CN-114373730-B - Electronic assembly and manufacturing method

CN114373730BCN 114373730 BCN114373730 BCN 114373730BCN-114373730-B

Abstract

The invention discloses an electronic component and a manufacturing method thereof. The electronic component is used for an electronic product and comprises a substrate, a bump arranged on the substrate and used for electrically connecting the electronic product, and at least one under bump metal layer arranged between the bump and the substrate and used for enabling the bump to be attached to the substrate, wherein the under bump metal layer forms a notch structure.

Inventors

ZENG GUOWEI
CHEN BAIQI

Assignees

矽创电子股份有限公司

Dates

Publication Date: 20260508
Application Date: 20151105
Priority Date: 20150626

Claims (12)

1. An electronic assembly for an electronic product, the electronic assembly comprising: A substrate; A bump disposed on the substrate for electrically connecting the electronic product, and At least one under bump metal layer arranged between the bump and the substrate to enable the bump to be attached to the substrate; wherein the UBM layer forms a notch structure such that the UBM layer is recessed on each side relative to the bump by a distance of at least 0.5 microns.
2. The electronic component of claim 1, wherein the under bump metal layer forms a portion of the bump when the bump and the under bump metal layer are made of the same material, or is a metal bond in a stacked arrangement when the bump and the under bump metal layer are made of different materials.
3. The electronic assembly of claim 1, wherein the notch structure is located in a plane where the bump is attached to the under bump metallurgy layer, and a first cross-sectional area of the projection of the bump is greater than a second cross-sectional area of the projection of the under bump metallurgy layer as viewed from a top view.
4. The electronic assembly of claim 1, wherein during an etching operation, the under bump metallurgy layer undergoes a structure breaking process to form the notch structure in a plane corresponding to the bump abutting the under bump metallurgy layer.
5. The electronic component of claim 1, comprising another under bump metal layer disposed between the under bump metal and the substrate, wherein a third cross-sectional area of the projection of the another under bump metal layer is greater than a second cross-sectional area of the projection of the under bump metal layer as viewed from a top view.
6. The electronic assembly of claim 5, wherein the under bump metal layer and the another under bump metal layer stack form a stair-step structure.
7. A method of manufacturing an electronic component for an electronic product, wherein the electronic component comprises a substrate, a bump and at least one under bump metallurgy, the method comprising: Sequentially disposing the under bump metal layer and the bump on the substrate, and An etching operation is performed on the UBM layer to form a notch structure such that the UBM layer is backed off on each side by a distance of at least 0.5 microns with respect to the bump.
8. The method of claim 7, wherein the under bump metal layer forms a part of the bump when the bump and the under bump metal layer are made of the same material, or is a metal bond assembly stacked on the under bump metal layer when the bump and the under bump metal layer are made of different materials.
9. The method of claim 7, wherein the notch structure is located in a plane where the bump is attached to the under bump metallurgy layer, and a first cross-sectional area of the projection of the bump is larger than a second cross-sectional area of the projection of the under bump metallurgy layer as seen from a top view.
10. The method of claim 7, wherein the etching operation performs a structure breaking process on the under bump metallurgy layer to form the notch structure in a plane corresponding to the bump bonding the under bump metallurgy layer.
11. The method of manufacturing of claim 7, further comprising forming another under bump metal layer between the under bump metal and the substrate, wherein a third cross-sectional area of the projection of the another under bump metal layer is greater than a second cross-sectional area of the projection of the under bump metal layer as viewed from a top view.
12. The method of claim 11, wherein the under bump metal layer and the another under bump metal layer stack form a step structure.

Description

Electronic assembly and manufacturing method The application is a divisional application of an application patent application with the application number 201510744847.5 of which is 2015, 11, 05 and entitled "electronic component and manufacturing method". Technical Field The present invention relates to electronic assemblies and methods for manufacturing the same, and more particularly, to an electronic assembly and a method for manufacturing the same for improving shear stress. Background The common various electronic devices are internally provided with the adaptive assembly and connection arrangement of various electronic components to realize the work of different electronic devices. In the prior art, at least one Bump is used as a signal conducting material between a driving chip and a plurality of peripheral components of the electronic component. However, the driving chip is limited to a design specification for small size, and the related size of the bump used in the driving chip is correspondingly reduced, so that the reduced size of the bump will decrease the contact area of the bump on the driving chip and the bonding strength corresponding to the bump, and once an external force acts on the bump, part or all of the bump will easily peel off the contact area of the driving chip, thereby generating damage to the electronic component and increasing the related repair cost. Therefore, under the concept that the conventional electronic products and electronic components are designed in a small size, providing another electronic component with an improved structural design and a manufacturing method thereof to correspondingly increase the shear stress capability of the electronic component has become an important issue in the art. Disclosure of Invention Therefore, a primary objective of the present invention is to provide an electronic component and a manufacturing method thereof with improved structural design, so as to correspondingly improve the shear stress capability of the electronic component. The invention discloses an electronic component which is used for an electronic product and comprises a substrate, a lug arranged on the substrate and used for electrically connecting the electronic product, and at least one under bump metal layer arranged between the lug and the substrate and used for enabling the lug to be attached to the substrate, wherein the under bump metal layer forms a notch structure. The invention also discloses a manufacturing method for an electronic component of an electronic product, wherein the electronic component comprises a substrate, a bump and at least one under bump metal layer, the manufacturing method comprises the steps of sequentially arranging the under bump metal layer and the bump on the substrate, and performing etching operation on the under bump metal layer to form a notch structure. Drawings Fig. 1A is a schematic partial view of an electronic component according to an embodiment of the invention. Fig. 1B is a schematic diagram of a portion of another electronic component according to an embodiment of the invention. Fig. 2 is a schematic top view of an electronic assembly of fig. 1A. FIG. 3A is a flow chart of a notch structure generated by an electronic component in FIG. 1A. FIG. 4 is a graph comparing a shear stress test performed before or after creating a notched structure in an electronic component according to an embodiment of the present invention. Fig. 5 is a flowchart of a manufacturing process according to a first embodiment of the present invention. Wherein reference numerals are as follows: Detailed Description Certain terms are used throughout the description and claims to refer to particular components. It will be appreciated by those of ordinary skill in the art that manufacturers may refer to a component by different names. The present specification and claims do not take the form of an element having a difference in name, but rather use the difference in function as a basis for distinguishing. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. In addition, the term "coupled" as used herein includes any direct or indirect electrical connection. Thus, if a first device couples to a second device, that connection may be through a direct connection, or through an indirect connection via other devices and connections. Aiming at the situation that the bump cannot be effectively attached to the driving chip or is easily stripped when external force is encountered in the prior art, the embodiment of the invention improves the structure of a single or a plurality of under bump metal layers between the bump and the driving chip, and for convenience of description, the following embodiment only adaptively draws the structural characteristics of part of the bump and the under bump metal layer. Referring to fig. 1A, fi