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CN-114467234-B - Bus bar assembly and method of manufacturing the same

CN114467234BCN 114467234 BCN114467234 BCN 114467234BCN-114467234-B

Abstract

A bus bar assembly of the present invention includes 1 st and 2 nd bus bars arranged in parallel with each other with a gap in the same plane, and an insulating resin layer including a gap filling portion and an upper surface lamination portion, wherein the upper surface lamination portion is provided with a1 st bus bar side upper surface opening exposing a predetermined region crossing a boundary between the 1 st bus bar and the gap filling portion, and a2 nd bus bar side upper surface opening exposing a predetermined region crossing a boundary between the 2 nd bus bar and the gap filling portion, and a partition wall is formed at a portion between the 1 st and 2 nd bus bar side upper surface openings in the upper surface lamination portion.

Inventors

  • ADACHI YUSUKE

Assignees

  • 新确有限公司

Dates

Publication Date
20260512
Application Date
20200902
Priority Date
20190927

Claims (12)

  1. 1. A bus bar assembly, comprising: The bus bar 1 and the bus bar 2 are formed by conductive flat plate-shaped members and are arranged on the same plane in a state that gaps exist between the bus bars, and an insulating resin layer comprises a gap filling part and an upper surface lamination part which are filled in the gaps, wherein the upper surface lamination part is arranged on the upper surface of one side in the thickness direction of a bus bar connecting body formed by connecting the bus bar 1 and the bus bar 2 by the gap filling part, The insulating resin layer further includes a lower surface lamination portion provided on a lower surface of the bus bar connecting body on the other side in the thickness direction thereof, and a side lamination portion provided on a side surface of the bus bar connecting body and connecting the upper surface lamination portion and the lower surface lamination portion, wherein the upper surface lamination portion is provided with a 1 st bus bar side upper surface opening exposing a predetermined region crossing a boundary between the 1 st bus bar and the gap filling portion, and a2 nd bus bar side upper surface opening exposing a predetermined region crossing a boundary between the two, of the upper surfaces of the 2 nd bus bar and the gap filling portion, A portion of the upper surface laminate portion between the 1 st bus bar side upper surface opening and the 2 nd bus bar side upper surface opening forms a partition wall, The lower surface lamination portion is provided with a lower surface opening exposing a predetermined region of the lower surfaces of the 1 st bus bar and the 2 nd bus bar.
  2. 2. The bus bar assembly of claim 1 wherein the bus bar assembly comprises, The 1 st bus bar side upper surface opening and the 2 nd bus bar side upper surface opening are provided in the center of the 1 st bus bar and the 2 nd bus bar in the length direction of the gap.
  3. 3. The bus bar assembly of claim 1 wherein the bus bar assembly comprises, The bus bar assembly comprises a frame body having an outer shape corresponding to the outer shape of the bus bar connecting body in a plan view, and provided with a predetermined thickness of a frame body surrounding central holes of the 1 st bus bar side upper surface opening and the 2 nd bus bar side upper surface opening in a plan view center, and an insulating resin layer covering the outer periphery of the frame body, The frame is fixedly joined to the peripheral edge of the upper surface of the bus bar connecting body so as to surround the 1 st bus bar side upper surface opening and the 2 nd bus bar side upper surface opening in a plan view.
  4. 4. A bus bar assembly, comprising: The bus bar 1 and the bus bar 2 are formed by conductive flat plate-shaped members and are arranged on the same plane in a state that gaps exist between the bus bars, and an insulating resin layer comprises a gap filling part and an upper surface lamination part which are filled in the gaps, wherein the upper surface lamination part is arranged on the upper surface of one side in the thickness direction of a bus bar connecting body formed by connecting the bus bar 1 and the bus bar 2 by the gap filling part, A1 st bus bar side upper surface opening exposing a predetermined region crossing a boundary between the 1 st bus bar and the gap filling portion in the upper surface lamination portion and a2 nd bus bar side upper surface opening exposing a predetermined region crossing a boundary between the two in the upper surface lamination portion, A portion of the upper surface laminate portion between the 1 st bus bar side upper surface opening and the 2 nd bus bar side upper surface opening forms a partition wall, The 1 st bus bar and the 2 nd bus bar have the upper surface, a lower surface on the other side in the thickness direction, a 1 st side surface facing the gap, a 2 nd side surface facing the opposite side to the gap, a 3 rd side surface connecting one end part of the upper surface, the lower surface, the 1 st side surface and the 2 nd side surface in the length direction of the gap, and a 4 th side surface connecting the other end part of the upper surface, the lower surface, the 1 st side surface and the 2 nd side surface in the length direction of the gap, The 1 st side surface has an upper surface abutting portion extending from the upper surface to the thickness direction other side, a step portion extending from an end portion of the upper surface abutting portion on the thickness direction other side toward a direction approaching the 2 nd side surface, and a lower surface abutting portion extending from an end portion of the step portion on the 2 nd side surface toward the thickness direction other side to the lower surface, The 2 nd side surface has an upper surface abutting portion extending from the upper surface to the other side in the thickness direction, a step portion extending from an end portion of the upper surface abutting portion on the other side in the thickness direction toward a direction approaching the 1 st side surface, and a lower surface abutting portion extending from an end portion of the step portion on the other side in the thickness direction toward the other side and reaching the lower surface, The insulating resin layer further includes a side surface lamination portion integrally formed with the upper surface lamination portion so that lower surfaces of the 1 st bus bar and the 2 nd bus bar are exposed and cover side surfaces of the bus bar connecting body.
  5. 5. The bus bar assembly of claim 4 wherein the bus bar assembly comprises, The 1 st bus bar side upper surface opening and the 2 nd bus bar side upper surface opening are provided in the center of the 1 st bus bar and the 2 nd bus bar in the length direction of the gap.
  6. 6. The bus bar assembly of claim 4 wherein the bus bar assembly comprises, The bus bar assembly comprises a frame body having an outer shape corresponding to the outer shape of the bus bar connecting body in a plan view, and provided with a predetermined thickness of a frame body surrounding central holes of the 1 st bus bar side upper surface opening and the 2 nd bus bar side upper surface opening in a plan view center, and an insulating resin layer covering the outer periphery of the frame body, The frame is fixedly joined to the peripheral edge of the upper surface of the bus bar connecting body so as to surround the 1 st bus bar side upper surface opening and the 2 nd bus bar side upper surface opening in a plan view.
  7. 7. A method for manufacturing a bus bar assembly comprising a 1 st bus bar and a2 nd bus bar, wherein the 1 st bus bar and the 2 nd bus bar are formed by conductive flat plate-shaped members and are arranged in the same plane in a state of having a gap between them, and an insulating resin layer comprising a gap filling portion filled in the gap, an upper surface lamination portion provided on an upper surface of a bus bar connecting body formed by connecting the 1 st bus bar and the 2 nd bus bar by the gap filling portion, a lower surface lamination portion provided on a lower surface of the other side in the thickness direction of the bus bar connecting body, the side lamination portion being provided on a side surface of the bus bar connecting body and connecting a peripheral edge of the upper surface lamination portion and the lower surface lamination portion, a predetermined region between the upper surface of the 1 st bus bar and the upper surface of the gap filling portion and a predetermined region between the upper surface of the 1 st bus bar and the lower surface of the bus bar, and a predetermined region between the upper surface of the first bus bar and the upper surface of the first bus bar 1 st bus bar and the lower surface of the bus bar 2 are provided on a predetermined region between the upper surface of the bus bar, and the opening of the first bus bar is provided on the upper surface of the bus bar 1 st bus bar and the first bus bar and the upper surface of the first bus bar 2 is provided, The method for manufacturing the bus bar assembly is characterized by comprising the following steps: A step of preparing a conductive metal flat plate for bus bar having a bus bar assembly forming region for forming the 1 st bus bar and the 2 nd bus bar; A slit forming step of forming a slit having the same width as the gap and penetrating between an upper surface on one side in the thickness direction and a lower surface on the other side in the thickness direction in the bus bar assembly forming region, and defining a1 st bus bar forming portion and a2 nd bus bar forming portion corresponding to the 1 st bus bar and the 2 nd bus bar; providing an insulating resin layer material in the gap and over the entire upper surface of the bus bar assembly forming region; a step of forming the insulating resin layer having the gap filling portion and the upper surface lamination portion by curing the insulating resin layer material; a laser irradiation step of irradiating a region of the upper surface laminate portion corresponding to the 1 st bus bar side upper surface opening and the 2 nd bus bar side upper surface opening with laser light to form the 1 st bus bar side upper surface opening and the 2 nd bus bar side upper surface opening; A lower surface side laser irradiation step of irradiating a region corresponding to the lower surface opening in the lower surface laminated portion with laser light to form the lower surface opening, and A cutting step of cutting the bus bar assembly forming region from the bus bar conductive metal flat plate, The laser irradiation step is configured to repeat a large pulse width laser irradiation process of irradiating the entire corresponding region with a large pulse width pulse laser and a small pulse width laser irradiation process of irradiating the entire corresponding region with a small pulse width pulse laser a plurality of times.
  8. 8. The method of manufacturing a bus bar assembly according to claim 7, wherein, The conductive metal flat plate for bus bar integrally has a plurality of bus bar assembly forming regions arranged in series in the 1 st direction along the length direction of the slit and a connecting region connecting adjacent bus bar assembly forming regions, In the slit formed in one bus bar assembly forming region, one end side in the longitudinal direction extends into a connecting region connected to one side in the 1 st direction of the one bus bar assembly forming region, and the other end side in the longitudinal direction extends into a connecting region connected to the other side in the 1 st direction of the one bus bar assembly forming region.
  9. 9. The method of manufacturing a bus bar assembly according to claim 7 or 8, wherein, The method for manufacturing the bus bar assembly comprises the following steps: A step of preparing a conductive metal flat plate for a frame body having a frame body forming region with an outer shape corresponding to the bus bar assembly forming region in a plan view; Forming a frame body forming portion by forming a center hole surrounding the 1 st bus bar side upper surface opening and the 2 nd bus bar side upper surface opening in a plan view in the frame body forming region; a step of providing an insulating resin layer material on the outer peripheral surface of the frame body forming portion; A step of setting the insulating resin layer material to cover the outer periphery of the frame body forming part by curing the insulating resin layer material, and A metal flat plate fixing and bonding step of fixing and bonding the conductive metal flat plate for the frame and the conductive metal flat plate for the bus bar in a superposed state, The cutting step is performed after the metal flat plate fixing and bonding step.
  10. 10. A bus bar assembly, comprising: And an insulating resin layer including a gap filling portion filled in the gap, an upper surface lamination portion provided on an upper surface of one side in a thickness direction of a bus bar connecting body in which the 1 st bus bar and the 2 nd bus bar are connected by the gap filling portion, a lower surface lamination portion provided on a lower surface of the other side in the thickness direction of the bus bar connecting body, and a side lamination portion provided on a side surface of the bus bar connecting body and connecting a peripheral edge of the upper surface lamination portion and the lower surface lamination portion, A 1 st bus bar side upper surface opening and a 2 nd bus bar side upper surface opening which expose a part of the upper surfaces of the 1 st bus bar and the 2 nd bus bar respectively are provided in the upper surface lamination portion, The lower surface lamination portion is provided with a1 st bus bar side lower surface opening and a2 nd bus bar side lower surface opening which expose predetermined areas of the lower surfaces of the 1 st bus bar and the 2 nd bus bar, respectively.
  11. 11. A bus bar assembly, comprising: And an insulating resin layer including a gap filling portion filled in the gap, an upper surface lamination portion provided on an upper surface of one side in a thickness direction of a bus bar connecting body in which the 1 st bus bar and the 2 nd bus bar are connected by the gap filling portion, a lower surface lamination portion provided on a lower surface of the other side in the thickness direction of the bus bar connecting body, and a side lamination portion provided on a side surface of the bus bar connecting body and connecting a peripheral edge of the upper surface lamination portion and the lower surface lamination portion, A1 st bus bar side upper surface opening and a 2 nd bus bar side upper surface opening exposing a part of the upper surfaces of the 1 st bus bar and the 2 nd bus bar respectively are provided in the upper surface lamination portion, The lower surface lamination portion is provided with a single lower surface opening that integrally exposes both of the predetermined areas of the lower surfaces of the 1 st bus bar and the 2 nd bus bar.
  12. 12. A bus bar assembly, comprising: The bus bar 1 and the bus bar 2 are formed by conductive flat plate-shaped members and are arranged on the same plane in a state that gaps exist between the bus bars 1 and the bus bars 2, and an insulating resin layer comprises a gap filling part and an upper surface lamination part which are filled in the gaps, wherein the upper surface lamination part is arranged on the upper surface of one side in the thickness direction of a bus bar connecting body formed by connecting the bus bar 1 and the bus bar 2 by the gap filling part, The 1 st bus bar and the 2 nd bus bar have the upper surface on one side in the thickness direction, a lower surface on the other side in the thickness direction, a 1 st side surface facing the gap, a2 nd side surface facing the opposite side to the gap, a 3 rd side surface connecting the ends of the upper surface, the lower surface, the 1 st side surface and the 2 nd side surface on one side in the length direction of the gap, and a 4 th side surface connecting the ends of the upper surface, the lower surface, the 1 st side surface and the 2 nd side surface on the other side in the length direction of the gap, The 1 st side surface has an upper surface abutting portion extending from the upper surface to the thickness direction other side, a step portion extending from an end portion of the upper surface abutting portion on the thickness direction other side toward a direction approaching the 2 nd side surface, and a lower surface abutting portion extending from an end portion of the step portion on the 2 nd side surface toward the thickness direction other side to the lower surface, The 2 nd side surface has an upper surface abutting portion extending from the upper surface to the other side in the thickness direction, a step portion extending from an end portion of the upper surface abutting portion on the other side in the thickness direction toward a direction approaching the 1 st side surface, and a lower surface abutting portion extending from an end portion of the step portion on the other side in the thickness direction toward the other side and reaching the lower surface, A1 st bus bar side upper surface opening and a 2 nd bus bar side upper surface opening exposing a part of the upper surfaces of the 1 st bus bar and the 2 nd bus bar respectively are provided in the upper surface lamination portion, The insulating resin layer has, in addition to the gap filling portion and the upper surface lamination portion, a side surface lamination portion integrally formed with the upper surface lamination portion so as to expose lower surfaces of the 1 st bus bar and the 2 nd bus bar and cover side surfaces of the bus bar connecting body.

Description

Bus bar assembly and method of manufacturing the same Technical Field The present invention relates to a bus bar assembly in which a1 st bus bar and a2 nd bus bar are mechanically connected in an electrically insulated state, and a method for manufacturing the same. Background Bus bar assemblies including a plurality of bus bars mechanically connected to each other in an electrically insulated state have been proposed and utilized in various fields. For example, a laminated bus bar assembly is proposed in which one flat bus bar and another flat bus bar are laminated up and down in parallel to each other (see patent documents 1 and 2 below). In the laminated bus bar assembly, the opposing plane of one flat bus bar and the opposing plane of the other flat bus bar are disposed to face each other across the insulating resin layer, and thus there is a problem that it is difficult to sufficiently secure reliability related to insulation. In particular, if the thickness of the insulating resin layer between the one flat bus bar and the other flat bus bar is made thinner in order to achieve miniaturization in the up-down direction, leakage current may flow between the two bus bars. In order to solve the above-described problem of the laminated bus bar assembly, the applicant of the present application has made an application for a planar bus bar assembly in which the 1 st bus bar and the 2 nd bus bar of the conductive metal flat plate are arranged in parallel on the same plane (see patent documents 3 and 4 below). Fig. 21 (a) is a plan view of an example of the planar busbar assembly 500. In addition, fig. 21 (b) shows a cross-sectional view taken along the lines XXI (b) -XXI (b) in fig. 21 (a). As shown in fig. 21 (a) and (b), the planar bus bar assembly 500 includes a1 st bus bar 510 (1) of a conductive metal flat plate, a2 nd bus bar 510 (2) of a conductive metal flat plate, the 2 nd bus bar 510 (2) having a gap 515 between the 1 st bus bar 510 (1) and being disposed in the same plane as the 1 st bus bar 510 (1), and an insulating resin layer 520, the insulating resin layer 520 mechanically connecting the 1 st and 2 nd bus bars 510 (1), 510 (2) in an electrically insulated state. The insulating resin layer 520 includes a gap filling portion 525, the gap filling portion 525 being filled in the gap 515, and a surface lamination portion 530, the surface lamination portion 530 being laminated on a surface of a bus bar connecting body formed by connecting the 1 st and 2 nd bus bars 510 (1) and 510 (2) by the gap filling portion 525. The surface laminated portion 530 includes an upper surface laminated portion 530 and a lower surface laminated portion 540, the upper surface laminated portion 530 and the lower surface laminated portion 540 covering an upper surface on one side in the thickness direction and a lower surface on the other side in the thickness direction of the bus bar joint body, respectively, and a side laminated portion 550 covering an outer side surface of the bus bar joint body and connecting the upper surface laminated portion 530 and the lower surface laminated portion 540. The upper surface lamination portion 530 is provided with 1 st and 2 nd openings 532 (1) and 532 (2) that expose predetermined portions of the upper surfaces of the 1 st and 2 nd bus bars 510 (1) and 510 (2) to form 1 st and 2 nd exposed areas. Fig. 21 (c) is a longitudinal sectional view of a semiconductor module 600 in which the semiconductor element 110 such as an LED is mounted on the bus bar assembly 500. As shown in fig. 21 c, in the semiconductor element 110, the 1 st electrode layer (lower electrode layer) and one of the 1 st and 2 nd exposed regions (the 1 st exposed region in fig. 21 c) are mechanically and electrically connected, for example, via a plating layer (not shown), and the 2 nd electrode layer (upper electrode layer) and the other of the 1 st and 2 nd exposed regions (the 2 nd exposed region in fig. 21 c) are electrically connected via a wire bonding (wire bonding) 120. The planar bus bar assembly 500 is useful in that miniaturization can be achieved in the vertical direction, but there is room for improvement in terms of the intensive arrangement (collective arrangement) of the mounted semiconductor elements 110. That is, the limit of the intensive arrangement of the semiconductor element 110 is defined by a separation width L2 (see fig. 21 b) between the opposite edges of the 1 st and 2 nd openings 532 (1) and 532 (2), and in the planar bus bar assembly 500, L2 is equal to or greater than the width L1 of the gap between the 1 st and 2 nd bus bars 510 (1) and 510 (2). In the planar bus bar assembly 500 having this structure, the gap L1 needs to be reduced in order to reduce the L2, but there is a limit to reducing the width L1 of the gap from the viewpoint of ensuring insulation between the 1 st and 2 nd bus bars 510 (1) and 510 (2). Prior art literature Patent literature Patent document 1 Japanese patent No