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CN-114582789-B - Grabbing device that silicon chip production was used

CN114582789BCN 114582789 BCN114582789 BCN 114582789BCN-114582789-B

Abstract

The invention discloses a grabbing device for silicon wafer production, which comprises a connecting plate, a plurality of supports and a plurality of clamping mechanisms, wherein the supports are arranged on the connecting plate at intervals, the clamping mechanisms comprise a first driving device, two supporting pieces, a plurality of finger clamping rods and a plurality of auxiliary supporting devices, clamping grooves are formed in the finger clamping rods, the finger clamping rods are respectively arranged on two sides of the two supporting pieces, the clamping grooves in the finger clamping rods on two sides of each supporting piece are mutually perpendicular, and the first driving device is obliquely arranged on the supports and used for driving the two supporting pieces to be far away from or close to each other. The invention adopts the mode of simulating human fingers to fix four corners of the silicon wafer so as to achieve the aim of clamping, simultaneously carries out correction action on the silicon wafer, furthest reduces the abrasion on the silicon wafer when contacting with the silicon wafer, reduces the reject ratio, and has the positioning requirement on the silicon wafer when being placed far lower than that of a sucker, thus reducing the positioning difficulty and the requirement on the dimensional accuracy of mechanisms such as a tray for placing the matched silicon wafer.

Inventors

  • LIU CUICUI
  • XU LIANG

Assignees

  • 江西汉可泛半导体技术有限公司

Dates

Publication Date
20260505
Application Date
20220303

Claims (5)

  1. 1. The utility model provides a grabbing device that silicon chip production used which characterized in that includes: A first connection plate (10); a plurality of brackets (2) which are arranged on the first connecting plate (10) at intervals; The clamping mechanisms (3) are arranged on one support (2), the clamping mechanisms (3) comprise a first driving device (31), two supporting pieces (32), a plurality of finger clamping rods (33) and a plurality of auxiliary supporting devices (34), clamping grooves (331) are formed in the finger clamping rods (33), the finger clamping rods (33) are respectively arranged on two sides of the supporting pieces (32), the clamping grooves (331) in the finger clamping rods (33) on two sides of each supporting piece (32) are mutually perpendicular, the first driving device (31) is obliquely arranged on the support (2) and used for driving the two supporting pieces (32) to be far away from or close to each other, and the auxiliary supporting devices (34) are used for guiding and supporting the movement of the supporting pieces (32); The silicon wafer lifting device comprises a plurality of fixing devices (4) and a plurality of lifting devices (5), wherein the fixing devices (4) are used for fixing silicon wafers on a carrier plate, the lifting devices (5) are used for driving the fixing devices (4) to be fixed on the carrier plate or far away from the carrier plate, the fixing devices (4) comprise pins (41) and saw-tooth pressing blocks (42) made of metal materials, the saw-tooth pressing blocks (42) are arranged on the pins (41), the lifting devices (5) comprise a plurality of second driving devices (51), a plurality of connecting pieces (52), a plurality of loop bars (53) and a plurality of electromagnets (54), the second driving devices (51) are used for driving the connecting pieces (52) to move up and down, the loop bars (53) are arranged on the connecting pieces (52), and the electromagnets (54) are arranged in the loop bars (53).
  2. 2. A gripping device for silicon wafer production according to claim 1, wherein the support member (32) is provided with a first avoiding groove (321) and a second avoiding groove (322).
  3. 3. The grabbing device for silicon wafer production according to claim 1, wherein the auxiliary supporting device (34) is obliquely arranged on the support (2), the auxiliary supporting device (34) comprises a guide rail (341), two moving blocks (342) and a second connecting plate (343), the guide rail (341) is arranged on the second connecting plate (343), and the moving blocks (342) are slidably arranged on the guide rail (341).
  4. 4. The grabbing device for silicon wafer production as claimed in claim 1, wherein the pin (41) is composed of an upper locating pin (411) and a lower locating pin (412), and the upper locating pin (411) and the lower locating pin (412) are detachably connected.
  5. 5. The grabbing device for silicon wafer production as claimed in claim 1, wherein the connecting piece (52) is provided with a plurality of wire fixing clamps (521).

Description

Grabbing device that silicon chip production was used Technical Field The invention relates to the technical field of silicon wafer production, in particular to a grabbing device for silicon wafer production. Background In the application of the photovoltaic industry, the most common method is to use a sucker for grabbing during the grabbing and transferring processes of the silicon wafer, but the method is easy to pollute and leave marks on the silicon wafer, so that the processing of the subsequent process is influenced, the effect of a finished product is negatively influenced, and the function of fixing the silicon wafer after the silicon wafer is placed on a carrier plate is lacked. Disclosure of Invention The invention aims to solve the technical problems and provides a grabbing device for silicon wafer production. The technical scheme of the invention is that the grabbing device for silicon wafer production comprises: A first connection plate; the brackets are arranged on the first connecting plate at intervals; The clamping mechanism comprises a first driving device, two supporting pieces, a plurality of finger clamping rods and a plurality of auxiliary supporting devices, clamping grooves are formed in the finger clamping rods, the finger clamping rods are respectively arranged on two sides of the supporting pieces, the clamping grooves on the finger clamping rods on two sides of the supporting pieces are mutually perpendicular, the first driving device is obliquely arranged on the supporting pieces and used for driving the two supporting pieces to be far away from or close to each other, and the auxiliary supporting devices are used for guiding and supporting the movement of the supporting pieces. Preferably, the support member is provided with a first avoidance groove and a second avoidance groove. Preferably, the auxiliary supporting device is obliquely arranged on the bracket, the auxiliary supporting device comprises a guide rail, two moving blocks and a second connecting plate, the guide rail is arranged on the second connecting plate, and the moving blocks are slidably arranged on the guide rail. Preferably, the silicon wafer lifting device further comprises a plurality of fixing devices and a plurality of lifting devices, wherein the fixing devices are used for fixing the silicon wafer on the carrier plate, and the lifting devices are used for driving the fixing devices to be fixed on the carrier plate or far away from the carrier plate. Preferably, the fixing device comprises a pin made of metal material and a saw-tooth pressing block, and the saw-tooth pressing block is arranged on the pin. Preferably, the lifting device comprises a plurality of second driving devices, a plurality of connecting pieces, a plurality of loop bars and a plurality of electromagnets, wherein the second driving devices are used for driving the connecting pieces to move up and down, the loop bars are arranged on the connecting pieces, and the electromagnets are arranged in the loop bars. Preferably, the pin is composed of an upper locating pin and a lower locating pin, and the upper locating pin and the lower locating pin are detachably connected. Preferably, the connecting piece is provided with a plurality of wire fixing clamps. The invention has the advantages that the four corners of the silicon wafer are fixed by adopting a finger-like manner of a simulation person so as to achieve the purpose of clamping, simultaneously, the silicon wafer is corrected, the abrasion to the silicon wafer is reduced to the greatest extent when the silicon wafer is contacted with the silicon wafer, the silicon wafer is not polluted during the grabbing, the reject ratio is reduced, a plurality of silicon wafers can be grabbed at one time, the productivity benefit can be greatly improved, the positioning requirement for the silicon wafer during the placing is far lower than that of a sucker, and the positioning difficulty and the requirement for the dimensional accuracy of mechanisms such as a tray for placing the matched silicon wafer are reduced. Drawings FIG. 1 is a perspective view of a silicon wafer according to the present invention; FIGS. 2 and 3 are perspective views showing the connection of the bracket, the clamping mechanism, the fixing device and the lifting device in the preferred embodiment of the present invention; FIG. 4 is a perspective view of the connection of the bracket and the clamping mechanism in a preferred embodiment of the present invention; FIG. 5 is an enlarged partial view of the A of FIG. 4; FIG. 6 is a bottom view of the bracket and clamping mechanism connection in the preferred embodiment of the present invention; FIG. 7 is a perspective view of the connection of the loop bar, electromagnet, pin and saw tooth press block in the preferred embodiment of the present invention; FIG. 8 is a cross-sectional view of a pin in a preferred embodiment of the present invention; FIG. 9 is a cross-sectional vie