CN-114643516-B - Grinding device and method for driving grinding device

CN114643516BCN 114643516 BCN114643516 BCN 114643516BCN-114643516-B

Abstract

The invention provides a grinding device and a driving method of the grinding device, which can prevent grinding of a processed object attached with unsuitable bands. Based on the measurement by the measuring means, the thickness value of the workpiece means after being carried out from the cassette and before being carried into the chuck table is grasped. Here, the thickness value of the workpiece unit is a value obtained by adding the respective thickness values of the workpiece and the tape attached to the workpiece. Therefore, based on this measurement, it can be determined whether or not the tape attached to the work has a desired thickness, that is, whether or not it is of a desired type. In other words, it is possible to determine whether or not the workpiece unit is a grinding target before being carried into the chuck table. As a result, grinding of the work to which the unsuitable tape is attached can be prevented.

Inventors

Guan Jiayima

Assignees

株式会社迪思科

Dates

Publication Date: 20260505
Application Date: 20211213
Priority Date: 20201221

Claims (8)

1.A grinding device, wherein, The grinding device comprises: a cassette mounting table for mounting a cassette that houses a workpiece unit having a tape attached to one surface of a workpiece; a chuck table for holding the workpiece unit; A conveying mechanism for conveying the workpiece unit between the cassette and the chuck table; A first measurement unit configured to measure a value of a thickness of the workpiece held by the conveying mechanism or a value used for calculation of the value of the thickness of the workpiece, the value of the thickness of the workpiece being a value obtained by adding values of respective thicknesses of the workpiece and a tape attached to the workpiece; a grinding unit for grinding the workpiece unit held by the chuck table, and A control unit for controlling each of the constituent elements, The control unit has a determination unit that determines whether or not the workpiece unit is a grinding target based on a value of a thickness of the workpiece unit obtained based on a measurement by the first measurement unit of the workpiece unit after being carried out from the cassette and before being carried into the chuck table.
2. The grinding apparatus of claim 1, wherein, The control unit has a storage section for storing values of respective thicknesses of the workpiece and the belt, The determination unit compares a value obtained by adding the respective thickness values of the object to be processed and the tape stored in the storage unit with a value of the thickness of the object to be processed unit obtained based on the measurement performed by the first measurement unit, and determines whether or not a desired tape is attached to the object to be processed.
3. The grinding apparatus of claim 1, wherein, The first measurement unit has: A first non-contact distance measuring device provided on one surface side of the object unit held by the conveying mechanism and measuring a distance to one surface of the object unit, and And a second noncontact distance measuring device provided on the other surface side of the rear surface of the workpiece unit held by the conveying mechanism, the second noncontact distance measuring device measuring a distance from the other surface of the workpiece unit.
4. The grinding apparatus according to claim 2, wherein, The first measurement unit has: A first non-contact distance measuring device provided on one surface side of the object unit held by the conveying mechanism and measuring a distance to one surface of the object unit, and And a second noncontact distance measuring device provided on the other surface side of the rear surface of the workpiece unit held by the conveying mechanism, the second noncontact distance measuring device measuring a distance from the other surface of the workpiece unit.
5. The grinding apparatus according to any one of claims 1 to 4, wherein, The grinding apparatus further has a second measuring unit for measuring a value of the thickness of the workpiece unit held by the chuck table or a value used in calculation of the value of the thickness of the workpiece unit, The determination unit compares a value of the thickness of the workpiece unit obtained based on the measurement performed by the second measurement unit with a value of the thickness of the workpiece unit obtained based on the measurement performed by the first measurement unit, and determines whether the second measurement unit operates normally.
6. A method for driving a grinding device, which comprises the steps of, The grinding device comprises: a cassette mounting table for mounting a cassette that houses a workpiece unit having a tape attached to one surface of a workpiece; a chuck table for holding the workpiece unit; A conveying mechanism for conveying the workpiece unit between the cassette and the chuck table; A first measurement unit configured to measure a value of a thickness of the workpiece unit held by the conveying mechanism or a value used for calculation of the value of the thickness of the workpiece unit; a grinding unit for grinding the workpiece unit held by the chuck table, and A control unit for controlling each of the constituent elements, The driving method of the grinding device comprises the following steps: A first carrying-out step in which the carrying mechanism carries out the workpiece unit from the cassette placed on the cassette placement stage; A first measurement step of measuring a value of the thickness of the workpiece unit carried out from the cassette by the first carrying-out step or a value used for calculation of the thickness of the workpiece unit, the value of the thickness of the workpiece unit being a value obtained by adding values of respective thicknesses of the workpiece and a tape attached to the workpiece; a first determination step of determining whether the workpiece unit is a grinding target based on a value of the thickness of the workpiece unit obtained based on the measurement in the first measurement step, and And a carrying-in step of carrying the workpiece unit onto the chuck table when the workpiece unit is determined to be a grinding target in the first determination step, and carrying the workpiece unit into the cassette again when the workpiece unit is determined to not be a grinding target in the first determination step.
7. The method for driving a grinding apparatus according to claim 6, wherein, The grinding apparatus further has a second measuring unit for measuring a value of the thickness of the workpiece unit held by the chuck table or a value used in calculation of the value of the thickness of the workpiece unit, The driving method of the grinding device comprises the following steps: A grinding step of grinding the workpiece unit carried onto the chuck table by the carrying-in step; a second measuring step of measuring a value of the thickness of the workpiece unit ground by the grinding step or a value used in calculation of the value of the thickness of the workpiece unit; a second carrying-out step of carrying out the workpiece unit, the thickness of which has been measured by the second measuring step, from the chuck table by the carrying mechanism; a third measuring step of measuring a value of the thickness of the workpiece unit or a value used for calculation of the thickness of the workpiece unit carried out from the chuck table by the second carrying-out step, and And a second determination step of comparing a value of the thickness of the object unit to be processed obtained based on the measurement of the second measurement step with a value of the thickness of the object unit to be processed obtained based on the measurement of the third measurement step, thereby determining whether or not the second measurement unit is operating normally.
8. The method for driving a grinding apparatus according to claim 6, wherein, The grinding apparatus further has a second measuring unit for measuring a value of the thickness of the workpiece unit held by the chuck table or a value used in calculation of the value of the thickness of the workpiece unit, The driving method of the grinding device comprises the following steps: A second measuring step of measuring a value of a thickness of the workpiece unit or a value used for calculation of the value of the thickness of the workpiece unit before grinding the workpiece unit carried onto the chuck table by the carrying-in step, and And a second determination step of comparing a value of the thickness of the object unit to be processed obtained based on the measurement of the second measurement step with a value of the thickness of the object unit to be processed obtained based on the measurement of the first measurement step, thereby determining whether the second measurement unit operates normally.

Description

Grinding device and method for driving grinding device Technical Field The present invention relates to a grinding apparatus and a driving method of the grinding apparatus. Background Chips of devices such as ICs (INTEGRATED CIRCUIT, integrated circuits) and LSIs (LARGE SCALE Integration) are indispensable components in various electronic devices such as mobile phones and personal computers. Such a chip is manufactured, for example, by thinning a wafer having a large number of devices formed on the front surface and dividing the wafer into regions including the devices. As a method for thinning a wafer, for example, grinding is performed by a grinding device having a grinding wheel with a plurality of grinding tools arranged in a ring-like manner, and a chuck table for sucking and holding a workpiece. When the wafer is thinned by such a grinding device, a tape (protective tape) is often attached to the front surface of the wafer before grinding (for example, see patent literature 1). In a state where the chuck table attracts and holds the front surface side of the wafer to which the tape is attached, the rear surface side of the wafer is ground by a plurality of grinding tools, and the wafer is thinned. By attaching the tape to the front surface of the wafer on which the devices are formed in this manner, the impact applied to the devices can be relaxed and breakage of the devices can be prevented when grinding the wafer. Patent document 1 Japanese patent laid-open No. 2007-288031 The tape varies in thickness, adhesive strength, and the like according to the kind. Therefore, the tape attached to the workpiece such as a wafer is used in a different manner depending on the grinding conditions and the like. In the grinding apparatus, a workpiece (workpiece unit) to which a desired belt is attached is conveyed from a cassette accommodating the workpiece unit to a chuck table for grinding. Here, the tape is attached to the workpiece using a dedicated device, but replacement or replenishment of the tape as a consumable is performed manually by an operator. Therefore, there is a concern that the tape is attached to the work in a state where the tape unsuitable for the apparatus is set. In addition, the storage of the workpiece unit in the cassette and/or the loading of the cassette storing the workpiece unit into the grinding apparatus may be performed manually by an operator. Therefore, there is a concern that the cassette accommodating the work object to which the unsuitable tape is attached is carried into the grinding apparatus. In addition, even with different kinds of bands, their colors and touch feeling are mostly similar. Therefore, before the grinding device grinds the workpiece, it is difficult for the operator to confirm the type of the belt by observing or touching the belt attached to the workpiece. Disclosure of Invention In view of these aspects, an object of the present invention is to provide a grinding apparatus capable of preventing grinding of a work piece to which an unsuitable tape is attached. According to one embodiment of the present invention, there is provided a grinding apparatus including a cassette mounting table for mounting a cassette for mounting a workpiece unit having a tape attached to one surface of a workpiece, a chuck table for holding the workpiece unit, a conveying mechanism for conveying the workpiece unit between the cassette and the chuck table, a first measuring unit for measuring a value of a thickness of the workpiece unit held by the conveying mechanism or a value used for calculation of a value of a thickness of the workpiece unit, a grinding unit for grinding the workpiece unit held by the chuck table, and a control unit for controlling each component, the control unit including a judging unit for judging whether the workpiece unit is a grinding target or not based on a value of the thickness of the workpiece unit obtained based on measurement performed by the workpiece unit after being carried out from the cassette and before being carried into the chuck table. In one aspect of the present invention, the control unit preferably includes a storage unit for storing values of respective thicknesses of the workpiece and the belt, and the determination unit compares a value obtained by adding the values of the respective thicknesses of the workpiece and the belt stored in the storage unit with a value of the thickness of the workpiece unit obtained based on the measurement performed by the first measurement unit, thereby determining whether or not a desired belt is attached to the workpiece. In one embodiment of the present invention, the first measuring means preferably includes a first non-contact distance measuring device provided on one surface side of the workpiece unit held by the conveying means and measuring a distance from the one surface of the workpiece unit, and a second non-contact distance measuring device provided on the other surface side of the back s