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CN-114539582-B - Resin sheet with support

CN114539582BCN 114539582 BCN114539582 BCN 114539582BCN-114539582-B

Abstract

The invention provides a resin sheet with a support and a cured product, which can suppress the dielectric loss tangent of the whole cured layer to be low and the halo phenomenon. The solution of the present invention is a resin sheet with a support, comprising a support and a resin sheet layer provided on the support, wherein the resin sheet layer comprises, in order from the support side, a first resin composition layer formed from a first resin composition and a second resin composition layer formed from a second resin composition having a composition different from that of the first resin composition, and the resin sheet with a support satisfies a predetermined condition.

Inventors

  • TSURUI KAZUHIKO

Assignees

  • 味之素株式会社

Dates

Publication Date
20260505
Application Date
20211110
Priority Date
20201111

Claims (20)

  1. 1. A resin sheet with a support, comprising a support and a resin sheet layer provided on the support, Wherein the resin sheet layer has, in order from the support body side: a first resin composition layer formed of a first resin composition, and A second resin composition layer formed of a second resin composition having a composition different from that of the first resin composition, All conditions of the following formulas (1), (2), (3) and (4) are satisfied when the thickness of the first resin composition layer is t 1 [ mu ] m, the thickness of the second resin composition layer is t 2 [ mu ] m, the elastic modulus of the first cured layer formed by curing the first resin composition layer at 190 ℃ for 90 minutes is y 1 GPa, the elastic modulus of the second cured layer formed by curing the second resin composition layer at 190 ℃ for 90 minutes is y 2 GPa, the dielectric loss tangent of the first cured layer is d 1 , the dielectric loss tangent of the second cured layer is d 2 , the relative dielectric constant of the first cured layer is p 1 , and the relative dielectric constant of the second cured layer is p 2 , 1≤t 1 /t 2 ≤10 ・・・(1) y 2 /y 1 ≤0.70 ・・・(2) 1<d 2 /d 1 ・・・(3) p 2 /p 1 <1 ・・・(4) The elastic modulus of the first cured layer is the elastic modulus at the measurement temperature of 23 ℃, the elastic modulus of the second cured layer is the elastic modulus at the measurement temperature of 23 ℃, The dielectric loss tangent of the first cured layer was measured at a measurement frequency of 5.8GHz and a measurement temperature of 23 ℃, and the dielectric loss tangent of the second cured layer was measured at a measurement frequency of 5.8GHz and a measurement temperature of 23 ℃, The relative permittivity of the first cured layer was measured at a measurement frequency of 5.8GHz and a measurement temperature of 23 ℃, and the relative permittivity of the second cured layer was measured at a measurement frequency of 5.8GHz and a measurement temperature of 23 ℃.
  2. 2. A resin sheet with a support, comprising a support and a resin sheet layer provided on the support, Wherein the resin sheet layer has, in order from the support body side: a first resin composition layer formed of a first resin composition, and A second resin composition layer formed of a second resin composition having a composition different from that of the first resin composition, When the thickness of the first resin composition layer is t 1 μm, the thickness of the second resin composition layer is t 2 μm, the elastic modulus of the first cured layer formed by curing the first resin composition layer at 190℃for 90 minutes is y 1 GPa, the elastic modulus of the second cured layer formed by curing the second resin composition layer at 190℃for 90 minutes is y 2 GPa, the dielectric loss tangent of the first cured layer is d 1 , and the dielectric loss tangent of the second cured layer is d 2 , Y 1 is 8.0GPa or more, And satisfies all the conditions of the following formulas (1), (2) and (3), 1≤t 1 /t 2 ≤10 ・・・(1) y 2 /y 1 ≤0.70 ・・・(2) 1<d 2 /d 1 ・・・(3) The elastic modulus of the first cured layer is the elastic modulus at the measurement temperature of 23 ℃, the elastic modulus of the second cured layer is the elastic modulus at the measurement temperature of 23 ℃, The dielectric loss tangent of the first cured layer was measured at a measurement frequency of 5.8GHz and a measurement temperature of 23 ℃, and the dielectric loss tangent of the second cured layer was measured at a measurement frequency of 5.8GHz and a measurement temperature of 23 ℃.
  3. 3. A resin sheet with a support, comprising a support and a resin sheet layer provided on the support, Wherein the resin sheet layer has, in order from the support body side: a first resin composition layer formed of a first resin composition, and A second resin composition layer formed of a second resin composition having a composition different from that of the first resin composition, When the thickness of the first resin composition layer is t 1 μm, the thickness of the second resin composition layer is t 2 μm, the elastic modulus of the first cured layer formed by curing the first resin composition layer at 190℃for 90 minutes is y 1 GPa, the elastic modulus of the second cured layer formed by curing the second resin composition layer at 190℃for 90 minutes is y 2 GPa, the dielectric loss tangent of the first cured layer is d 1 , and the dielectric loss tangent of the second cured layer is d 2 , Y 2 is 3.5GPa or less, And satisfies all the conditions of the following formulas (1), (2) and (3), 1≤t 1 /t 2 ≤10 ・・・(1) y 2 /y 1 ≤0.70 ・・・(2) 1<d 2 /d 1 ・・・(3) The elastic modulus of the first cured layer is the elastic modulus at the measurement temperature of 23 ℃, the elastic modulus of the second cured layer is the elastic modulus at the measurement temperature of 23 ℃, The dielectric loss tangent of the first cured layer was measured at a measurement frequency of 5.8GHz and a measurement temperature of 23 ℃, and the dielectric loss tangent of the second cured layer was measured at a measurement frequency of 5.8GHz and a measurement temperature of 23 ℃.
  4. 4. A resin sheet with a support, comprising a support and a resin sheet layer provided on the support, Wherein the resin sheet layer has, in order from the support body side: a first resin composition layer formed of a first resin composition, and A second resin composition layer formed of a second resin composition having a composition different from that of the first resin composition, The first resin composition contains (C) a radical polymerizable compound, All conditions of the following formulas (1), (2) and (3) are satisfied when the thickness of the first resin composition layer is t 1 [ mu ] m, the thickness of the second resin composition layer is t 2 [ mu ] m, the elastic modulus of the first cured layer formed by curing the first resin composition layer at 190 ℃ for 90 minutes is y 1 GPa, the elastic modulus of the second cured layer formed by curing the second resin composition layer at 190 ℃ for 90 minutes is y 2 GPa, the dielectric loss tangent of the first cured layer is d 1 , and the dielectric loss tangent of the second cured layer is d 2 , 1≤t 1 /t 2 ≤10 ・・・(1) y 2 /y 1 ≤0.70 ・・・(2) 1<d 2 /d 1 ・・・(3) The elastic modulus of the first cured layer is the elastic modulus at the measurement temperature of 23 ℃, the elastic modulus of the second cured layer is the elastic modulus at the measurement temperature of 23 ℃, The dielectric loss tangent of the first cured layer was measured at a measurement frequency of 5.8GHz and a measurement temperature of 23 ℃, and the dielectric loss tangent of the second cured layer was measured at a measurement frequency of 5.8GHz and a measurement temperature of 23 ℃.
  5. 5. The resin sheet with a support according to any one of claims 1 to 4, wherein the second resin composition contains (a) a thermosetting resin.
  6. 6. The resin sheet with a support according to claim 5, wherein the thermosetting resin is an epoxy resin.
  7. 7. The resin sheet with a support according to any one of claims 1 to 4, wherein the first resin composition and the second resin composition each contain (B) an inorganic filler.
  8. 8. The resin sheet with a support according to claim 7, wherein a ratio of a content of the (B) inorganic filler in the second resin composition to a content of the (B) inorganic filler in the first resin composition, that is, the second resin composition/first resin composition is 0.40 or less, The unit of the content is mass%.
  9. 9. The resin sheet with a support according to claim 7, wherein a ratio of a content of the (B) inorganic filler in the second resin composition to a content of the (B) inorganic filler in the first resin composition, that is, the second resin composition/first resin composition is 0.30 or less, The unit of the content is mass%.
  10. 10. The resin sheet with a support according to claim 7, wherein a ratio of a content of the (B) inorganic filler in the second resin composition to a content of the (B) inorganic filler in the first resin composition, that is, the second resin composition/first resin composition is 0.20 or more, The unit of the content is mass%.
  11. 11. The resin sheet with a support according to claim 7, wherein a ratio of a content of the (B) inorganic filler in the second resin composition to a content of the (B) inorganic filler in the first resin composition, that is, the second resin composition/first resin composition is 0.25 or more, The unit of the content is mass%.
  12. 12. The resin sheet with a support according to any one of claims 1 to 4, wherein the first resin composition contains (C) a radical polymerizable compound.
  13. 13. The resin sheet with a support according to any one of claims 1 to 4, wherein y 2 /y 1 is 0.25 or more in the condition of formula (2).
  14. 14. The resin sheet with a support according to any one of claims 1 to 4, wherein y 2 /y 1 is 0.28 or more in the condition of formula (2).
  15. 15. The resin sheet with a support according to any one of claims 1 to 4, wherein y 2 /y 1 is 0.45 or less in the condition of formula (2).
  16. 16. The resin sheet with a support according to any one of claims 1 to 4, wherein y 2 /y 1 is 0.40 or less in the condition of formula (2).
  17. 17. The resin sheet with a support according to any one of claims 1 to 4, wherein d 2 /d 1 is 5 or less in the condition of formula (3).
  18. 18. The resin sheet with a support according to any one of claims 1 to 4, wherein d 2 /d 1 is 4 or less in the condition of formula (3).
  19. 19. The resin sheet with a support according to any one of claims 1 to 4, wherein d 2 /d 1 is 2 or more in the condition of formula (3).
  20. 20. The resin sheet with a support according to claim 19, wherein d 2 /d 1 is 2.5 or more in the condition of formula (3).

Description

Resin sheet with support Technical Field The present invention relates to a resin sheet with a support. Further, the present invention relates to a cured product of the resin sheet layer of the support-equipped resin sheet, a printed wiring board, and a semiconductor device. Background In recent years, there has been an increasing demand for small-sized high-function electronic devices such as smartphones and tablet devices, and further enhancement of functions has been demanded for insulating materials (insulating layers) for semiconductor packages used for these small-sized electronic devices. Such an insulating layer is known to be formed by curing a resin composition (see, for example, patent document 1). In recent years, miniaturization of electronic devices has been advanced, and along with this, an insulating layer having a lower dielectric loss tangent has been demanded. However, when a material having a lower dielectric loss tangent is used, the adhesion is lowered, curing stress tends to accumulate, and the occurrence of the halo (haloing) phenomenon after the formation of the via tends to be remarkable. The halo phenomenon refers to a phenomenon in which peeling occurs between an insulating layer around a via hole and an inner layer substrate. Such a halo phenomenon may generally occur when a resin around the through hole is deteriorated, and the deteriorated portion is eroded at the time of roughening treatment. The deteriorated portion is generally observed as a color change portion. Prior art literature Patent literature Patent document 1 Japanese patent application laid-open No. 2017-008312. Disclosure of Invention Problems to be solved by the invention The invention provides a resin sheet with a support and a cured product, which can suppress the dielectric loss tangent of the whole cured layer to be low and can suppress the halo phenomenon. Means for solving the problems The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, have found that, in a resin sheet with a support having a first resin composition layer and a second resin composition layer, when the ratio of thicknesses, the ratio of elastic moduli, and the ratio of dielectric loss tangents of the respective layers are set to satisfy predetermined conditions, surprisingly, the dielectric loss tangents of the entire cured layer can be suppressed to be low, and the halo phenomenon can be suppressed, thereby completing the present invention. Namely, the present invention includes the following. [1] A resin sheet with a support, comprising a support and a resin sheet layer provided on the support, wherein the resin sheet layer comprises, in order from the support side, a first resin composition layer formed from a first resin composition and a second resin composition layer formed from a second resin composition having a composition different from that of the first resin composition, When the thickness of the first resin composition layer is t 1 (μm), the thickness of the second resin composition layer is t 2 (μm), the elastic modulus (measurement temperature 23 ℃) of the first cured layer formed by curing the first resin composition layer at 190 ℃ for 90 minutes is y 1 (GPa), the elastic modulus (measurement temperature 23 ℃) of the second cured layer formed by curing the second resin composition layer at 190 ℃ for 90 minutes is y 2 (GPa), the dielectric loss tangent (measurement frequency 5.8GHz, measurement temperature 23 ℃) of the first cured layer is d 1, and the dielectric loss tangent (measurement frequency 5.8GHz, measurement temperature 23 ℃) of the second cured layer is d 2, all conditions of the following formulas (1), (2) and (3) are satisfied, 1≤t1/t2≤10···(1) y2/y1≤0.70···(2) 1<d2/d1···(3) [2] The resin sheet with a support according to the above [1], wherein the second resin composition contains (A) a thermosetting resin; [3] the resin sheet with a support of [1] or [2], wherein the first resin composition and the second resin composition each contain (B) an inorganic filler; [4] The support-equipped resin sheet according to the above [3], wherein the ratio (second resin composition/first resin composition) of the content (mass%) of the inorganic filler (B) in the second resin composition to the content (mass%) of the inorganic filler (B) in the first resin composition is 0.30 or less; [5] The support-equipped resin sheet according to the above [3] or [4], wherein the ratio (second resin composition/first resin composition) of the content (mass%) of the inorganic filler (B) in the second resin composition to the content (mass%) of the inorganic filler (B) in the first resin composition is 0.25 or more; [6] the resin sheet with a support according to any one of the above [1] to [5], wherein the first resin composition contains (C) a radical polymerizable compound; [7] The resin sheet with a support according to any one of the above [1] to [6], wherein y 2/y1 is 0.28 or mor