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CN-114530396-B - Apparatus for treating substrate

CN114530396BCN 114530396 BCN114530396 BCN 114530396BCN-114530396-B

Abstract

Embodiments of the inventive concept provide an apparatus for processing a substrate. The apparatus includes a process container having an inner space, a support unit configured to support and rotate a substrate in the inner space, a liquid supply unit configured to supply a process liquid to the substrate supported by the support unit, and an exhaust unit configured to exhaust a gas flow from the inner space, wherein the exhaust unit includes a gas flow guiding pipe having an inlet provided to introduce the gas flow into the gas flow guiding pipe in a tangential direction to a rotation direction of the substrate supported on the support unit.

Inventors

  • YAN JIXIANG
  • SONG JINGYUAN
  • Liu Yanglie
  • Xu Gengjin

Assignees

  • 细美事有限公司

Dates

Publication Date
20260505
Application Date
20211123
Priority Date
20201123

Claims (17)

  1. 1. An apparatus for processing a substrate, the apparatus comprising: a processing container having an interior space; a supporting unit configured to support and rotate the substrate in the internal space; A liquid supply unit configured to supply a processing liquid to the substrate supported by the support unit, and An exhaust unit configured to exhaust a gas flow from the inner space, Wherein the supporting unit includes: A support plate configured to support the substrate; a rotation shaft configured to rotate the support plate, and An actuator coupled to the rotating shaft and configured to provide torque to the rotating shaft, Wherein the exhaust unit includes an air flow guiding tube having an inlet provided to introduce the air flow into the air flow guiding tube in a tangential direction to a rotation direction of the substrate supported on the support unit, Wherein the processing vessel comprises: an outer cup configured to provide the interior space, and An inner cup disposed in the inner space to be spaced apart from the outer cup and configured to surround the rotation shaft or the actuator, and The air flow guide tube is disposed between the outer cup and the inner cup and has an upper wall and a side wall, and the inlet is formed on the side wall.
  2. 2. The apparatus of claim 1, wherein the air flow guide pipes are provided in plurality, spaced apart from each other in a circumferential direction of the substrate supported by the support unit.
  3. 3. The apparatus of claim 1, wherein the air flow guide tube is mounted at an inner wall of the outer cup.
  4. 4. The apparatus of claim 1, wherein the length of the airflow guide tube extends vertically.
  5. 5. The apparatus of claim 1, wherein the upper wall serves as a blocking surface, and in the side wall, the inlet is provided at a wall facing in a direction parallel to a tangent line of the substrate supported by the support unit, and the remaining surface serves as a blocking surface.
  6. 6. The apparatus of claim 1, wherein the inner cup defines an exhaust space below the support plate, and the exhaust unit further comprises a separate exhaust pipe for exhausting the air flow introduced into the exhaust space to the outside of the inner space.
  7. 7. The apparatus of claim 6, wherein the exhaust unit further comprises an integrated exhaust pipe located outside the process vessel and provided with a pressure control member, and the separate exhaust pipe and the gas flow guide pipe are connected to the integrated exhaust pipe.
  8. 8. A device according to claim 3, wherein the side wall comprises: A first side adjacent to the inner surface of the outer cup; A second side surface adjacent to the substrate placed on the support unit, and A third side face in the tangential direction to the rotation direction of the substrate, and The inlet is formed at the third side.
  9. 9. The device of claim 8, wherein a distance between the second side and the rotation axis of the support unit increases as the second side is away from the inlet.
  10. 10. The apparatus of claim 1, wherein the substrate processing apparatus further comprises a liquid supply nozzle for supplying photoresist to the substrate supported by the support unit.
  11. 11. An apparatus for processing a substrate, the apparatus comprising: a processing container having an interior space; a supporting unit configured to support and rotate the substrate in the internal space; a liquid supply unit configured to supply a processing liquid to the substrate supported by the support unit, and An exhaust unit configured to exhaust the air flow in the inner space, Wherein the supporting unit includes: A support plate configured to support the substrate; a rotation shaft configured to rotate the support plate, and An actuator coupled to the rotating shaft and configured to provide torque to the rotating shaft, Wherein the exhaust unit includes: an exhaust pipe for exhausting an air flow of a first path, which is a path flowing into an exhaust space below the support plate in the internal space, to the outside of the process container through a space between an inner wall of the process container and the substrate supported on the support plate, and An air flow guiding pipe which is located in the inner space and guides the air flow to a second path which is a path in a tangential direction of a rotation direction of the substrate supported by the supporting unit, Wherein the processing vessel comprises: an outer cup configured to provide the interior space, and An inner cup disposed in the inner space to be spaced apart from the outer cup, Wherein the air flow guiding tube is arranged between the outer cup and the inner cup, and The air flow guide pipe includes an upper wall and a side wall, and an inlet formed on the side wall to introduce the air flow in a tangential direction of a rotation direction of the substrate supported by the support unit.
  12. 12. The apparatus of claim 11, wherein the exhaust unit further comprises an integrated exhaust pipe located outside the processing vessel and provided with a pressure control member, and the gas flow guide pipe is connected to the integrated exhaust pipe.
  13. 13. The apparatus of claim 12, wherein the integrated exhaust pipe comprises: An air flow introduction part through which the air flow released from the air flow guide pipe is introduced; An air flow discharge portion through which the air flow introduced into the air flow introduction portion is discharged to the outside, and A gas-liquid separator for separating the gas flow and the treatment liquid from the gas flow introduced into the gas flow introduction portion, Wherein the gas-liquid separator is disposed to protrude from a bottom surface of the gas flow introducing portion and to be spaced apart from an upper surface of the gas flow introducing portion.
  14. 14. The apparatus of claim 11, wherein the sidewall comprises: A first side adjacent to the inner surface of the outer cup; A second side surface adjacent to the substrate placed on the support unit; A third side surface between the first side surface and the second side surface, the third side surface defining a substantially flat plane oriented in a radial direction of the substrate placed on the support unit, and the inlet being formed in the third side surface.
  15. 15. The device of claim 14, wherein a distance between the second side and the rotational axis of the support unit increases as the second side moves away from the inlet.
  16. 16. An apparatus for processing a substrate, the apparatus comprising: a processing container having an interior space; a supporting unit configured to support and rotate the substrate in the internal space; a liquid supply unit configured to supply a processing liquid to the substrate supported by the support unit, and An exhaust unit configured to exhaust the air flow in the inner space, Wherein the supporting unit includes: A support plate configured to support the substrate; a rotation shaft configured to rotate the support plate, and An actuator coupled to the rotating shaft and configured to provide torque to the rotating shaft, Wherein the exhaust unit includes an air flow guiding tube having an inlet provided to introduce the air flow into the air flow guiding tube in a tangential direction to a rotation direction of the substrate supported on the support unit, Wherein the processing vessel comprises: an outer cup configured to provide the interior space, and An inner cup disposed in the inner space to be spaced apart from the outer cup and configured to surround the rotation shaft or the actuator, and Wherein the air flow guiding tube is arranged between the outer cup and the inner cup, and The air flow guide pipe has an upper wall and a plurality of side walls, and an inlet through which an air flow flows in a tangential direction of the rotation direction of the substrate is formed on a side wall of the plurality of side walls facing the tangential direction of the rotation direction of the substrate.
  17. 17. The apparatus of claim 16, wherein the exhaust unit further comprises an exhaust pipe for guiding and releasing the gas flow in a path different from the path in the tangential direction of the substrate, and the exhaust pipe is provided at a position closer to the inner cup than the gas flow guiding pipe, the exhaust pipe releasing the gas flow flowing into an exhaust space below the support plate in the inner space to the outside of the processing container through an inner wall of the processing container and a space between the substrate supported on the support plate.

Description

Apparatus for treating substrate Technical Field Embodiments of the inventive concepts described herein relate to an apparatus for processing a substrate, and more particularly, to an apparatus for processing a substrate by supplying a liquid onto a rotating substrate. Background Various processes such as a photolithography process, an etching process, an ashing process, a thin film deposition process, and a cleaning process are performed to manufacture a semiconductor device or a flat display panel. Among these processes, the photolithography process includes supplying photoresist to a semiconductor substrate to form a photoresist film on a surface of the substrate, exposing the photoresist film using a photomask, and then supplying a developing solution to selectively remove portions of the photoresist film. These processes are performed in a process chamber. Fig. 1 is a schematic view illustrating a substrate processing apparatus 1 for applying photoresist to a substrate. Referring to fig. 1, a substrate processing apparatus 1 includes a processing container 10 having an inner space, a support unit 20 for supporting a substrate W in the inner space, and a nozzle 30 for supplying a processing liquid 82 (see fig. 3) onto the substrate W placed on the support unit 20. The processing vessel 10 has an outer cup 12 and an inner cup 14. Further, a fan filter unit (not shown) for supplying a downward air flow into the inner space is provided above the process container 10, and a drain pipe 60 for discharging a process liquid and an exhaust pipe 70 for discharging an atmosphere in the process space are connected to a lower region of the inner space. When the substrate processing apparatus 1 having the structure shown in fig. 1 processes the substrate W while supplying the processing liquid onto the rotating substrate W, the gas flow on the surface of the substrate W flows from the center to the edge of the substrate W in the rotation direction of the substrate W by the centrifugal force as shown in fig. 2. Thereafter, as shown in fig. 3, the air flow flows downward after colliding with the outer cup 12, and is discharged from the inner space to the outside through the exhaust pipe 70. As the direction of the air flow changes from horizontal to vertical, the air flow collides with the outer cup 12, and a vortex is generated at the point where the air flow collides with the outer cup 12. At the point where the vortex is generated, the air flow stagnates, and thus the inner space cannot be smoothly discharged. This problem is further exacerbated as the rotational speed of the substrate W increases. When a film of the processing liquid is formed on the substrate W, the vortex and stagnant air flow at the collision point hinder the air flow over the edge area of the substrate W. Therefore, the film thickness on the edge region of the substrate W is greater than that on the central region of the substrate W. Further, contaminants such as fumes may flow back onto the substrate W due to the eddy current at the collision point, thereby contaminating the substrate W. Disclosure of Invention Embodiments of the inventive concept provide a substrate processing apparatus to improve efficiency of processing a substrate. Embodiments of the inventive concept provide a substrate processing apparatus to smoothly discharge an air flow in a processing space when a substrate is processed by supplying a processing liquid onto a rotating substrate in the processing space. Embodiments of the inventive concept provide a substrate processing apparatus for forming a liquid film having a uniform thickness over an entire area of a substrate by supplying a processing liquid onto a rotating substrate. Embodiments of the inventive concept provide a substrate processing apparatus to prevent contaminants from being re-adsorbed to a substrate when the substrate is processed by supplying a processing liquid onto a rotating substrate. The technical problems to be solved by the present inventive concept are not limited to the above-described problems, and any other technical problems not mentioned herein will be apparent to those skilled in the art to which the present inventive concept pertains from the following description. Embodiments of the inventive concept provide a substrate processing apparatus. The apparatus includes a process container having an inner space, a support unit configured to support and rotate a substrate in the inner space, a liquid supply unit configured to supply a process liquid to the substrate supported by the support unit, and an exhaust unit configured to exhaust a gas flow from the inner space, wherein the exhaust unit includes a gas flow guiding pipe having an inlet provided to introduce the gas flow into the gas flow guiding pipe in a tangential direction to a rotation direction of the substrate supported on the support unit. In one embodiment, the air flow guide pipes are provided in plurality, spaced apart from each