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CN-114521193-B - Hermetically sealed glass package

CN114521193BCN 114521193 BCN114521193 BCN 114521193BCN-114521193-B

Abstract

The invention provides a package for heat-sealing functional areas, comprising a base substrate, a cover substrate, which together with the cover substrate forms at least part of the package or forms the package, at least one functional area, such as a cavity, hermetically sealed by the package, wherein the package comprises at least one laser bonding wire, and the substrates of the package are hermetically bonded to each other by the at least one laser bonding wire, wherein the laser bonding wire has a height HL perpendicular to the bonding surface thereof, wherein heat can be generated in the functional area of the package, and wherein at least the base substrate and/or the cover substrate are in the form of a thermal insulator.

Inventors

  • R. hight
  • J. U. Thomas
  • A. Matanin
  • HERTZBERG JOACHIM
  • Small root Zawa margin
  • T. Zettel

Assignees

  • 肖特股份有限公司

Dates

Publication Date
20260505
Application Date
20200925
Priority Date
20190926

Claims (20)

  1. 1.A hermetically sealed package (1) for heat sealing functional areas, comprising: A base substrate (3); A cover substrate (5), the base substrate together with the cover substrate forming at least a part of the package or forming the package; At least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) arranged between the base substrate (3) and the cover substrate (5); -a plurality of functional areas hermetically sealed by said encapsulation (1), said functional areas being in the form of cavities; -at least one laser bonding wire (8) hermetically bonding the bottom substrate (3) and at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f), and-at least one laser bonding wire (8) hermetically bonding at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and the cover substrate (5); Wherein each of said laser bonding wires has a Height (HL) perpendicular to its respective bonding surface; wherein heat can be generated within the cavity of the package; Wherein at least the base substrate and/or the cover substrate is in the form of a thermal insulator; Wherein the base substrate (3), the at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and/or the cover substrate (5) comprise a vitreous material; wherein a plurality of receiving articles (2) are provided in the package (1), and wherein the receiving articles (2) are distributed to different cavities, and Wherein the package (1) comprises glass through holes on an intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) separating at least two cavities for electrically connecting the receiving articles (2) arranged in the different cavities.
  2. 2. Hermetically sealed package (1) according to claim 1, Wherein the base substrate (3), the at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and/or the cover substrate (5) are made of a low thermal conductivity material, and/or Wherein the base substrate (3), the at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and the cover substrate (5) are in the form of thermal insulators.
  3. 3. Hermetically sealed package (1) according to claim 1, Wherein the base substrate (3), the at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and/or the cover substrate (5) comprises glass, glass-ceramic, silicon, sapphire or a combination of the above materials.
  4. 4. A hermetically sealed package (1) according to any of claims 1 to 3, wherein at least one of the laser bonding wires (8) circumferentially surrounds the cavity at a Distance (DF) from the cavity.
  5. 5. Hermetically sealed package (1) according to any one of claims 1 to 3, Wherein the containment article (2) comprises an electronic circuit, a sensor or a MEMS.
  6. 6. Hermetically sealed package (1) according to any one of claims 1 to 3, Wherein the receiving article (2) comprises a power semiconductor chip, and/or Wherein the receiving article (2) forms part of the package.
  7. 7. Hermetically sealed package (1) according to claim 6, wherein the power semiconductor chip is selected from the group consisting of GaN LEDs, siC power transistors, gaAs power transistors and GaN power transistors.
  8. 8. Hermetically sealed package (1) according to any one of claims 1 to 3, Wherein, insulating medium is included in the cavity in order to improve insulating effect.
  9. 9. Hermetically sealed package (1) according to claim 8, Wherein the insulating medium is a fluid or a vacuum.
  10. 10. Hermetically sealed package (1) according to claim 9, Wherein the fluid is an insulating liquid or an insulating gas.
  11. 11. Hermetically sealed package (1) according to any one of claims 1 to 3, Further comprising at least one electrical connection layer on at least one of said at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f).
  12. 12. Hermetically sealed package (1) according to any one of claims 1 to 3, Wherein at least one of the base substrate (3), the at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and the cover substrate (5) is provided in the form of a multilayer composite comprising one or more coating or pre-stressing zones and/or comprising one or more substrates.
  13. 13. Hermetically sealed package (1) according to any one of claims 1 to 3, Wherein the laser bonding wire (8) having the Height (HL) extends into the material of the base substrate (3), the at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and the cover substrate (5) arranged above the laser bonding wire, and wherein the base substrate (3), the at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and the cover substrate (5) are bonded together by fusing to each other.
  14. 14. A hermetically sealed package (1) according to any one of claims 1 to 3, wherein indicia are included in at least one of the base substrate (3), the at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and the cover substrate (5).
  15. 15. Hermetically sealed package (1) according to any one of claims 1 to 3, Wherein the encapsulation (1) is at least partially and/or part thereof transparent for a range of wavelengths.
  16. 16. Hermetically sealed package (1) according to any one of claims 1 to 3, Wherein the cavity of the package is adapted to receive a receiving article having dimensions of 10mm x 10mm or less.
  17. 17. Hermetically sealed package (1) according to claim 16, Wherein the cavity of the package is adapted to receive a receiving article having dimensions of 5mm by 5mm or less.
  18. 18. Hermetically sealed package (1) according to claim 17, Wherein the cavity of the package is adapted to receive a receiving article having dimensions of 2mm x 2mm or less.
  19. 19. Hermetically sealed package (1) according to claim 18, Wherein the cavity of the package is adapted to receive a receiving article having dimensions of 1mm x 1mm or less.
  20. 20. A method for providing a hermetically sealed package (1), wherein the package (1) encloses a plurality of functional areas, the functional areas being in the form of cavities, the method comprising the steps of: -providing a base substrate (3), at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and a cover substrate (5), the cover substrate (5) being at least partially or partially transparent for at least one wavelength range; -arranging a plurality of containing articles (2) within the cavity, wherein the containing articles (2) are distributed to different cavities; -arranging the cover substrate (5) on a bottom substrate above the receiving article (2) such that at least one contact area (25) is formed between the at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and the bottom substrate (3), and at least one contact area (25) is formed between the at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and the cover substrate (5) such that each package (1) has at least one contact area; -hermetically sealing the cavity by forming at least one laser bonding wire (8) along at least one contact area of each package (1), wherein at least one laser bonding wire (8) hermetically bonds the bottom substrate (3) and at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f), and at least one laser bonding wire (8) hermetically bonds at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and the cover substrate (5); wherein at least one of the base substrate and the cover substrate is designed to be thermally insulated; Wherein the base substrate (3), the at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) and/or the cover substrate (5) comprise a vitreous material, and Wherein the package (1) comprises glass through holes on at least one intermediate substrate (4, 4a,4b,4c,4d,4e,4 f) separating at least two cavities for electrically connecting the receiving articles (2) arranged in different cavities.

Description

Hermetically sealed glass package Technical Field The present invention relates to a hermetically sealed, in particular multiple sealed, glass package, and a method for providing a hermetically sealed glass package. Background Hermetically sealed packages, which may also be referred to as shells, packages or housings, may be used, for example, to protect sensitive electronic devices, circuits, or sensors, etc. These packages enable the application of medical implants in, for example, the heart area, retina or for biological processors. Biological processors made of titanium are known and are being used. The sensor can be protected from particularly adverse environmental conditions by the package according to the invention. The field also includes microelectromechanical systems (MEMS), barometers, blood gas sensors, glucose sensors, and the like. Another application area of the package according to the invention can be seen in the field of housings for smart phones, virtual reality glasses and similar devices. The package according to the invention may also be used for producing flow batteries, for example in the context of electric vehicles. Moreover, the package according to the present invention may also find application in the aerospace industry, high temperature applications and micro-optics. Common to the above-mentioned intended purposes of use is that the electronic device needs to meet high requirements in terms of its robustness. In order to be able to use electronic devices that are not expected to withstand such external impacts, the package must be protected from such adverse environmental effects. Furthermore, it may be necessary to ensure that communication with the interior of the package, i.e. with the cavity defined by the package (e.g. containing electromagnetic radiation), is performed, e.g. in the visible range and/or in the microwave radiation range, which means that the package should be at least partially transparent, i.e. at least in part thereof, and/or at least transparent for certain wavelength ranges. This transparency enables communication processes, data or energy transmission, measurement of electronic devices or sensors arranged in the cavity or measurement therewith. In particular, optical communication techniques or optical data and energy transmission may be made possible. In principle, it is known to combine several parts and arrange them in such a way that a receiving area is formed in the intermediate space, which receiving area can receive a component. For example, european patent EP 3 012 059 B1, which is incorporated herein by reference, discloses a method for producing a transparent member for protecting optical components. For this purpose, a novel laser process is used. There is a problem in that, for example, in the case of use as a bioimplant, a large amount of heat energy is released from the interior of the package in a short time or a long time, i.e., the heat escaping from the package may cause damage to the vicinity of the bioimplant. Known studies have addressed the effects of heat on various types of tissue and generally assume that local damage has occurred when the local temperature exceeds 43 degrees celsius, which may have resulted in cell death, depending on the location of the damage. For example, in the event of a failure (e.g., a short circuit of a semiconductor component or a battery), temperatures above 100 degrees celsius may be reached in a short time. Disclosure of Invention The present invention therefore relates to a research scope to improve packages and in particular to make packages more robust. In other words, it is therefore an object of the present invention to provide an improved package which reduces the temperature load in the vicinity, for example to prevent cell damage. This may be achieved by reducing, delaying or controlling the heat emitted from the package into the environment. Alternatively, the package according to the invention can use cheaper components because of the protection provided. In particular, the present invention may use components with greater fault tolerance that are less costly to manufacture because the present invention may tolerate component failure without the components generating temperature peaks (e.g., in an organization). Yet another aspect of the invention is based on the recognition that in the case of hermetically sealed package solutions special provisions may have to be made to dissipate any heat in the package that may be generated over a long period of time, e.g. heat from the power semiconductor. The package according to the invention is thus designed for thermal encapsulation of functional areas. In other words, the package is thermally insulated, thereby preventing heat from escaping from the package into the environment, especially thermal spikes that may occur, for example, in the event of a failure of an electronic component in the package. To this end, the package comprises at least o