CN-114624827-B - Optical module

CN114624827BCN 114624827 BCN114624827 BCN 114624827BCN-114624827-B

Abstract

The application discloses an optical module, which comprises a circuit board, a tube shell component, a reflector, a light receiving chip, a light transmitting hole, a light transmitting component, an optical component and a reflector, wherein the upper surface of the circuit board is provided with a light receiving chip, the lower surface of the circuit board is provided with a bonding pad, the upper surface of the tube shell component comprises a light receiving cavity and a slot which are respectively sunken downwards, a bulge part is arranged between the light receiving cavity and the slot, the bulge part comprises a light transmitting hole for communicating the light receiving cavity and the slot, the lower surface of the tube shell component comprises an upward sunken light transmitting cavity, the other end of the light transmitting cavity is provided with a notch, the light transmitting component is positioned in the light transmitting cavity, one end of the circuit board extends into the light transmitting cavity through the notch, the bonding pad is positioned in the light transmitting cavity and is connected with the light transmitting component through a wire, the optical component is positioned in the light receiving cavity, the reflector is arranged at the slot, the light transmitting hole can reflect light from the optical component, and the light receiving chip is positioned between the reflector and the circuit board, and the tube shell component can receive light from the reflector.

Inventors

ZHANG HONGHAO
DONG BENZHENG
XIE YIFAN
LIU KAI
FU QINHAO
LI DAN
WANG TENGFEI

Assignees

青岛海信宽带多媒体技术有限公司

Dates

Publication Date: 20260508
Application Date: 20201214

Claims (9)

1. The optical module is characterized by comprising a circuit board, wherein the upper surface of the circuit board is provided with a light receiving chip, and the lower surface of the circuit board is provided with a bonding pad; The upper surface of the tube shell assembly comprises a light receiving cavity and a slot which are respectively recessed downwards, a protruding part is arranged between the light receiving cavity and the slot, and the protruding part comprises a light through hole for communicating the light receiving cavity and the slot; A first optical fiber adapter is arranged at one end of the light receiving cavity; One end of the light emitting cavity is provided with a third optical fiber adapter, and the other end of the light emitting cavity is provided with a notch; The light emitting assembly is positioned in the light emitting cavity, is arranged on the bottom surface of the light emitting cavity and can emit light to the third optical fiber adapter, and one end of the circuit board extends into the light emitting cavity through the notch; An optical assembly located in the light receiving cavity capable of receiving light from the first fiber optic adapter; a reflecting mirror disposed at the slot, capable of reflecting light from the optical component through the light-passing hole; and the light receiving chip is positioned between the reflecting mirror and the circuit board and outside the tube shell assembly and can receive light from the reflecting mirror.
2. The optical module of claim 1, further comprising a housing, wherein the package assembly further comprises a first cover plate and a third cover plate; One end of the cover body is combined with the protruding part, the other end of the cover body is combined with the circuit board, and the cover body is arranged above the slot and the light receiving chip; The first cover plate covers the light receiving cavity, and the third cover plate covers the light emitting cavity.
3. The optical module of claim 1, wherein the first fiber optic adapter and the third fiber optic adapter have different heights.
4. The optical module of claim 1, further comprising a receiving lens array and a third collimating lens; The receiving lens array is positioned on the slot and between the light passing hole and the reflecting mirror; The third collimating lens is located between the first fiber adapter and the optical assembly; the optical component is a wave-division multiplexing component, and the receiving lens array is used for respectively converging multiple beams of light output by the wave-division multiplexing component.
5. The optical module of claim 4, wherein the light receiving chip is a chip array for receiving the plurality of beams of light reflected by the mirror.
6. The optical module of claim 1, further comprising a wavelength division multiplexing assembly and an array of light emitting chips, each positioned in the light emitting cavity, the wavelength division multiplexing assembly combining multiple beams of light from the array of light emitting chips into one beam.
7. The optical module of claim 4, wherein the bottom surface of the light receiving cavity forms a DeMUX fixing glue groove with an annular protrusion, the wavelength division multiplexing component is arranged on the annular protrusion, and glue is arranged in the groove surrounded by the annular protrusion to bond the wavelength division multiplexing component.
8. The optical module of claim 6, wherein the bottom surface of the light emitting cavity forms a MUX fixing glue groove with an annular protrusion, the wavelength division multiplexing component is disposed on the annular protrusion, and glue is disposed in the groove surrounded by the annular protrusion to bond the wavelength division multiplexing component.
9. The optical module of claim 1, further comprising a thermally conductive substrate positioned on a surface of the circuit board and in the indentation, the thermally conductive substrate being capable of conducting heat between the circuit board and the package assembly.

Description

Optical module Technical Field The application relates to the technical field of optical communication, in particular to an optical module. Background With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology. In general, to increase the transmission rate of an optical module, it is possible to use an increase in the transmission channel in the optical module, such as modifying a conventional optical module including one set of light-emitting sub-modules (each of which emits light of one wavelength) and one set of light-receiving sub-modules (each of which receives light of one wavelength) to include two sets of light-emitting sub-modules (each of which emits light of one wavelength) and two sets of light-receiving sub-modules (each of which receives light of one wavelength). Therefore, the occupied volume of the light emitting sub-module and the light receiving sub-module in the optical module is continuously increased, and further the optical module is not beneficial to further development. Disclosure of Invention The application provides an optical module, which aims to solve the problems that an optical emission sub-module and an optical receiving sub-module occupy larger volume in the optical module and are not beneficial to the miniaturization development of the optical module. In order to solve the technical problems, the embodiment of the application discloses the following technical scheme: The embodiment of the application discloses an optical module, which comprises a circuit board, a tube shell component, an optical component and a light receiving chip, wherein the upper surface of the circuit board is provided with a light receiving chip, the lower surface of the light receiving chip is provided with a bonding pad, the upper surface of the tube shell component comprises a light receiving cavity and a slot which are respectively sunken downwards, a protruding part is arranged between the light receiving cavity and the slot, the protruding part comprises a light through hole for communicating the light receiving cavity and the slot, the lower surface of the tube shell component comprises an upwards sunken light emitting cavity, one end of the light receiving cavity is provided with a first optical fiber adapter, one end of the light emitting cavity is provided with a third optical fiber adapter, the other end of the light emitting cavity is provided with a notch, the light emitting component is positioned in the light emitting cavity and can transmit light to the third optical fiber adapter, one end of the circuit board extends into the light emitting cavity through the notch, the bonding pad is positioned in the light emitting cavity and is connected with the light emitting component through a wire, the optical component is positioned in the light receiving cavity and can receive light from the first optical fiber adapter, the reflector is arranged at the slot and can reflect light from the optical component through the light through hole, the light receiving cavity is positioned between the reflector and the light receiving chip and the circuit board can receive light from outside the tube shell. The light module comprises a circuit board, a light receiving chip, a shell component, a light receiving cavity, a notch and a light adapter, wherein the light receiving chip is arranged on the upper surface of the circuit board, a bonding pad is electrically connected with the light emitting component, the shell component comprises a light receiving cavity and a notch which are respectively recessed downwards, the lower surface of the shell component comprises a light emitting cavity which is recessed upwards, the circuit board stretches into a notch of the light emitting cavity, the light emitting and the light receiving are respectively arranged on the upper surface and the lower surface of the circuit board in a lamination mode, and a light through hole, the optical fiber adapter and the like are used for realizing a light passage. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application as claimed. Drawings In order to more clearly illustrate the technical solution of the present application, the drawings that are needed in the embodiments will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive eff