CN-114446608-B - Semiconductor packaging structure

Abstract

The invention relates to a semiconductor packaging structure which comprises a substrate, a top transformer, a bottom transformer and a first connecting piece, wherein the substrate is provided with a core layer, the top transformer and the bottom transformer are positioned on two opposite sides of the core layer, and the first connecting piece is connected with the top transformer and the bottom transformer. Each of the top and bottom transformers is composed of two coils interleaved with each other and wound separately.

Inventors

• PAN BAIZHI
• DING JUNYAN

Assignees

• 日月光半导体制造股份有限公司
• 日月光半导体制造股份有限公司

Dates

Publication Date

20260421

Application Date

20211217

Priority Date

20211217

Claims (13)

1. 1. A semiconductor package structure, comprising: A substrate having a core layer; A top transformer and a bottom transformer on opposite sides of the core layer, the substrate having opposite first and second surfaces, the top transformer being adjacent the first surface and the bottom transformer being adjacent the second surface; a first connection connecting the top transformer and the bottom transformer; wherein each of the top transformer and the bottom transformer is composed of two coils which are mutually staggered and wound separately; A die located on the first surface of the substrate; an external connection member located on the second surface of the substrate, the external connection member being connected to a power source external to the semiconductor package structure; The bottom transformer is electrically connected to the external connecting piece through the second connecting piece; And the top transformer is electrically connected to the die through the third connecting piece.
2. 2. The semiconductor package according to claim 1, wherein, The top transformer or the bottom transformer further comprises a magnetic core.
3. 3. The semiconductor package according to claim 2, wherein, The magnetic core is surrounded by two of the coils.
4. 4. The semiconductor package according to claim 1, wherein, The two coils are wound around an axis that is parallel to the core layer.
5. 5. The semiconductor package according to claim 1, wherein, The two coils are wound around an axis that is perpendicular to the core layer.
6. 6. The semiconductor package according to claim 1, wherein, The first connector includes a through hole in the substrate.
7. 7. The semiconductor package according to claim 1, wherein, The second connector includes a through hole in the substrate.
8. 8. The semiconductor package according to claim 1, wherein, The third connector includes a through hole in the substrate.
9. 9. The semiconductor package according to claim 1, wherein, The first surface of the die adjacent to the substrate is provided with a bump connector, and the top transformer is electrically connected with the bump connector through the third connector.
10. 10. The semiconductor package according to claim 1, wherein, The bottom transformer reduces the voltage from the power source to a first voltage.
11. 11. The semiconductor package according to claim 10, wherein, The top transformer reduces the first voltage to a second voltage.
12. 12. The semiconductor package according to claim 1, wherein, The external connection is a solder ball.
13. 13. The semiconductor package according to claim 1, wherein, The bottom transformer is disposed opposite the top transformer.

Description

Semiconductor packaging structure Technical Field The present invention relates to the field of semiconductor technology, and more particularly, to a semiconductor package structure. Background A transformer (transformer) is an electronic device that converts electrical energy from one circuit to another via an induction coil. The time-varying current of the primary coil of the induction coil can generate a time-varying magnetic field in the coil of the transformer, and the time-varying magnetic field can generate a time-varying voltage or induced electromotive force in the secondary coil, and the effect is called mutual inductance. If the secondary coil is connected to a load, the secondary coil generates current and power is transferred from the primary coil to the load. In an ideal transformer, the induced voltage V s of the secondary winding is proportional to the voltage V p of the primary winding, and the ratio is equal to the ratio of the number of secondary windings N s to the number of primary windings N p, and if N s>Np, the voltage of the ac can be gradually increased, and if N s<Np, the voltage of the ac can be gradually decreased. Referring to fig. 1A, in a conventional 48V system, the voltage of the 48V may need to be changed by a plurality of transformers 14 before the signal enters the package structure 30 according to different voltage requirements. As shown in fig. 1B, the 48V voltage is stabilized by the voltage stabilizer 12, and then the 48V voltage is reduced to 1V by the transformer 14, and the corresponding current is 240A. Referring to fig. 1A and 1B, the transformer 14 is disposed outside the package structure 30 and is also disposed on the printed circuit board (Printed Circuit Board, PCB) 20 with the package structure 30. The stabilized 48V voltage is converted into a voltage required by the SoC on the package structure 30, for example, 1V voltage, by the transformer 14, and then enters the package structure 30 to perform the relevant electrical operation. However, the path of the voltage signal traveling on the PCB 20 through the transformer 14 to the package structure 30 is too long, which may result in a reduced power quality of the overall package structure and unstable voltage. Disclosure of Invention In view of the above problems in the related art, the present invention provides a semiconductor package structure capable of shortening a signal transmission path and improving energy consumption. According to an embodiment of the present invention, there is provided a semiconductor package structure. The semiconductor packaging structure comprises a substrate, a top transformer, a bottom transformer and a first connecting piece, wherein the substrate is provided with a core layer, the top transformer and the bottom transformer are positioned on two opposite sides of the core layer, and the first connecting piece is used for connecting the top transformer and the bottom transformer. Wherein each of the top transformer and the bottom transformer is composed of two coils which are interlaced with each other and wound separately. In some embodiments, the substrate has opposing first and second surfaces, the top transformer being adjacent the first surface and the bottom transformer being adjacent the second surface. In some embodiments, the top transformer or the bottom transformer further comprises a magnetic core. In some embodiments, the magnetic core is surrounded by two coils. In some embodiments, the two coils are wound about an axis that is parallel to the core layer. In some embodiments, the two coils are wound about an axis that is perpendicular to the core layer. In some embodiments, the first connector includes a through hole in the substrate. In some embodiments, the semiconductor package structure further includes a die located on the first surface of the substrate and an external connection located on the second surface of the substrate. In some embodiments, the semiconductor package further includes a second connection member, and the bottom transformer is electrically connected to the external connection member through the second connection member. In some embodiments, the second connector includes a through hole in the substrate. In some embodiments, the semiconductor package further includes a third connection, through which the top transformer is electrically connected to the die. In some embodiments, the third connector includes a through hole in the substrate. In some embodiments, the die has bump connectors at a first surface adjacent to the substrate, and the top transformer is electrically connected to the bump connectors through third connectors. In some embodiments, the external connection is connected to a power source external to the semiconductor package. In some embodiments, the bottom transformer reduces the voltage from the power source to a first voltage. In some embodiments, the top transformer reduces the first voltage to the second voltage. In