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CN-114664713-B - Buffer memory system and method for automatically feeding battery pieces to large carrier plate

CN114664713BCN 114664713 BCN114664713 BCN 114664713BCN-114664713-B

Abstract

The invention discloses a buffer system and a buffer method for automatically feeding battery pieces to a large carrier plate, and relates to the technical field of silicon wafer production equipment, wherein the buffer system comprises a buffer surface changing transfer table, a grabbing device arranged on one side of the buffer surface changing transfer table, the large carrier plate and the small carrier plate; the grabbing device can grab the silicon wafer on the large carrier plate and transfer the silicon wafer to the buffer surface replacing middle rotary table, and can grab the silicon wafer on the small carrier plate and transfer the silicon wafer to the large carrier plate. The invention has the beneficial effects that the silicon wafer can be cached by adding the turntable in the cache surface changing process, the grabbing device can carry out the next action, the silicon wafer is placed under the turntable in the cache surface changing process from the upper side through the grabbing device, the silicon wafer can be grabbed from the lower side of the turntable in the cache surface changing process through the other grabbing device, and the silicon wafer turnover can be completed.

Inventors

  • LIU CUICUI
  • WANG XIANGYUAN

Assignees

  • 江西汉可泛半导体技术有限公司

Dates

Publication Date
20260512
Application Date
20220303

Claims (8)

  1. 1. A buffer storage system for automatically feeding battery pieces to a large carrier plate is characterized in that, The device comprises a buffer surface changing transfer table (1), wherein a grabbing device (2), a large carrier plate (3) and a small carrier plate (4) are arranged on one side of the buffer surface changing transfer table (1); the buffer memory surface changing transfer table (1), the large carrier plate (3) and the small carrier plate (4) are provided with placing grooves for loading silicon wafers (5); The grabbing device (2) can grab the silicon wafer (5) in the placing groove of the large carrier plate (3) and transfer the silicon wafer into the placing groove on the buffer conversion surface transfer table (1), and the grabbing device (2) can grab the silicon wafer (5) in the placing groove of the small carrier plate (4) and transfer the silicon wafer into the placing groove on the large carrier plate (3); the buffer memory surface changing transfer table (1) comprises: A placing plate (12), wherein a plurality of through grooves (121) are formed in the placing plate (12); The silicon wafer clamping device comprises a plurality of first clamping mechanisms (13), wherein each first clamping mechanism (13) comprises two fixing plates (131) which are oppositely arranged and two driving devices (132), a plurality of groups of clamping rods (133) are arranged on each fixing plate (131), the number of each group of clamping rods (133) is two, the two clamping rods (133) are respectively positioned on two adjacent side walls of the fixing plates (131), one group of clamping rods (133) on each fixing plate (131) and one group of clamping rods (133) on the other fixing plate (131) which are oppositely arranged are arranged in a diagonal manner, each clamping rod (133) is provided with a first clamping groove (1331) for clamping a silicon wafer (5), and each driving device (132) is arranged on the placing plate (12) and is used for driving the fixing plate (131) to move in the horizontal direction; The buffer memory surface changing transfer table (1) further comprises: The first auxiliary supporting devices (14) are used for guiding and supporting the fixed plate (131), the first auxiliary supporting devices (14) are arranged on the placing plate (12), the first auxiliary supporting devices (14) comprise first guide rails (141) and first moving blocks (142), the first moving blocks (142) are slidably arranged on the first guide rails (141), and the first guide rails (141) are arranged on the placing plate (12) and are parallel to the driving devices (132).
  2. 2. The automatic battery piece feeding and large-carrier plate caching system according to claim 1, wherein the grabbing device (2) is arranged between the cache surface changing transfer table (1) and the large carrier plate (3), and the small carrier plate (4) is arranged between the cache surface changing transfer table (1) and the grabbing device (2); The placing grooves on the large carrier plate (3) are arranged towards the cache surface-changing transfer table (1), and the placing grooves on the cache surface-changing transfer table (1) and the small carrier plate (4) are all arranged upwards along the vertical direction.
  3. 3. An automated battery sheet loading to large carrier buffer system according to claim 1, wherein the gripping device (2) comprises: The utility model provides a plurality of second fixture (23), second fixture (23) include first drive arrangement (231) and two support piece (232) that set up relatively, support piece (232) are close to be provided with a plurality of groups finger clamp pole (233) on the lateral wall of buffer memory trade face transfer table (1) one side, every group finger clamp pole (233) quantity is two and two finger clamp pole (233) are located respectively on two adjacent lateral walls of support piece (232), a set of finger clamp pole (233) on support piece (232) are the diagonal setting with a set of finger clamp pole (233) on another support piece (232) of relative setting, be provided with on finger clamp pole (233) and be used for centre gripping silicon chip (5) second draw-in groove (2331), first drive arrangement (231) set up and are used for driving two on support (22) support piece (232) keep away from or are close to.
  4. 4. An automated battery sheet loading to large carrier buffer system according to claim 3, wherein the gripping device (2) further comprises: The second auxiliary supporting devices (234) are used for guiding and supporting the movement of the supporting piece (232), the second auxiliary supporting devices (234) comprise a second guide rail (2341), two second moving blocks (2342) and a connecting plate (2343), the second guide rail (2341) is arranged on the connecting plate (2343), and the second moving blocks (2342) are slidably arranged on the second guide rail (2341).
  5. 5. An automated battery sheet loading to large carrier buffer system according to claim 4, wherein the gripping device (2) further comprises: The fixing device (24) is used for fixing the silicon wafer (5) on the large carrier plate (3), the fixing device (24) comprises a pin (241) made of metal and a saw-tooth pressing block (242), and the saw-tooth pressing block (242) is arranged on the pin (241), wherein the large carrier plate (3) is provided with a pin hole matched with the pin (241), and a magnet is arranged in the pin hole; The lifting device comprises a plurality of lifting devices (25) used for driving the fixing devices (24) to be close to or far away from the large carrier plate (3), each lifting device (25) comprises a second driving device (251), a connecting piece (252), a sleeve rod (253) and an electromagnet (254), each second driving device (251) is used for driving the connecting piece (252) to move up and down, each sleeve rod (253) is arranged on the corresponding connecting piece (252), each electromagnet (254) is arranged in each sleeve rod (253), the upper end of each pin (241) is arranged in each sleeve rod (253), and each electromagnet (254) can attract each pin (241) after being electrified.
  6. 6. The buffer storage method for automatically feeding battery pieces to a large carrier plate, which uses the buffer storage system as claimed in claim 1, is characterized by comprising the following steps: s1, conveying a large carrier plate (3) loaded with a silicon wafer (5) to a grabbing position of a grabbing device (2) through a conveying device; S2, starting a grabbing device (2), grabbing a silicon wafer (5) in a placing groove of the large carrier plate (3) through the grabbing device (2), and transferring the grabbed silicon wafer (5) into the placing groove on the cache surface-changing and surface-storing transfer table (1); s3, conveying the small carrier plate (4) loaded with the silicon wafer (5) to a grabbing position of the grabbing device (2) through a conveyor; s4, starting the grabbing device (2), grabbing the silicon wafer (5) in the placing groove of the small carrier plate (4) through the grabbing device (2), and transferring the grabbed silicon wafer (5) into the placing groove on the large carrier plate (3).
  7. 7. The method for automatically loading the battery slices into the large carrier plate according to claim 6, wherein in the step S4, the grabbing device (2) can place and fix the grabbed silicon slices (5) in the placing groove on the large carrier plate (3).
  8. 8. The method for automatically feeding the battery pieces to the large carrier plate according to claim 7, wherein in the step S4, the silicon wafer (5) can be clamped by the second clamping mechanism (23) on the grabbing device (2) and placed in the placing groove on the large carrier plate (3), the lifting device (25) on the grabbing device (2) can drive the fixing device (24) to be close to the large carrier plate (3), the pin (241) on the fixing device (24) can be adsorbed by the magnet on the large carrier plate (3), the side edge of the saw-tooth pressing block (242) arranged on the pin (241) can be contacted with the silicon wafer (5) on the large carrier plate (3), and the silicon wafer (5) can be fixed on the large carrier plate (3).

Description

Buffer memory system and method for automatically feeding battery pieces to large carrier plate Technical Field The invention relates to the technical field of silicon wafer production equipment, in particular to a buffer memory system and a buffer memory method for automatically feeding battery slices to a large carrier plate. Background The monocrystalline silicon heterojunction solar silicon wafer has high conversion efficiency, and is recognized as one of the key technologies of the next generation large-scale industrialization by the photovoltaic industry. One of the core devices of amorphous silicon thin film plating CVD devices for producing heterojunction silicon wafers is a vertical HWCVD (hot wire chemical vapor deposition) device. In addition, when the silicon wafer is plated with one surface, the silicon wafer needs to be turned over when the silicon wafer is replaced to another surface to be plated on another device, the process is difficult to complete, and the feeding beat is slow. Disclosure of Invention The invention aims to at least solve one of the technical problems in the prior art and provides a buffer memory system and a buffer memory method for automatically feeding battery slices to a large carrier plate. The technical scheme of the invention is as follows: the invention provides a buffer system for automatically feeding battery pieces to a large carrier plate, which comprises a buffer surface changing middle rotary table, wherein a grabbing device, the large carrier plate and a small carrier plate are arranged on one side of the buffer surface changing middle rotary table; The buffer memory surface-changing middle rotary table, the large carrier plate and the small carrier plate are provided with placing grooves for loading silicon wafers; the grabbing device can grab the silicon wafer in the large carrier plate placing groove and transfer the silicon wafer into the placing groove on the turntable in the buffer memory surface change, and the grabbing device can grab the silicon wafer in the small carrier plate placing groove and transfer the silicon wafer into the placing groove on the large carrier plate. In a specific embodiment of the invention, the grabbing device is arranged between the buffer memory surface replacing turntable and the large carrier plate, and the small carrier plate is arranged between the buffer memory surface replacing turntable and the grabbing device; the standing groove on the big carrier plate is arranged towards the buffer memory surface changing transfer table, and the standing grooves on the buffer memory surface changing transfer table and the small carrier plate are all arranged upwards along the vertical direction. In a specific embodiment of the present invention, the cache surface changing transfer platform includes: the placing plate is provided with a plurality of through grooves; The first clamping mechanism comprises two fixed plates which are oppositely arranged and two driving devices, a plurality of groups of clamping rods are arranged on the fixed plates, each group of clamping rods are two in number and two in number, the clamping rods are respectively located on two adjacent side walls of the fixed plates, one group of clamping rods on the fixed plates and one group of clamping rods on the other fixed plate which are oppositely arranged are arranged in a diagonal mode, the clamping rods are provided with first clamping grooves for clamping silicon wafers, and the driving devices are arranged on the placing plates and used for driving the fixed plates to move along the horizontal direction. In a specific embodiment of the present invention, the cache surface changing turntable further includes: the first auxiliary supporting devices are used for guiding and supporting the fixed plate, the first auxiliary supporting devices are arranged on the placing plate and comprise first guide rails and first moving blocks, the first moving blocks are slidably arranged on the first guide rails, and the first guide rails are arranged on the placing plate and are parallel to the driving devices. In one embodiment of the present invention, the gripping device includes: The second clamping mechanisms comprise a first driving device and two supporting pieces which are oppositely arranged, a plurality of groups of finger clamping rods are arranged on the side wall, close to one side of the buffer storage surface changing transfer table, of each supporting piece, the number of the finger clamping rods is two, the two finger clamping rods are respectively located on two adjacent side walls of the supporting pieces, a group of finger clamping rods on the supporting pieces and a group of finger clamping rods on another supporting piece which are oppositely arranged are arranged in a diagonal mode, a second clamping groove used for clamping a silicon wafer is formed in each finger clamping rod, and the first driving device is arranged on the support and used f