CN-114551314-B - Horizontal multi-silicon-wafer transfer mechanism

CN114551314BCN 114551314 BCN114551314 BCN 114551314BCN-114551314-B

Abstract

The invention discloses a horizontal multi-silicon wafer transfer mechanism which comprises a profile frame, a placement plate, a plurality of through grooves and a plurality of clamping mechanisms, wherein the placement plate is provided with the through grooves, the clamping mechanisms comprise two fixing plates, two driving devices and a plurality of clamping rods, clamping grooves are formed in the clamping rods, every two clamping rods are a group of clamping grooves which are arranged on the fixing plates and are mutually perpendicular, and the driving devices are obliquely arranged on the placement plate at a certain angle and used for driving the fixing plates to move. The invention adopts the finger-like mode to fix four corners of the silicon wafer so as to achieve the aim of clamping, simultaneously carries out correction action on the silicon wafer, furthest reduces the abrasion on the silicon wafer when contacting with the silicon wafer, causes no pollution to the silicon wafer during the grabbing and reduces the reject ratio, and one driving device can simultaneously position the positions of two clamping rods, thereby solving the problem of limited space, realizing one-time horizontal placement of a plurality of silicon wafers, simultaneously filling the upper surface and the lower surface for picking and placing, and improving the transfer efficiency and flexibility.

Inventors

LIU CUICUI
XU LIANG

Assignees

江西汉可泛半导体技术有限公司

Dates

Publication Date: 20260505
Application Date: 20220303

Claims (4)

1. The utility model provides a horizontal many silicon chip transfer mechanism which characterized in that includes: A profile frame (10); A placing plate (2) arranged on the section bar frame (10), wherein a plurality of through grooves (21) are arranged on the placing plate (2); The clamping mechanisms (3) comprise two fixing plates (31), two driving devices (32) and a plurality of clamping rods (33), clamping grooves (331) are formed in the clamping rods (33), the two fixing plates (31) are oppositely arranged, each two clamping rods (33) are arranged on the fixing plates (31) in a group, the clamping grooves (331) in the two clamping rods (33) are mutually perpendicular, and the driving devices (32) are obliquely arranged on the placing plates (2) at a certain angle and used for driving the fixing plates (31) to move; the auxiliary supporting device (4) is arranged on the placing plate (2) and used for guiding and supporting the fixed plate (31), the auxiliary supporting device (4) comprises a guide rail (41) and a moving block (42), the moving block (42) is slidably arranged on the guide rail (41), the guide rail (41) is obliquely arranged on the placing plate (2) at a certain angle, and the guide rail (41) is opposite to the placing plate (2) at an angle of 45 degrees.
2. A horizontal multi-silicon wafer transfer mechanism according to claim 1, wherein the driving means (32) is at an angle of 45 degrees relative to the placement plate (2).
3. The horizontal multi-silicon wafer transfer mechanism as set forth in claim 1 wherein one side of the stationary plate (31) has an outwardly extending protrusion (311).
4. The horizontal multi-silicon wafer transfer mechanism of claim 1, wherein a plurality of avoiding grooves (312) are formed in the fixing plate (31).

Description

Horizontal multi-silicon-wafer transfer mechanism Technical Field The invention relates to the technical field of silicon wafer production, in particular to a horizontal multi-silicon wafer transfer mechanism. Background In the application of the photovoltaic industry, the most common method at present is to adopt a mechanical arm and a sucker for grabbing, put the semi-finished coated silicon wafer into a device after overturning by the mechanical arm, and take the semi-finished coated silicon wafer out of the other surface to achieve the purpose of overturning, but the method for grabbing by the sucker is easy to pollute and leave marks on the silicon wafer, thereby influencing the processing effect of the subsequent process and also influencing the forming effect of the finished product to a certain extent. Disclosure of Invention The invention aims to solve the technical problems and provides a horizontal multi-silicon wafer transfer mechanism. The technical scheme of the invention is that the horizontal multi-silicon wafer transfer mechanism comprises: A section bar frame; The placing plate is arranged on the section bar frame and provided with a plurality of through grooves; The clamping mechanisms comprise two fixing plates, two driving devices and a plurality of clamping rods, clamping grooves are formed in the clamping rods, the two fixing plates are oppositely arranged, each two clamping rods are arranged on the fixing plates in a group, the clamping grooves on the two clamping rods are mutually perpendicular, and the driving devices are obliquely arranged at a certain angle and used for driving the fixing plates to move. Preferably, the driving device is at an angle of 45 degrees relative to the placement plate. Preferably, one side of the fixing plate is provided with a protrusion extending outwards. Preferably, the device further comprises a plurality of auxiliary supporting devices which are arranged on the placing plate and used for guiding and supporting the movement of the fixing plate. Preferably, the auxiliary supporting device comprises a guide rail and a moving block, wherein the moving block is slidably arranged on the guide rail, and the guide rail is arranged on the placing plate in an inclined manner. Preferably, the guide rail is at an angle of 45 degrees relative to the placement plate. Preferably, a plurality of avoidance grooves are formed in the fixing plate. The invention has the advantages that the four corners of the silicon wafer are fixed by adopting a finger mode of a simulation person so as to achieve the aim of clamping, simultaneously, the silicon wafer is corrected, the abrasion to the silicon wafer is reduced to the greatest extent when the silicon wafer is contacted with the silicon wafer, the silicon wafer is not polluted during the grabbing, the reject ratio is reduced, one driving device can simultaneously position the two clamping rod directions, the problem of limited space is solved, the number of used cylinders is reduced, the problems of abrasion, surface scratch, cracking and the like of the silicon wafer in the turn-over process are solved to the greatest extent in the simplest mode, a plurality of silicon wafers can be placed horizontally at one time, the upper surface and the lower surface of the silicon wafer can be simultaneously fully fetched and placed, and the transfer efficiency and the flexibility are improved. Drawings FIG. 1 is a perspective view of the overall structure of a preferred embodiment of the present invention; FIG. 2 is a front elevational view of the overall structure of the preferred embodiment of the present invention; FIG. 3 is a perspective view of the placement plate in the preferred embodiment of the present invention disposed on a profile frame; FIG. 4 is a perspective view of a clamping mechanism in a preferred embodiment of the invention; FIG. 5 is an enlarged view of a portion of FIG. 4 at A; FIG. 6 is a schematic illustration of a silicon wafer placement on a mechanism. Reference numerals are a section bar frame 10, a placing plate 2, a through groove 21, a clamping mechanism 3, a fixing plate 31, a protruding part 311, an avoiding groove 312, a driving device 32, a clamping rod 33, a clamping groove 331, an auxiliary supporting device 4, a guide rail 41 and a moving block 42. Detailed Description The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention. Referring to fig. 1 to 6, a horizontal multi-silicon wafer transfer mechanism includes: a section bar frame 10; the placing plate 2 is arranged on the