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CN-114551331-B - Bearing device and semiconductor process equipment

CN114551331BCN 114551331 BCN114551331 BCN 114551331BCN-114551331-B

Abstract

The application discloses a bearing device and semiconductor process equipment, and relates to the field of semiconductor equipment. The bearing device comprises a base, a supporting shaft, a driving mechanism and a temperature measuring mechanism, wherein the base is provided with a temperature measuring surface, one end of the supporting shaft is connected with the base, a first channel is formed in the supporting shaft, one end of the first channel is arranged corresponding to the temperature measuring surface, the driving mechanism comprises a driving assembly and a shell, the driving assembly comprises a driving structure positioned outside the shell and a driven driving structure positioned in the shell, the driving assembly and the driven driving structure are magnetically coupled, the supporting shaft is at least partially arranged in an inner cavity of the shell, the other end of the supporting shaft is connected with the driven driving structure, a light transmitting part is arranged on the shell, the light transmitting part is arranged corresponding to the other end of the first channel, and the temperature measuring mechanism is arranged outside the shell and corresponds to the light transmitting part. A semiconductor processing apparatus comprises the carrier device. The application can solve the problems of low temperature measurement precision, air pressure change in the cavity caused by movement of the supporting shaft, and the like.

Inventors

  • CUI YU

Assignees

  • 北京北方华创微电子装备有限公司
  • 北京北方华创微电子装备有限公司

Dates

Publication Date
20260421
Application Date
20220209
Priority Date
20220209

Claims (11)

  1. 1. The bearing device is applied to a process chamber of semiconductor process equipment and is characterized by comprising a base (10), a supporting shaft (20), a driving mechanism (40) and a temperature measuring mechanism (50); The base (10) is provided with a bearing surface (11) and a temperature measuring surface (12) which are arranged in opposite directions, and the bearing surface (11) is used for bearing a wafer; one end of the supporting shaft (20) is connected with the base (10), the supporting shaft (20) is provided with a first channel (211) extending along the axis direction of the supporting shaft, and one end of the first channel (211) is arranged corresponding to the temperature measuring surface (12); The driving mechanism (40) comprises a driving assembly (42) and a shell (41) used for being in sealing connection with the process chamber, the driving assembly (42) comprises a driving structure arranged outside the shell (41) and a driven driving structure arranged in an inner cavity of the shell (41), the supporting shaft (20) is at least partially arranged in the inner cavity of the shell (41), the other end of the supporting shaft (20) is connected with the driven driving structure, and the driving structure drives the driven driving structure through magnetic coupling so as to drive the supporting shaft (20) to move along the axis direction of the supporting shaft and rotate around the axis of the supporting shaft; the housing (41) is provided with a light transmission part along the extending direction of the first channel (211), and the other end of the first channel (211) is arranged corresponding to the light transmission part; the temperature measuring mechanism (50) is arranged outside the shell (41) and corresponds to the light transmission part; The driving structure comprises a rotary driving component (422), the driven driving structure comprises a first driven driving structure, the output end of the rotary driving component (422) is magnetically coupled with the first driven driving structure, and the first driven driving structure is connected with the supporting shaft (20) so as to drive the supporting shaft (20) to rotate around the axis of the supporting shaft; The rotary drive component (422) comprises a rotary drive member (4221) and a first magnetic rotary member (4222), the first driven drive structure comprising a second magnetic rotary member (4223); the rotary driving piece (4221) is in transmission connection with the first magnetic rotating piece (4222), the first magnetic rotating piece (4222) is magnetically coupled with the second magnetic rotating piece (4223), the first magnetic rotating piece (4222) is rotatably arranged outside the shell (41), and the second magnetic rotating piece (4223) is rotatably arranged in an inner cavity of the shell (41) and is connected with the supporting shaft (20).
  2. 2. The carrying device according to claim 1, wherein the active drive structure further comprises a first lift drive member (421); the first lifting driving part (421) is connected with the rotary driving part (422) to drive the rotary driving part (422) and the supporting shaft (20) to move along the axial direction of the supporting shaft (20).
  3. 3. The carrying device according to claim 2, wherein the first lifting drive part (421) comprises a first linear module (4211) and a first frame (4212), the first driven drive structure further comprising a second frame (4213); The first linear module (4211) is connected to the first frame (4212), the first frame (4212) is disposed outside the housing (41) and is movable relative to the housing (41) along the axial direction of the support shaft (20), and the first magnetic rotating member (4222) is rotatably connected to the first frame (4212); the second frame (4213) is disposed in an inner cavity of the housing (41) and is movable relative to the housing (41) along an axial direction of the support shaft (20), and the second magnetic rotating member (4223) is rotatably connected to the second frame (4213).
  4. 4. A bearing device according to claim 3, wherein the first magnetic rotating member (4222) is a magnetic gear sleeve, the rotary driving member (4221) is provided with an output gear, the output gear is in meshed connection with the magnetic gear sleeve, and two end surfaces of the magnetic gear sleeve, which are opposite to each other along the axial direction, are respectively connected with the first frame (4212) through bearings; and/or the second magnetic rotating piece (4223) is a magnetic ring sleeve, and two end faces of the magnetic ring sleeve, which are opposite to each other along the axial direction, are respectively connected with the second frame (4213) through bearings.
  5. 5. A carrying device according to claim 3, characterized in that the first lifting drive part (421) further comprises a third frame (4214), the third frame (4214) being connected to the first frame (4212); the side wall of the first frame (4212) is provided with an avoidance hole, and the avoidance hole is communicated with the inner cavity of the first frame (4212) and the inner cavity of the third frame (4214); The rotary driving member (4221) is disposed on the third frame (4214), and an output end of the rotary driving member (4221) is disposed in an inner cavity of the third frame (4214) and is in transmission connection with the first magnetic rotary member (4222) through the avoidance hole.
  6. 6. The carrier according to claim 2, further comprising a lift shaft (30) for lifting the wafer, the lift shaft (30) being at least partially disposed in an interior cavity of the housing (41); The lifting shaft (30) is provided with a second channel (311) extending along the axis direction of the lifting shaft and is sleeved on the outer side of the supporting shaft (20); The driving structure further comprises a second lifting driving component (424), the driven driving structure further comprises a second driven driving structure, the output end of the second lifting driving component (424) is magnetically coupled with the second driven driving structure, and the second driven driving structure is connected with the lifting shaft (30) to drive the lifting shaft (30) to move along the axis direction of the lifting shaft.
  7. 7. The carrier according to claim 6, wherein the second lifting drive member (424) comprises a second linear module (4241) and a first magnetic member (4242), the second linear module (4241) being connected with the first magnetic member (4242), the second driven drive structure comprising a second magnetic member (4243) magnetically coupled with the first magnetic member (4242); The first magnetic member (4242) is slidably connected to the outer wall of the housing (41), the second magnetic member (4243) is slidably connected to the inner wall of the housing (41), and the lifting shaft (30) is connected to the second magnetic member (4243).
  8. 8. The carrying device according to claim 7, wherein the drive assembly (42) further comprises a first annular support (425), the first annular support (425) being connected to the second magnetic rotating member (4223), and the first annular support (425) being sleeved at an end of the support shaft (20) facing away from the base (10); and/or, the driving assembly (42) further comprises a second annular supporting piece (426), the second annular supporting piece (426) is connected with the second magnetic piece (4243), and the second annular supporting piece (426) is sleeved at one end, deviating from the base (10), of the lifting shaft (30).
  9. 9. The carrying device according to claim 1, wherein the housing (41) comprises a sealing cylinder (411), a sealing plate (413) and an annular seal (412), the light-transmitting portion being formed on the sealing plate (413), the annular seal (412) being used for sealingly connecting the sealing plate (413) to an end of the sealing cylinder (411) facing away from the base (10).
  10. 10. The carrying device according to claim 9, wherein the temperature measuring mechanism (50) comprises a temperature measuring element (51) and a shielding case (52), one end of the shielding case (52) is connected to the annular sealing member (412), and the other end of the shielding case (52) is connected to the temperature measuring element (51) to form a shielding passage for shielding external light between the housing (41) and the temperature measuring element (51).
  11. 11. A semiconductor processing apparatus comprising a carrier device according to any one of claims 1 to 10.

Description

Bearing device and semiconductor process equipment Technical Field The application belongs to the technical field of semiconductor equipment, and particularly relates to a bearing device and semiconductor process equipment. Background The current infrared temperature measurement technology is widely applied to the temperature measurement and monitoring process of epitaxial equipment, and in the processing process of a wafer, as the wafer has a non-uniform surface with characteristic patterns on the surface for epitaxial processing, the infrared temperature measurement on the surface of the wafer cannot obtain accurate temperature, so that the temperature monitoring is basically carried out by adopting the back of a base with a more uniform test surface for supporting the wafer. In the epitaxial process, in order to ensure the uniformity of growth, the base adopts rotatable design, and along with the rotation of the base, the support structure at the bottom can interfere with the temperature measurement of the infrared pyrometer, thereby affecting the temperature measurement precision. Currently, some base support members include a base shaft and a substrate lifting member, wherein the base shaft includes a support column and a plurality of extension arms extending outward from the support column, so, at the rotatory in-process of base support member, extension arms can periodically pass through the space between the base back and the infrared pyrometer to the infrared emission on the base back causes the interference, influences the temperature measurement degree of accuracy. In addition, in the lifting process of the supporting shaft, the volume in the cavity can be changed to influence the air pressure in the cavity, so that extra load can be brought to the substrate lifting component. Disclosure of Invention The embodiment of the application aims to provide a bearing device and semiconductor process equipment, which at least can solve the problems that the temperature measurement precision is affected by the periodical blocking of infrared emission of an extension arm, extra load is brought in the lifting process of a support shaft and the like. In order to solve the technical problems, the application is realized as follows: The embodiment of the application provides a bearing device which is applied to a process chamber of semiconductor process equipment, and comprises a base, a supporting shaft, a driving mechanism and a temperature measuring mechanism; The base is provided with a bearing surface and a temperature measuring surface which are arranged in a back-to-back manner, and the bearing surface is used for bearing a wafer; one end of the supporting shaft is connected with the base, the supporting shaft is provided with a first channel extending along the axis direction of the supporting shaft, and one end of the first channel is arranged corresponding to the temperature measuring surface; the driving mechanism comprises a driving assembly and a shell body, wherein the shell body is used for being connected with the process chamber in a sealing mode, the driving assembly comprises a driving structure arranged outside the shell body and a driven driving structure arranged in an inner cavity of the shell body, the supporting shaft is at least partially arranged in the inner cavity of the shell body, the other end of the supporting shaft is connected with the driven driving structure, and the driving structure drives the driven driving structure through magnetic coupling so as to drive the supporting shaft to move along the axis direction of the supporting shaft and rotate around the axis of the supporting shaft; the shell is provided with a light transmission part along the extending direction of the first channel, and the other end of the first channel is arranged corresponding to the light transmission part; the temperature measuring mechanism is arranged outside the shell and corresponds to the light-transmitting part. The embodiment of the application also provides semiconductor process equipment which comprises the bearing device. In the embodiment of the application, the support shaft is provided with the first channel extending along the axis direction of the support shaft, one end of the first channel is correspondingly arranged with the temperature measuring surface on the back surface of the base, in order to ensure the tightness of the process chamber, the bottom of the process chamber is connected with the shell, the support shaft is at least partially arranged in the inner cavity of the shell, the shell is provided with the light transmitting part along the extending direction of the first channel, the other end of the first channel is correspondingly arranged with the light transmitting part, the temperature measuring mechanism is arranged outside the shell and is correspondingly arranged with the light transmitting part, and the light transmitting part has better light transmission to