CN-114628152-B - Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic assembly. The multilayer electronic component includes a main body including a plurality of internal electrodes and a stacked dielectric layer interposed between the plurality of internal electrodes, and an external electrode disposed on the main body and connected to the plurality of internal electrodes. The plurality of internal electrodes includes two or more internal electrodes having different thicknesses, and a maximum thickness internal electrode having a maximum thickness and a minimum thickness internal electrode having a minimum thickness among the plurality of internal electrodes are disposed on a first outermost side and a second outermost side, respectively, which are opposite to each other in a lamination direction of the plurality of internal electrodes. The thickness of each internal electrode disposed between the maximum thickness internal electrode and the minimum thickness internal electrode is equal to or greater than the thickness of an adjacent internal electrode adjacent to the internal electrode toward the second outermost side in the lamination direction.

Inventors

• Biao Huicheng
• Tian Gaoren
• Tian Qixun
• Hong Daoxuan

Assignees

• 三星电机株式会社

Dates

Publication Date

20260508

Application Date

20210825

Priority Date

20201214

Claims (20)

1. 1. A multilayer electronic assembly comprising: a main body including a laminated dielectric layer and a plurality of internal electrodes, the dielectric layer being interposed between the plurality of internal electrodes, and An external electrode disposed on the body and connected to the plurality of internal electrodes, Wherein the plurality of internal electrodes includes two or more internal electrodes having different thicknesses, a maximum thickness internal electrode having a maximum thickness and a minimum thickness internal electrode having a minimum thickness among the plurality of internal electrodes are disposed on a first outermost side and a second outermost side, respectively, which are opposite to each other in a lamination direction of the plurality of internal electrodes, and a thickness of each internal electrode disposed between the maximum thickness internal electrode and the minimum thickness internal electrode is equal to or greater than a thickness of an adjacent internal electrode adjacent to the internal electrode toward the second outermost side in the lamination direction.
2. 2. The multilayer electronic component according to claim 1, wherein the main body includes a capacitance forming portion in which the plurality of internal electrodes are provided, and an upper cover portion and a lower cover portion provided at both ends of the capacitance forming portion in the stacking direction of the plurality of internal electrodes, respectively.
3. 3. The multilayer electronic component according to claim 1, wherein, among the plurality of internal electrodes, when a thickness of the internal electrode disposed on the first outermost side is defined as t1 and a thickness of the internal electrode disposed on the second outermost side is defined as t2, t1 and t2 satisfy t1+.2×t2.
4. 4. The multilayer electronic component of claim 2, Wherein the capacitance forming portion includes a first region including the first outermost side and a second region including the second outermost side, Wherein in the first region, a first inner electrode group is provided in which a plurality of inner electrodes having the same thickness as the inner electrodes provided on the first outermost side are laminated, and Wherein in the second region, a second inner electrode group is provided in which a plurality of inner electrodes having the same thickness as that of the inner electrodes provided on the second outermost side are laminated.
5. 5. The multilayer electronic component according to claim 4, wherein lengths of the first region and the second region in the stacking direction of the plurality of internal electrodes are the same.
6. 6. The multilayer electronic assembly of claim 4, wherein the number of internal electrodes included in the first internal electrode set is the same as the number of internal electrodes included in the second internal electrode set.
7. 7. The multilayer electronic component of claim 2, Wherein the capacitance forming portion includes three or more regions in which internal electrodes having different thicknesses are respectively disposed, and Wherein, in each of the three or more regions, the internal electrodes included in the respective regions of the capacitance forming portion have the same thickness.
8. 8. The multilayer electronic component according to claim 7, wherein the number of the internal electrodes included in each of the three or more regions of the capacitance forming portion is the same.
9. 9. The multilayer electronic component according to claim 1, wherein a separation distance in the stacking direction between the plurality of internal electrodes is constant.
10. 10. The multilayer electronic assembly of claim 1, wherein the thickness of the plurality of internal electrodes is configured to taper from the first outermost side to the second outermost side.
11. 11. The multilayer electronic component of claim 1, Wherein the external electrode includes a first external electrode and a second external electrode respectively provided on both end surfaces of the main body in a first direction different from the lamination direction, and Wherein the plurality of internal electrodes includes first and second internal electrodes connected to the first and second external electrodes, respectively.
12. 12. The multilayer electronic assembly of claim 11, wherein the first outer electrode and the second inner electrode are disposed spaced apart from each other in the first direction, the second outer electrode and the first inner electrode are disposed spaced apart from each other in the first direction, and the first outer electrode is spaced apart from the second inner electrode by the same distance as the second outer electrode is spaced apart from the first inner electrode.
13. 13. A multilayer electronic assembly comprising: a body including a plurality of internal electrodes and a laminated dielectric layer interposed between the plurality of internal electrodes, Wherein the plurality of internal electrodes include a maximum thickness internal electrode having a maximum thickness provided at a first outermost side and a minimum thickness internal electrode having a minimum thickness provided at a second outermost side, the first outermost side and the second outermost side being opposite to each other in a lamination direction of the plurality of internal electrodes, and the plurality of internal electrodes are arranged such that a thickness of each of the plurality of internal electrodes gradually decreases from the first outermost side to the second outermost side.
14. 14. The multilayer electronic component according to claim 13, wherein the main body includes a capacitance forming portion in which the plurality of internal electrodes are provided, and an upper cover portion and a lower cover portion provided at both ends of the capacitance forming portion in the stacking direction of the plurality of internal electrodes, respectively.
15. 15. The multilayer electronic component of claim 13, wherein the thickness value t1 of the maximum thickness internal electrode and the thickness value t2 of the minimum thickness internal electrode satisfy t1≤2×t2.
16. 16. The multilayer electronic assembly of claim 14, Wherein the capacitance forming portion includes a first region including the first outermost side and a second region including the second outermost side, Wherein in the first region, a first inner electrode group is provided in which a plurality of inner electrodes having the same thickness as the inner electrodes provided on the first outermost side are laminated, and Wherein in the second region, a second inner electrode group is provided in which a plurality of inner electrodes having the same thickness as that of the inner electrodes provided on the second outermost side are laminated.
17. 17. The multilayer electronic component of claim 16, wherein the first region and the second region are the same length in the stacking direction of the plurality of internal electrodes.
18. 18. The multilayer electronic assembly of claim 16, wherein the number of internal electrodes included in the first internal electrode set is the same as the number of internal electrodes included in the second internal electrode set.
19. 19. The multilayer electronic assembly of claim 14, Wherein the capacitance forming portion includes three or more regions in which internal electrodes having different thicknesses are respectively disposed, and Wherein, in each of the three or more regions, the thickness of the internal electrode included in the corresponding region of the capacitance forming portion is the same and different from the thickness of the internal electrode in the remaining region of the three or more regions.
20. 20. The multilayer electronic component of claim 19, wherein the number of the internal electrodes included in each of the three or more regions of the capacitance forming portion is the same.

Description

Multilayer electronic component The present application claims the benefit of priority of korean patent application No. 10-2020-0174343 filed in the korean intellectual property office on 12 months 14 of 2020, the disclosure of which is incorporated herein by reference in its entirety. Technical Field The present disclosure relates to a multilayer electronic assembly. Background A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, may be a chip capacitor mounted on a printed circuit board of various types of electronic products such as an image display device including a Liquid Crystal Display (LCD) and a Plasma Display Panel (PDP), a computer, a smart phone, a mobile phone, etc., and may be charged or discharged. Such a multilayer ceramic capacitor can be used as a component of various electronic devices because it can have a small size and high capacitance and can be easily mounted. As components of electronic devices have been designed to have reduced sizes, demands for miniaturization and high capacitance of multilayer ceramic capacitors have increased. As a multilayer ceramic capacitor having high capacitance with an increased number of stacked internal electrodes has been developed, imbalance in interlayer current density of the internal electrodes disposed in the capacitor may increase. In other words, as the deviation of the electrical path increases according to the distance between the mounting board and the internal electrode, imbalance in current density (current is concentrated in the internal electrode disposed adjacent to the mounting board) may occur, which may become a factor that deteriorates the product reliability of the multilayer ceramic capacitor. Accordingly, with the technical demand for miniaturization and high capacitance of the multilayer ceramic capacitor, a technique for reducing imbalance in current density occurring between the internal electrodes disposed at different distances from the mounting board may be required. Disclosure of Invention An aspect of the present disclosure is to provide a multi-layered electronic component that can reduce imbalance in current density between internal electrodes disposed at different distances from a mounting board. According to one aspect of the present disclosure, a multilayer electronic assembly includes a body including a plurality of internal electrodes and a stacked dielectric layer interposed between the plurality of internal electrodes, and an external electrode disposed on the body and connected to the plurality of internal electrodes. The plurality of internal electrodes may include two or more internal electrodes having different thicknesses. The maximum thickness internal electrode having the maximum thickness and the minimum thickness internal electrode having the minimum thickness among the plurality of internal electrodes are disposed at a first outermost side and a second outermost side, respectively, which are opposite to each other in a lamination direction of the plurality of internal electrodes. The thickness of each internal electrode disposed between the thickest internal electrode and the minimum thickness internal electrode is equal to or greater than the thickness of an adjacent internal electrode adjacent to the internal electrode toward the second outermost side in the lamination direction. According to another aspect of the present disclosure, a multilayer electronic assembly includes a body including a plurality of internal electrodes and a stacked dielectric layer interposed between the plurality of internal electrodes. The plurality of internal electrodes includes a maximum thickness internal electrode having a maximum thickness disposed at a first outermost side and a minimum thickness internal electrode having a minimum thickness disposed at a second outermost side, the first outermost side and the second outermost side being opposite to each other in a lamination direction of the plurality of internal electrodes. The plurality of internal electrodes are arranged such that a thickness of each of the plurality of internal electrodes gradually decreases from the first outermost side to the second outermost side. According to yet another aspect of the present disclosure, a multilayer electronic assembly includes a body including a plurality of internal electrodes and a stacked dielectric layer interposed between the plurality of internal electrodes. The plurality of internal electrodes include a maximum thickness internal electrode having a maximum thickness disposed at an outermost side of a bottom portion and a minimum thickness internal electrode having a minimum thickness disposed at an outermost side of a top portion, the outermost side of the top portion and the outermost side of the bottom portion being opposite to each other in a stacking direction of the plurality of internal electrodes. The plurality of internal electrodes are arranged such that a thickness of each of th