CN-114927441-B - Semiconductor cleaning equipment

CN114927441BCN 114927441 BCN114927441 BCN 114927441BCN-114927441-B

Abstract

The application discloses semiconductor cleaning equipment which comprises a bearing seat, a first cleaning arm, a second cleaning arm and a driving mechanism, wherein the bearing seat is used for placing a wafer, the first cleaning arm is provided with a first nozzle, the first cleaning arm sprays first cleaning media to the wafer through the first nozzle, the second cleaning arm is provided with a second nozzle, the second cleaning arm sprays second cleaning media to the wafer through the second nozzle, the semiconductor cleaning equipment is provided with a first working mode and a second working mode, the output end of the driving mechanism moves to a position capable of driving the first cleaning arm under the condition that the semiconductor cleaning equipment is in the first working mode, the movement track of the first nozzle is at least partially located above the bearing seat, and the output end of the driving mechanism moves to a position capable of driving the second cleaning arm under the condition that the semiconductor cleaning equipment is in the second working mode, and the movement track of the second nozzle is at least partially located above the bearing seat. The scheme can simplify the structural layout.

Inventors

SONG AIJUN
ZHANG JINGBO
ZHAO HONGYU

Assignees

北京北方华创微电子装备有限公司
北京北方华创微电子装备有限公司

Dates

Publication Date: 20260421
Application Date: 20220531
Priority Date: 20220531

Claims (10)

1. The utility model provides a semiconductor cleaning equipment which characterized in that, includes carrier seat, first cleaning arm, second cleaning arm and actuating mechanism, wherein: The bearing seat is used for placing a wafer; the first cleaning arm is provided with a first nozzle, and sprays a first cleaning medium to the wafer through the first nozzle; the second cleaning arm is provided with a second nozzle, and sprays a second cleaning medium to the wafer through the second nozzle; The semiconductor cleaning device is provided with a first working mode and a second working mode, the position of the output end of the driving mechanism can be changed to apply a driving action to the corresponding cleaning arm, so that the required cleaning medium is sprayed to the wafer, the output end of the driving mechanism moves to the position capable of driving the first cleaning arm to drive the first cleaning arm to move, the movement track of the first nozzle is at least partially positioned above the bearing seat, and the output end of the driving mechanism moves to the position capable of driving the second cleaning arm to drive the second cleaning arm to move when the semiconductor cleaning device is in the second working mode, and the movement track of the second nozzle is at least partially positioned above the bearing seat.
2. The semiconductor cleaning apparatus of claim 1, wherein the drive mechanism drives the first cleaning arm to rotate about a first axis, the first nozzle to move in an arc about the first axis, and wherein the drive mechanism drives the second cleaning arm to rotate about a second axis, the second nozzle to move in an arc about the second axis.
3. The semiconductor cleaning apparatus of claim 2, wherein the drive mechanism comprises a first drive assembly, a first transmission assembly, and a second transmission assembly, wherein: The first transmission assembly comprises a first worm and a first worm wheel, the first worm wheel is connected with the first cleaning arm, the first worm is meshed with the first worm wheel, the second transmission assembly comprises a second worm and a second worm wheel, the second worm wheel is connected with the second cleaning arm, the second worm is meshed with the second worm wheel, and the first driving assembly is used for driving the first worm or the second worm.
4. A semiconductor cleaning apparatus according to claim 3, wherein the drive mechanism further comprises a second drive assembly coupled to the first drive assembly for driving the first drive assembly between a first position and a second position to change the position of the output of the first drive assembly, the output of the first drive assembly being coupled to the first worm when the first drive assembly is in the first position, the output of the first drive assembly being coupled to the second worm when the first drive assembly is in the second position.
5. The semiconductor cleaning apparatus of claim 4, wherein the first drive assembly includes a first gear disposed at an output thereof, the first drive assembly includes a second gear disposed on the first worm, and the second drive assembly includes a third gear disposed on the second worm; The first gear moves with the first drive assembly between the second gear and the third gear, the first gear meshing with the second gear when the first drive assembly is in the first position, and the first gear meshing with the third gear when the first drive assembly is in the second position.
6. The semiconductor cleaning apparatus of claim 3, wherein the first drive assembly comprises a first drive device and a right angle gearbox, an output of the first drive device being disposed along a height direction of the semiconductor cleaning apparatus, an input of the right angle gearbox being connected to an output of the first drive device, the output of the right angle gearbox being disposed in a first plane and being configured to drive the first worm or the second worm, wherein the first plane is perpendicular to the height direction of the semiconductor cleaning apparatus.
7. The semiconductor cleaning apparatus of claim 2, further comprising a cleaning chamber and a bottom chamber disposed along a height direction thereof, wherein the carrier is disposed in the cleaning chamber, wherein the drive mechanism is disposed in the bottom chamber, wherein the first cleaning arm and the second cleaning arm each comprise a main body section and a bending section, wherein a first end of the main body section is connected to the drive mechanism, wherein a second end of the main body section extends into the cleaning chamber, wherein a first end of the bending section is connected to a second end of the main body section, and wherein a second end of the bending section is bent toward the carrier.
8. The semiconductor cleaning apparatus of claim 4, further comprising a cleaning chamber and a bottom chamber arranged in a height direction thereof, wherein the carrier is disposed in the cleaning chamber, and wherein the drive mechanism is disposed in the bottom chamber; the driving mechanism further comprises a first substrate, a second substrate and a third substrate, wherein the first substrate is arranged on the cavity wall of the bottom cavity, the second driving assembly, the second substrate and the third substrate are arranged on the first substrate, the second substrate and the third substrate are oppositely arranged on two sides of the first cleaning arm and the second cleaning arm, and the first worm and the second worm are rotatably arranged on the second substrate and the third substrate in a penetrating mode.
9. A semiconductor cleaning apparatus according to claim 3, wherein the first worm and the second worm are symmetrically and parallel arranged on both sides of the first cleaning arm and the second cleaning arm, an engagement area between the first worm and the first worm wheel is located on a plane where the first worm and the second worm wheel are located, and an engagement area between the second worm and the second worm wheel is located on a plane where the first worm and the second worm wheel are located.
10. The semiconductor cleaning apparatus of claim 4, wherein the first worm and the second worm are each disposed to extend in a horizontal plane, and the first worm wheel and the second worm wheel are each disposed in a vertical direction in an axial direction.

Description

Semiconductor cleaning equipment Technical Field The application relates to the technical field of semiconductor manufacturing, in particular to semiconductor cleaning equipment. Background In the process of semiconductor chip, the wafer after many processes (such as etching, heat treatment, etc.) needs to be cleaned by a cleaning device to ensure that the surface of the wafer has higher cleanliness. In a specific cleaning process, the cleaning apparatus needs to spray a cleaning medium (e.g., ultrapure water or the like) and nitrogen gas sequentially to a wafer to be cleaned, remove residual impurities by the cleaning medium, and achieve drying by the nitrogen gas. In the related art, the cleaning apparatus includes at least two cleaning arms, one for spraying the cleaning medium and one for spraying nitrogen gas. In order to ensure the uniformity of the spraying of the cleaning arm, the cleaning device further comprises a driving mechanism for driving the cleaning arm to rotate, so that the nozzle at the end part of the cleaning arm reciprocates in an arc track above the wafer, and the uniform spraying on the surface of the wafer is realized. As can be seen, the related cleaning apparatus is configured with a plurality of driving mechanisms, which are difficult to meet the demands of increasingly improved structural compactness, space utilization. Disclosure of Invention The application discloses a semiconductor cleaning device which is used for simplifying structural layout. In order to solve the problems, the application adopts the following technical scheme: the application provides semiconductor cleaning equipment, which comprises a bearing seat, a first cleaning arm, a second cleaning arm and a driving mechanism, wherein: The bearing seat is used for placing a wafer; the first cleaning arm is provided with a first nozzle, and sprays a first cleaning medium to the wafer through the first nozzle; the second cleaning arm is provided with a second nozzle, and sprays a second cleaning medium to the wafer through the second nozzle; The semiconductor cleaning device is provided with a first working mode and a second working mode, the output end of the driving mechanism moves to a position capable of driving the first cleaning arm when the semiconductor cleaning device is in the first working mode, the movement track of the first nozzle is at least partially located above the bearing seat, and the output end of the driving mechanism moves to a position capable of driving the second cleaning arm when the semiconductor cleaning device is in the second working mode, and the movement track of the second nozzle is at least partially located above the bearing seat. The technical scheme adopted by the application can achieve the following beneficial effects: the semiconductor cleaning device disclosed by the application has a first working mode and a second working mode, wherein the output end of the driving mechanism moves to a position capable of driving the first cleaning arm so as to spray a first cleaning medium to a wafer by the first nozzle under the condition that the semiconductor cleaning device is in the first working mode, and the output end of the driving mechanism moves to a position capable of driving the second cleaning arm so as to spray a second cleaning medium to the wafer by the second nozzle under the condition that the semiconductor cleaning device is in the second working mode. It can be seen that by switching between different modes of operation of the semiconductor cleaning apparatus, the driving mechanism of the present application can change the position of its output end to apply a driving action to the corresponding cleaning arm, thereby spraying the desired cleaning medium to the wafer. Compared with the related art, the semiconductor cleaning device is provided with only one driving mechanism under the condition of ensuring that the function of spraying different cleaning media can be realized, so that the structural layout inside the semiconductor cleaning device can be simplified undoubtedly, and the structural compactness and the space utilization rate are improved. Drawings The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings: fig. 1 is a schematic structural view of a semiconductor cleaning apparatus according to an embodiment of the present application; FIG. 2 is a schematic view of a first cleaning arm, a second cleaning arm and a driving mechanism according to an embodiment of the present application; FIG. 3 is a schematic diagram illustrating a driving relationship of a driving mechanism to drive a first cleaning arm according to an embodiment of the present application; FIG. 4 is a sc