tablets, notebooks, and/or wearable devices, consumer preferences tend to be smaller form factors, particularly thinner (e.g., z-size limitations) and/or lighter form factors. At the same time, consumers want high performance from computing resources (e.g., heat generating components), such as processing resources, memory resources, battery resources, and the like. High performance often results in unwanted heat generation from the heat generating components. The heat may be dissipated via a thermal module positionable adjacent the heat generating component. The heat generating components are also shielded from ambient radio frequency energy (RF shielding) that may degrade their performance. Further, RF emissions (e.g., RF noise) from the heat generating components may be blocked so that they do not interfere with other device components (such as various antennas). In other words, the inventive concept may relate to RF shielding in both directions (e.g., from and towards the heat generating components). The inventive concept may employ components in the device that contribute to both locating the thermal module and the heat generating component and to the RF shielding of the heat generating component. These components may save space in the thin form factor device in the z-dimension, as well as other advantages. These components may also provide reduced z-dimensions by removing other components that contribute to the z-height. Conventionally, a cover is placed over the thermal module to bias against the thermal module of the heat generating assembly. The present invention implementation allows for the removal of the cover and thereby reduces thickness, cost and/or complexity. In some cases, the components also contribute to repairability (e.g., easier assembly and disassembly) of the device. These and other aspects are described below. FIG. 1 illustrates a partial cross-sectional view of an example device 100 that appears as a tablet-type computing device. In this representation, the device 100 may include a limited-size shielded and cooled circuit board assembly 102 (hereinafter "circuit board assembly"), which in this example is contained within the housing 104 and the display 106. The circuit board assembly 102 may be employed in other device scenarios. Fig. 2A-2G collectively illustrate features of the circuit board assembly 102. Fig. 2A-2D illustrate exploded views of the circuit board assembly 102. Fig. 2E shows a partially assembled view of the circuit board assembly 102. Fig. 2F and 2G are views of a portion of the circuit board assembly 102. The circuit board assembly 102 may include a circuit board 202, a heat generating component 204, a thermal module 206, a frame 208, a rail 210, and a gasket 212. The circuit board 202 may be embodied as a Printed Circuit Board (PCB), a Flexible Printed Circuit (FPC), or the like. The heat generating component 204 may be positioned on the circuit board 202. The heat generating component may be embodied as a processor 214, such as a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), and memory/storage, battery and/or converter, etc.