CN-114551264-B - Manufacturing method of packaging element

CN114551264BCN 114551264 BCN114551264 BCN 114551264BCN-114551264-B

Abstract

The invention provides a manufacturing method of a packaging element, which comprises the steps of providing a carrier plate, a first conductive layer and a release layer, wherein the carrier plate is provided with an element area and a peripheral area, the first conductive layer and the release layer are arranged on the carrier plate, forming a second conductive layer on the release layer positioned in the element area, wherein at least one of the first conductive layer and the second conductive layer comprises a first connecting pad which is arranged in the peripheral area of the carrier plate, the second conductive layer is provided with a second connecting pad which is electrically connected with the first connecting pad through the first conductive layer, and performing a detection step to provide an input signal from one of the first connecting pad and the second connecting pad and receive an output signal from the other of the first connecting pad and the second connecting pad.

Inventors

CHEN YONGYI
HUANG GUANGQIANG
LIU YUTING
LIN YIHONG
ZHENG CHENGEN

Assignees

群创光电股份有限公司

Dates

Publication Date: 20260512
Application Date: 20201126

Claims (8)

1. A method of manufacturing a package, comprising the steps of: Providing a carrier plate, at least one first conductive layer and a release layer, wherein the carrier plate is provided with at least one element area and a peripheral area, the at least one first conductive layer and the release layer are arranged on the carrier plate, and the at least one first conductive layer is positioned between the release layer and the carrier plate; Forming a second conductive layer on the release layer, wherein at least one of the at least one first conductive layer and the second conductive layer comprises at least one first connecting pad, the at least one first connecting pad is arranged in the peripheral area of the carrier, the second conductive layer is provided with at least one second connecting pad, the at least one second connecting pad is arranged in the at least one element area of the carrier, and the at least one second connecting pad is electrically connected with the at least one first connecting pad through the at least one first conductive layer; performing a detection step to provide an input signal from one of the at least one first pad and the at least one second pad and receive an output signal from the other of the at least one first pad and the at least one second pad, and After the detecting step, the release layer, the carrier and the first conductive layer are removed, wherein the release layer and the at least one first conductive layer are removed in the same release process.
2. The method of claim 1, wherein providing the at least one first conductive layer further comprises providing at least two first conductive layers and an insulating layer disposed between the at least two first conductive layers.
3. The method of claim 1, further comprising forming a third conductive layer between the release layer and the second conductive layer.
4. The method of claim 1, further comprising forming at least one contact structure penetrating the release layer after providing the release layer, and the at least one second pad is electrically connected to the at least one first conductive layer through the at least one contact structure.
5. The method of claim 1, wherein the at least one second pad comprises a plurality of second pads, the plurality of second pads are divided into a plurality of pad groups electrically insulated from each other, and the at least one first pad comprises a plurality of first pads electrically connected to the plurality of pad groups through the at least one first conductive layer, respectively.
6. The method of claim 5, wherein the at least one first conductive layer includes a plurality of sensing lines, and one of the plurality of first pads is electrically connected to one of the plurality of pad groups through one of the plurality of sensing lines.
7. The method of claim 5, wherein the detecting step includes providing the input signal from one of the plurality of first pads and receiving the output signal and another output signal from at least two of the plurality of second pads, respectively.
8. The method of claim 1, wherein the output signal is received in a contact or non-contact manner.

Description

Manufacturing method of packaging element Technical Field The present invention relates to a method for manufacturing a package, and more particularly, to a method for manufacturing a package for inspection during manufacturing the package. Background In the packaging technology, the re-wiring layer redistribution layer can be fabricated on a large-sized substrate, and then packaged and cut to fabricate a large number of package elements at the same time. However, in the current packaging technology, there is no monitoring method capable of detecting and judging the process of the re-wiring layer or the quality of the device in real time, and it is generally required to detect whether there is a short circuit or an open circuit on the wire of the re-wiring layer after the chip is bonded on the re-wiring layer. In this way, when the circuit of the re-wiring layer detects a defect, the chip bonded on the re-wiring layer cannot be reused, resulting in waste of manufacturing cost. Disclosure of Invention According to an embodiment of the present disclosure, a method for manufacturing a package is provided. Firstly, a carrier plate, at least one first conductive layer and a release layer are provided, wherein the carrier plate is provided with at least one element area and a peripheral area, and the first conductive layer and the release layer are arranged on the carrier plate. And forming a second conductive layer on the release layer, wherein at least one of the first conductive layer and the second conductive layer comprises at least one first connecting pad which is arranged in the peripheral area of the carrier, and the second conductive layer is provided with at least one second connecting pad which is arranged in the element area of the carrier and is electrically connected with the first connecting pad through the first conductive layer. Then, a detecting step is performed to provide an input signal from one of the first pad and the second pad and to receive an output signal from the other of the first pad and the second pad. Drawings Fig. 1 is a schematic diagram illustrating a method for manufacturing a package according to some embodiments of the disclosure. Fig. 2 is a schematic diagram illustrating a method for manufacturing a package according to some embodiments of the disclosure. Fig. 3 is a schematic top view of a package device before a dicing process according to some embodiments of the present disclosure. FIG. 4 is an enlarged schematic diagram of the inspection lines and pads corresponding to the single device region in FIG. 3. Fig. 5 is a schematic diagram illustrating a method for manufacturing a package according to some embodiments of the disclosure. Fig. 6 is a schematic diagram illustrating a method for manufacturing a package according to some embodiments of the disclosure. Fig. 7 is a schematic diagram illustrating a method for manufacturing a package according to some embodiments of the disclosure. Fig. 8 is a schematic diagram illustrating a method for manufacturing a package according to some embodiments of the disclosure. Fig. 9 is a schematic diagram illustrating a method for manufacturing a package according to some embodiments of the disclosure. The reference numerals illustrate 12-carrier plate, 12 a-element region, 12 b-periphery region, 14-first conductive layer, 14a, 34 a-sense line, 14a 1-first sense line, 14a 2-second sense line, 14a 3-third sense line, 14a 4-fourth sense line, 14c, 34 c-connection pad, 16-release layer, 16v, 32 v-via, 18a, 18 b-contact structure, 20-redistribution layer, 221, 222, 223, 224-second conductive layer, 221a, 221 b-conductive pillars, 14b, 222a, 222b, 223a, 223b, 224a, 224b, 223b1, 223b2, 223b3, 223b4, 223a1, 223a2, 223a3, 223a 4-connection pad, 241, 242, 243-dielectric layer, 24 h-opening, 26-input/output terminal, 28-package element, 30-wire, 32-insulation layer, 34-third conductive layer. Detailed Description The present disclosure is described in detail below with reference to specific embodiments and the accompanying drawings, which may be simplified schematic diagrams and in which elements may not be drawn to scale in order to make the disclosure more clear and understandable. Also, the number and size of the elements in the drawings are illustrative only and are not intended to limit the scope of the present disclosure. Certain terms are used throughout the description and following claims to refer to particular components. Those skilled in the art will appreciate that electronic device manufacturers may refer to a same component by different names, and that there is no intent to distinguish between components that function identically but are not necessarily named identically. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. Further, the terms "coupled" and "electrically connected" herein include an