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CN-114743923-B - Wafer carrying disc and semiconductor process equipment

CN114743923BCN 114743923 BCN114743923 BCN 114743923BCN-114743923-B

Abstract

The invention provides a wafer bearing disc, which comprises a wafer tray, a lifting assembly, a bearing ring and a plurality of fingers, wherein the wafer tray is used for bearing wafers, the bearing ring is arranged around the wafer tray, the fingers are arranged on the bearing ring, the fingers are provided with supporting parts and limiting parts fixedly arranged on the supporting parts, the lifting assembly is used for driving the bearing ring to lift the plurality of fingers or driving the bearing ring to move the plurality of fingers to descend, the limiting parts are provided with guide inclined planes facing the inner sides, the diameter of a reference circle defined by the inner sides of the limiting parts is larger than the diameter of a reference circle defined by the inner sides of the supporting parts, and the limiting parts are used for guiding and limiting the wafers. In the invention, the limiting parts are fixedly arranged on the supporting parts of the plurality of fingers of the wafer bearing disc, and the limiting parts can guide and limit the wafer from the periphery of the wafer, thereby ensuring the heating uniformity of the wafer and improving the safety of the semiconductor process. The invention also provides semiconductor process equipment.

Inventors

  • HAN WEIPENG
  • HUANG QIWEI
  • GUO HONGRUI
  • LIU HAOWEN

Assignees

  • 北京北方华创微电子装备有限公司

Dates

Publication Date
20260512
Application Date
20220507

Claims (10)

  1. 1. The wafer carrying disc is characterized by comprising a wafer carrying disc, a lifting assembly, a carrying ring and a plurality of fingers, wherein the wafer carrying disc is used for carrying a wafer and heating the wafer, the carrying ring is arranged around the wafer carrying disc, the fingers are arranged on the carrying ring and are arranged at intervals along the circumferential direction of the carrying ring, the fingers are provided with supporting parts and limiting parts fixedly arranged on the supporting parts, the lifting assembly is used for driving the carrying ring to drive the fingers to lift, so that the supporting parts of the fingers can drive the wafer on the wafer carrying disc to lift, or the carrying ring is driven to drive the fingers to descend, so that the wafer is placed on the wafer carrying disc, the limiting parts are provided with inward oriented guide inclined planes, the pitch diameters defined by the inner sides of the limiting parts are larger than those defined by the inner sides of the supporting parts, and the limiting parts are used for guiding and limiting the wafer; a temperature measurement fixing hole is formed in the limiting part, and a first temperature measurement sensor is arranged in the temperature measurement fixing hole; A second temperature measuring sensor is arranged at the top of the supporting part; The first temperature sensor and the second temperature sensor monitor the temperature of the central area and the edge area of the wafer respectively.
  2. 2. The wafer carrier of claim 1, wherein the guiding ramp comprises a first guiding section, a second guiding section and a third guiding section distributed sequentially from top to bottom, the second guiding section is a plane and has an included angle of 110 ° -120 ° with a horizontal plane, the first guiding section and the third guiding section are curved surfaces, the first guiding section is in transitional connection between the top surface of the limiting portion and the second guiding section, and the third guiding section is in transitional connection between the inner side surface of the limiting portion and the second guiding section.
  3. 3. The wafer carrier of claim 1, wherein the first temperature sensor is configured to detect an actual temperature of the wafer surface in a non-contact manner.
  4. 4. The wafer carrier of claim 3, wherein the first temperature sensor comprises a housing fixedly disposed in the temperature measurement fixing hole, a rotation mechanism fixedly disposed in the housing, and an infrared sensor rotatably disposed in the housing by the rotation mechanism, the rotation mechanism for driving the infrared sensor to freely rotate in the housing to change a temperature measurement position of the infrared sensor on the wafer surface.
  5. 5. The wafer carrier of claim 4, wherein the rotation mechanism comprises a housing shell and a driving portion, the infrared sensor is disposed in the housing shell, a side of the housing shell corresponding to the opening of the temperature measurement fixing hole is provided with a temperature measurement opening, the infrared sensor is used for measuring the temperature of the wafer through the temperature measurement opening, one side of the housing shell away from the temperature measurement opening is fixedly connected with the inner wall of the housing shell through the driving portion, the other side of the housing shell is movably connected with the inner wall of the housing shell through an elastic telescopic rod, and the driving portion is used for driving the housing shell to drive the infrared sensor to freely rotate relative to the housing shell.
  6. 6. The wafer carrier of any one of claims 3 to 5, wherein the second temperature sensor is configured to detect an actual temperature of the wafer at a location corresponding to the second temperature sensor by contact.
  7. 7. The wafer carrier of claim 6, wherein a trace hole is formed in the finger, a cable is disposed in the trace hole, and the first temperature sensor and the second temperature sensor each output the detected actual temperature through the cable in the trace hole.
  8. 8. A semiconductor processing apparatus comprising a process chamber and a wafer carrier disposed within the process chamber, wherein the wafer carrier is the wafer carrier of any one of claims 1 to 7.
  9. 9. The semiconductor processing apparatus of claim 8, wherein the wafer carrier is any one of claims 3 to 6, further comprising a control module and a heater for heating a wafer carried on the wafer carrier, the control module being configured to adjust a heating temperature of the heater according to an actual temperature detected by the first temperature sensor and/or the second temperature sensor to maintain a temperature of the wafer at a preset temperature.
  10. 10. The semiconductor process equipment according to claim 9, wherein the control module is located outside the process chamber, a wiring hole is formed in the finger, a cable is arranged in the wiring hole, the first temperature sensor and the second temperature sensor are connected with the control module through the cable in the wiring hole, a corrugated pipe is sleeved on the cable, one end of the corrugated pipe is connected with the first temperature sensor or the second temperature sensor in a sealing mode, and the other end of the corrugated pipe is connected with the wall of the process chamber in a sealing mode.

Description

Wafer carrying disc and semiconductor process equipment Technical Field The present invention relates to the field of semiconductor processing equipment, and in particular, to a wafer carrier tray and semiconductor processing equipment including the same. Background The physical vapor deposition (Physical Vapor Deposition, PVD) process refers to a process of gasifying a material source surface into gaseous atoms or molecules or partially ionizing the material source surface into ions by a physical method under vacuum conditions, and depositing a thin film having a specific function on a substrate surface through a low-pressure gas or plasma process. Referring to fig. 1, a schematic structure of a conventional magnetron sputtering apparatus is shown, wherein a Process transmission path is that a Wafer (Wafer) is taken out from a Wafer box (foup) on a Wafer handler (Load Port) 1, and is transferred to a degassing (Degas) chamber 4 for degassing through an equipment front end Module (Equipment front end Module, EFEM) 2 and a Load lock Module (Load lock) 3, and then is transferred to a Process chamber (Process Module, PM) for depositing a metal film, and finally the Wafer is transferred back to the Wafer box. The degassing cavity 4 is used for heating the wafer to a certain temperature and removing water vapor and other volatile impurities adsorbed on the surface of the wafer. The wafer is placed on a heated susceptor into the Degas chamber. Because the heater is difficult to reach absolute balance and the friction coefficients of different types of wafers are different, the wafers are easy to slide in the process, so that heating is uneven, and partial areas are not completely removed by water vapor and volatile impurities. Severe slipping can even lead to failure of the transfer sheet, with the risk of fragmentation. Therefore, how to avoid the wafer from being a technical problem to be solved in the art is urgent. Disclosure of Invention The invention aims to provide a wafer carrying disc and semiconductor process equipment comprising the same, wherein the wafer carrying disc can prevent a wafer from sliding in the transportation or process, ensure the heating uniformity of the wafer and improve the safety of a semiconductor process. In order to achieve the above object, as one aspect of the present invention, there is provided a wafer carrier including a wafer tray for carrying a wafer, a lifting assembly for driving the wafer carrier to lift the plurality of fingers, a carrier ring disposed around the wafer tray, and a plurality of fingers disposed on the carrier ring at intervals along a circumferential direction of the carrier ring, the fingers having support portions and stopper portions fixedly disposed on the support portions, the lifting assembly for driving the carrier ring to lift the plurality of fingers so that the support portions of the plurality of fingers lift the wafer on the wafer tray, or driving the carrier ring to lower the plurality of fingers so as to place the wafer on the wafer tray, the stopper portions having guide slopes toward an inner side, a reference diameter defined by an inner side of the stopper portions being larger than a reference diameter defined by an inner side of the plurality of support portions, the stopper portions for guiding and stopping the wafer. Optionally, the direction inclined plane includes from top to bottom first direction section, second direction section and the third direction section that distributes in proper order, the second direction section be the plane and with contained angle between the horizontal plane is 110 ° -120, first direction section with the third direction section is the curved surface, just first direction section transitional coupling is in the top surface of spacing portion with between the second direction section, third direction section transitional coupling is in spacing portion's medial surface with between the second direction section. Optionally, a temperature measurement fixing hole is formed on the limiting part, and a first temperature measurement sensor is arranged in the temperature measurement fixing hole and is used for detecting the actual temperature of the surface of the wafer in a non-contact manner. Optionally, the first temperature measurement sensor includes shell, rotary mechanism and infrared sensor, the shell is fixed to be set up in the temperature measurement fixed orifices, rotary mechanism is fixed to be set up in the shell, infrared sensor passes through rotary mechanism rotatable setting in the shell, rotary mechanism is used for driving infrared sensor freely rotates in the shell, in order to change infrared sensor temperature measurement position on the wafer surface. Optionally, rotary mechanism includes accommodation shell and drive division, infrared sensor set up in the accommodation shell, accommodation shell corresponds one side of temperature measurement fixed orifices open-ended has the te