CN-114855129-B - Masking tape stripping device

CN114855129BCN 114855129 BCN114855129 BCN 114855129BCN-114855129-B

Abstract

The present invention relates to a masking tape peeling device for performing a sputtering process in a state where a masking tape is attached for electromagnetic wave (EMI) shielding a part of a region of a semiconductor material, and peeling off the masking tape attached to the semiconductor material after the sputtering process is completed, and more particularly, to a masking tape peeling device capable of stably removing only the masking tape from the material in a state where a supporting material is pressurized by a material fixing portion during peeling off the masking tape, preventing damage or impact of the semiconductor material when peeling off the masking tape, and solving the problem of masking tape residue due to peeling process errors.

Inventors

Jin Bingshi
Pu Zhencheng
Huang Guixi

Assignees

韩美半导体株式会社

Dates

Publication Date: 20260505
Application Date: 20220113
Priority Date: 20210204

Claims (14)

1. A masking tape peeling device for peeling a masking tape from a material to which the masking tape is attached in a part of a region, comprising: A material supply unit that supplies a material aggregate provided with a plurality of materials to which the masking tape is attached; a supply picker that picks up and conveys the material aggregate supplied from the material supply section; A peeling head provided with a peeling part which is lifted above the material attached with the masking tape and a material fixing part which is lifted at one side of the peeling part and is used for pressing and fixing the upper surface of the material not attached with the masking tape; A supply roller for supplying an adhesive tape to a lower face of the peeling part and a recovery roller for recovering the adhesive tape, and A mounting base to which the peeling head, the supply roller, and the recovery roller are mounted, and, A conveying table on which the material aggregate conveyed by the supply picker is placed and which conveys the material in the X-axis and Y-axis directions so as to be positioned below the peeling head, The peeling head further comprises a main body provided with the peeling part and the material fixing part, The stripping head is arranged on the mounting base through the main body part, The supply roller conveys the adhesive tape to a lower side of the peeling part so that an adhesive surface of the adhesive tape faces the masking tape of the material, the recovery roller recovers the adhesive tape to which the peeled masking tape is attached, The material fixing portion and the peeling portion are simultaneously or sequentially lowered to be in contact with a material, and the peeling portion is raised in a state where the material fixing portion is in contact with the material to peel the masking tape from the material.
2. The masking tape stripping apparatus as claimed in claim 1, wherein the masking tape stripping apparatus further comprises: a guide roller mounted to the mounting base and provided between the supply roller and the recovery roller, for guiding the adhesive tape; a supporting part mounted on the mounting base and respectively arranged at two sides of the stripping part for supporting the adhesive tape guided by the guiding roller, and And a load unit having one end connected to the support part and measuring tension of the adhesive tape.
3. The masking tape dispenser of claim 2, wherein, The mounting base is of a lifting structure, When the mounting base is lifted, the peeling head, the supply roller, the recovery roller, the guide roller, the support portion, and the load unit are lifted together, The material fixing part protrudes downwards compared with the stripping part, an elastic component or an air cylinder for supporting the material fixing part or a motor for lifting the material fixing part is arranged above the material fixing part, The mounting base is lowered for the first time so that the material fixing portion is brought into contact with and supported by the material, lowered for the second time until the peeling portion is lowered and the adhesive surface of the adhesive tape is brought into contact with the masking tape while maintaining the material contact and support, and then raised so as to peel the masking tape from the material.
4. The masking tape dispenser of claim 1, wherein, The peeling portion and the material fixing portion are respectively lifted and lowered independently from the mounting base.
5. The masking tape dispenser according to any one of claims 1, 3 to 4, And an impact relieving member provided above at least one of the material fixing portion and the peeling portion, the impact relieving member raising the material fixing portion or the peeling portion by a predetermined height to relieve an impact applied to the material during a process of contacting the material fixing portion with the material and a process of lowering the peeling portion to contact the adhesive surface of the adhesive tape with the masking tape, The impact relieving component is an elastic component, a cylinder or a motor.
6. The masking tape dispenser of claim 2, wherein, The masking tape stripping device also comprises a guide roller supporting frame which is provided with the guide roller and can be lifted, The guide roller is arranged on the installation base through the guide roller supporting frame, The load unit is arranged that the other end is arranged on the guide roller supporting frame and can lift together with the guide roller, The loading unit measures tension of the adhesive tape before peeling the masking tape with the adhesive face of the adhesive tape, The guide roller supporting frame is lifted and lowered according to a tension measurement result such that a lifting height of the guide roller is changed for adjusting a tension of the adhesive tape supplied to a lower face of the peeling part.
7. The masking tape dispenser of claim 2, wherein, The masking tape stripping device further includes: A guide roller support frame which is provided with the guide roller and can be lifted and lowered, and A control section for generating an alarm based on the tension value measured by the load unit, The guide roller is arranged on the installation base through the guide roller supporting frame, The load unit is arranged that the other end is arranged on the guide roller supporting frame and can lift together with the guide roller, The load unit measures tension of the adhesive tape during contact and peeling of the masking tape with the adhesive surface of the adhesive tape, The control part generates an alarm when the measured tension value of the adhesive tape exceeds a preset tension range.
8. The masking tape dispenser of claim 2, wherein, The load unit is provided with a measuring part for measuring the tension of the adhesive tape and a rod extending from one end of the measuring part, The support part is provided with a plurality of support pins for supporting the adhesive tape by arranging the rod, The load unit measures tension of the adhesive tape supported by at least one of the plurality of support pins.
9. The masking tape dispenser of claim 1, wherein, The masking tape stripping device further includes: an alignment view which is provided above the moving path of the conveying table and checks the position of the masking tape to be peeled off; A recovery pick-up device for picking up and moving in one direction the material aggregate attached with the stripping material of the masking tape stripped by the stripping head, and A material recovery unit for recovering a material aggregate from which the work is completed by the recovery pickup, The supply picker and the recovery picker are provided in one body or separately, And moving the conveying table in the X-axis or Y-axis direction according to the inspection result of the alignment view so that each masking tape attached to the material is positioned below the stripping part of the stripping head.
10. The masking tape dispenser of claim 1, wherein, The conveying table and the peeling head are provided in plurality, The supply pick-up and the transport table have overlapping working paths.
11. The masking tape dispenser of claim 1, wherein, The peeling head and the transfer stage rotate on an X-Y plane.
12. The masking tape dispenser of claim 11, wherein, The peeling head further includes: A main body frame fixed to the mounting base and mounting the main body portion, and An angle adjusting part for adjusting the rotation angle of the main body part mounted on the main body frame and fixedly fastening the main body frame and the main body part, The angle adjusting part rotates the main body part by 0 degree, 45 degrees and 90 degrees, The angle adjustment portion rotates the conveying table such that it corresponds to a rotation angle of the main body portion rotated by the angle adjustment portion.
13. The masking tape dispenser of claim 12, wherein, A replaceable stripping head is arranged at the lower end of the stripping part, a replaceable material fixing part head is arranged at the lower end of the material fixing part, The material fixing portion head is provided with a retreat groove or a penetration portion for retreating the adhesive tape so as to prevent interference between the adhesive tape and the material fixing portion when the main body portion is rotated 45 ° or 90 °.
14. The masking tape dispenser of claim 12, wherein, A stripping head is arranged at the lower end of the stripping part, a replaceable material fixing part head is arranged at the lower end of the material fixing part, The peeling head and the material fixing portion head are mounted together to a tool and detachable from the main body portion and the lower end of the material fixing portion, The material fixing portion head is provided with a retreat groove or a penetration portion for retreating the adhesive tape so as to prevent interference between the adhesive tape and the material fixing portion when the main body portion is rotated 45 ° or 90 °.

Description

Masking tape stripping device Technical Field The present invention relates to a masking tape peeling device that performs a sputtering process in a state where a masking tape is attached to a region other than a sputtering region of a semiconductor material in order to perform sputtering for shielding electromagnetic waves (EMI) in a partial region of the semiconductor material, and peels off and removes the masking tape attached to the semiconductor material after the sputtering process. And more particularly, to a masking tape stripping apparatus capable of preventing impact from being transmitted to a semiconductor material and minimizing damage to the material when the masking tape is stripped. Background After the circuit portion is formed on the substrate, a mold portion is formed over the circuit portion with a mold material in order to protect the circuit portion. In addition, the upper and side surfaces of the respective semiconductor materials except the bottom surface provided with the electrode may perform a sputtering process for electromagnetic wave (EMI) shielding. Recently, there is a case where one semiconductor material accommodates a plurality of circuit portions in one mold portion in order to provide a plurality of functions, and a part of one semiconductor material is not capable of forming a sputtering layer for shielding electromagnetic waves according to the kind or function of any one of the circuit portions. For example, when one of the plurality of circuit portions is a circuit for communication or the like, the sputtered layers on the upper surface and the side surfaces of the mold portion of the corresponding circuit portion region should be prevented from being evaporated or removed in order to realize a wireless communication function. However, with the miniaturization of the semiconductor material, it is not easy to perform the sputtering process for one semiconductor material mold portion surface by area. In addition, recently, there are cases where an electrode and a mold portion are formed together on the upper surface or the lower surface of a material due to the special shape of the material. In this case, a method is used in which the portion where the electrode is formed is rubberized with a thermosetting masking tape, and the sputtering process is performed only in the mold portion. In order to sputter one semiconductor material in each region, a method is used in which sputtering is performed in a state in which a masking tape such as a thermosetting tape is applied to a part of a region of a mold portion of the semiconductor material, and the masking tape is peeled off after the sputtering process is completed. On the other hand, when the mold portion of the semiconductor material is coated with the masking tape, there is a problem that, due to the sputtering characteristic of vapor deposition of small particles, when there is a small gap between the masking tape and the mold portion of the semiconductor material, the sputtered particles penetrate into the inside and a sputtered layer is formed also in a portion where the sputtered layer should not be formed. When a masking tape excellent in strong adhesive strength is used for preventing such internal penetration, there is a problem that glass of the masking tape is difficult. In addition, when unloading the semiconductor material after the end of the sputtering process, if the operator removes the masking tape by one-to-one manual operation, there is a problem that operability and productivity (Unit per hour; UPH) are lowered, and when the masking tape is to be removed by an automated apparatus, there is a problem that damage of the semiconductor material or a problem that the masking tape remains in the semiconductor material due to a peeling process error may occur. Accordingly, there is an urgent need for a masking tape peeling apparatus capable of solving the problem that, when masking tape attached to a part of a semiconductor material is removed after sputtering for electromagnetic wave shielding is performed on the part of the area, the semiconductor material is damaged or masking tape remains due to peeling process errors. Disclosure of Invention The purpose of the present invention is to provide a masking tape peeling device that can solve the problem of damage to a semiconductor material or masking tape residue caused by process errors when masking tape attached to a part of a region of the semiconductor material is removed after sputtering for electromagnetic wave masking is performed with the masking tape attached thereto. Further, the object is to stabilize the supporting material with the material fixing portion during peeling of the masking tape, thereby preventing the material from being lifted together, not damaging the material, and ensuring that only the masking tape can be removed. In addition, the tension of the adhesive tape is measured by the load unit during the process of peeling the mas