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CN-114762089-B - Substrate cleaning system and substrate cleaning method

CN114762089BCN 114762089 BCN114762089 BCN 114762089BCN-114762089-B

Abstract

The invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. The substrate cleaning system (50) is provided with a heater (51), a chemical dilution module (52), and a cleaning module. The temperature of the diluted chemical solution mixed by the chemical solution dilution module (52) is determined to be a temperature higher than the normal temperature and lower than the glass transition temperature of the cleaning member. The cleaning member cleans the substrate (W) while supplying the diluted chemical solution having the determined temperature to the substrate (W).

Inventors

  • GAO YANGYI
  • SATO KOHEI
  • FUKAYA KOICHI

Assignees

  • 株式会社荏原制作所

Dates

Publication Date
20260505
Application Date
20201125
Priority Date
20191211

Claims (20)

  1. 1. A substrate cleaning system, comprising: A heater that heats pure water; a chemical diluting module for mixing chemical with pure water heated by the heater at a predetermined volume ratio, and A cleaning module for cleaning the substrate, The cleaning module is provided with: A substrate holding device that holds the substrate; A cleaning member which contacts the substrate and cleans the substrate; A chemical liquid supply nozzle for supplying a chemical liquid determined to have a predetermined temperature to the substrate, and A pure water supply nozzle that supplies heated pure water toward the substrate, The temperature of the diluted chemical solution mixed by the chemical solution dilution module is determined to be a temperature higher than the normal temperature and lower than the glass transition temperature of the cleaning member; the cleaning member cleans the substrate in a state where the diluted chemical solution having the determined temperature is supplied to the substrate.
  2. 2. The substrate cleaning system of claim 1, wherein, The substrate cleaning system includes: a chemical liquid supply line connected to the chemical liquid supply nozzle, and A pure water supply line connected to the pure water supply nozzle, The heater is connected to the pure water supply line and disposed upstream of a connection member that connects the chemical liquid supply line and the pure water supply line in a flow direction of the pure water.
  3. 3. The substrate cleaning system of claim 1 or 2, wherein, The temperature of the pure water supplied from the pure water supply nozzle is higher than the temperature of the diluted chemical supplied from the chemical supply nozzle.
  4. 4. The substrate cleaning system of claim 2, wherein, The cleaning module is provided with: A1 st filter disposed adjacent to the chemical supply nozzle and capturing foreign matter flowing through the chemical supply line, and And a2 nd filter which is disposed adjacent to the pure water supply nozzle and captures foreign matter flowing through the pure water supply line.
  5. 5. The substrate cleaning system of claim 1 or 2, wherein, The chemical liquid supply nozzle is a radiation nozzle that supplies a diluted chemical liquid from a center of the substrate held by the substrate holding device to a peripheral edge portion of the substrate.
  6. 6. The substrate cleaning system of claim 1 or 2, wherein, The chemical liquid supply nozzle includes: A1 st chemical liquid supply nozzle for supplying a diluting chemical liquid toward the center of the substrate held by the substrate holding device, and And a2 nd chemical liquid supply nozzle configured to supply a diluted chemical liquid toward a peripheral edge portion of the substrate held by the substrate holding device.
  7. 7. The substrate cleaning system of claim 1 or 2, wherein, The chemical liquid supply nozzle includes: a surface-side chemical liquid supply nozzle for supplying a diluting chemical liquid toward the surface of the substrate held by the substrate holding device, and A back-side chemical liquid supply nozzle that supplies a diluted chemical liquid toward the back surface of the substrate held by the substrate holding device.
  8. 8. The substrate cleaning system of claim 1 or 2, wherein, The cleaning module includes a heating device disposed adjacent to a peripheral edge portion of the substrate held by the substrate holding device, The heating device heats the diluted chemical solution present at the peripheral edge of the substrate.
  9. 9. A substrate cleaning method is characterized in that, The pure water is heated by the heater, Mixing the liquid medicine with the pure water heated by the heater according to a preset volume ratio, The temperature of the mixed diluted chemical solution is determined to be a temperature higher than the normal temperature and lower than the glass transition temperature of the cleaning member for scrubbing the substrate, The diluted chemical solution determined to have a predetermined temperature is supplied to the substrate held by the substrate holding device through the chemical solution supply nozzle, Supplying the pure water heated by the heater to the substrate held by the substrate holding device through a pure water supply nozzle, The substrate is scrubbed by the cleaning member in a state where the diluted chemical solution having the determined temperature is supplied to the substrate.
  10. 10. The method for cleaning a substrate according to claim 9, wherein, The pure water flowing through the pure water supply line connected to the pure water supply nozzle is heated by the heater, In the flow direction of the pure water, the chemical solution is mixed with the pure water flowing through a chemical solution supply line connected to the pure water supply line at a position downstream of the heater.
  11. 11. The method for cleaning a substrate according to claim 9 or 10, wherein, The temperature of the pure water supplied from the pure water supply nozzle is higher than the temperature of the diluted chemical supplied from the chemical supply nozzle.
  12. 12. The method for cleaning a substrate according to claim 10, wherein, The 1 st filter arranged adjacent to the liquid medicine supply nozzle captures foreign matters flowing through the liquid medicine supply line, Foreign matter flowing through the pure water supply line is caught by a2 nd filter disposed adjacent to the pure water supply nozzle.
  13. 13. The method for cleaning a substrate according to claim 9 or 10, wherein, The diluted chemical solution is supplied to the substrate held by the substrate holding device using the chemical solution supply nozzle as a radiation nozzle for supplying the diluted chemical solution from the center of the substrate held by the substrate holding device over the peripheral edge portion of the substrate.
  14. 14. The method for cleaning a substrate according to claim 9 or 10, wherein, The diluted chemical is supplied to the substrate held by the substrate holding device using the chemical supply nozzle having the 1 st chemical supply nozzle and the 2 nd chemical supply nozzle, the 1 st chemical supply nozzle supplying the diluted chemical toward the center of the substrate held by the substrate holding device, and the 2 nd chemical supply nozzle supplying the diluted chemical toward the peripheral edge of the substrate held by the substrate holding device.
  15. 15. The method for cleaning a substrate according to claim 9 or 10, wherein, Supplying a diluting chemical to the substrate held by the substrate holding device using the chemical supply nozzle having a front side chemical supply nozzle and a rear side chemical supply nozzle, the front-side chemical liquid supply nozzle supplies a diluted chemical liquid toward the front surface of the substrate held by the substrate holding device, and the rear-side chemical liquid supply nozzle supplies a diluted chemical liquid toward the rear surface of the substrate held by the substrate holding device.
  16. 16. The method for cleaning a substrate according to claim 9 or 10, wherein, The diluted chemical solution present at the peripheral edge portion of the substrate is heated by a heating device disposed adjacent to the peripheral edge portion of the substrate held by the substrate holding device.
  17. 17. A substrate cleaning system, comprising: a heater that heats pure water to generate heated pure water; a chemical diluting module for mixing the chemical with the heated pure water to generate a heated chemical, and A cleaning module for cleaning the substrate, The cleaning module is provided with: A substrate holding device that holds the substrate; A cleaning member which contacts the substrate and cleans the substrate; A chemical liquid supply nozzle that supplies the heated chemical liquid to the substrate; a pure water supply nozzle for supplying pure water to the substrate, and An internal pipe connected to the cleaning member and configured to supply a heating fluid, which is either one of the heating pure water or the heating chemical, to the cleaning member, The internal pipe communicates with at least one of the heater and the chemical diluting module.
  18. 18. The substrate cleaning system of claim 17, wherein, The internal pipe is disposed in the cleaning member and extends in the longitudinal direction of the cleaning member.
  19. 19. The substrate cleaning system of claim 17 or 18, wherein, The internal pipe has at least 1 opening portion facing the cleaning member.
  20. 20. The substrate cleaning system of claim 17 or 18, wherein, The substrate cleaning system further includes: A chemical liquid supply line to which the chemical liquid supply nozzle is connected; a pure water supply line connected to the pure water supply nozzle, and A heating fluid transfer line connected to the internal piping, The heater is connected to the pure water supply line, The heating fluid supply line is connected to at least one of the pure water supply line and the chemical liquid supply line.

Description

Substrate cleaning system and substrate cleaning method Technical Field The invention relates to a substrate cleaning system and a substrate cleaning method for cleaning a substrate. Background In the manufacture of semiconductor devices, a CMP apparatus for performing planarization of a substrate surface performs a cleaning process in which the substrate surface is polished with a suspension (slurry) containing abrasive grains and a polishing aid, and then the slurry adhering to the substrate surface and the back surface is removed with a cleaning liquid, and a drying process in which droplets adhering to the substrate surface and the back surface due to the cleaning process are removed. If the cleaning process is not proper, defects occur in the structure of the element, and thus the characteristics of the element are poor, and therefore, it is necessary to select a cleaning process method that does not cause destruction or corrosion of the element and reliably removes the slurry in a short time. Under such a background, the present invention is mainly applied to scrubbing by a sponge member having a roll shape or a pen shape, and a cleaning liquid composed of various chemical solutions is used as an auxiliary function (for example, refer to patent document 1). Prior art literature Patent literature Patent document 1 Japanese patent application No. 5866227 Patent document 2 Japanese patent laid-open publication No. 2002-43267 Patent document 3 Japanese patent application laid-open No. 2010-74191 Problems to be solved by the invention The scrubbing described in patent document 1 is mainly applied to a wiring process (BEOL) for forming a multilayer wiring composed of a copper (Cu) wiring and a Low-k insulating film. In recent years, chemical mechanical Polishing (CMP, chemical Mechanical Polishing) has been widely used in the manufacture of transistors (FEOL) for forming electrodes and plugs due to the necessity of high speed logic devices and low cost of memory devices. Film thickness, line width, line spacing are finer in FEOL than in BEOL, and therefore cleaning performance for fine particles or molecular contamination must be improved, and a cleaning method using a heated chemical solution to promote chemical action is expected as a practical method. However, in the scrubbing described in patent document 1, when the heated chemical is supplied from the nozzle, if the chemical temperature is too high, the mechanical properties of the sponge member are degraded by heat, and there is a concern that the cleaning effect is lower than when only the chemical at room temperature is used. Further, as a result of studies by the inventors, it has been found that the liquid temperature in the vicinity of the peripheral edge portion of the substrate is lowered due to the cooling action associated with the substrate rotation movement during the cleaning of the substrate, and the cleaning treatment cannot be performed at the desired liquid temperature, and as a result, a stable cleaning effect cannot be obtained. Disclosure of Invention Accordingly, a first object of the present invention is to provide a substrate cleaning system and a substrate cleaning method, which are provided with a heating chemical supply unit that can improve cleaning effect. A second object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method, which achieve high uniformity of liquid temperature over the entire surface to be cleaned of a substrate during a cleaning process. [ Means for solving the problems ] A substrate cleaning system is provided with a heater for heating pure water, a chemical diluting module for mixing chemical solution with the pure water heated by the heater in a predetermined volume ratio, and a cleaning module for cleaning a substrate, wherein the cleaning module is provided with a substrate holding device for holding the substrate, a cleaning member for scrubbing the substrate while being in contact with the substrate, a chemical solution supply nozzle for supplying chemical solution determined to be at a predetermined temperature to the substrate, and a pure water supply nozzle for supplying heated pure water to the substrate, wherein the temperature of the diluted chemical solution mixed by the chemical solution diluting module is determined to be a temperature higher than a normal temperature and lower than a glass transition temperature of the cleaning member, and the cleaning member performs scrubbing of the substrate while supplying the diluted chemical solution having the determined temperature to the substrate. In one embodiment, the substrate cleaning system includes a chemical liquid supply line to which the chemical liquid supply nozzle is connected, and a pure water supply line to which the pure water supply nozzle is connected, wherein the heater is connected to the pure water supply line and is disposed upstream of a connection member that connects the chemi