CN-114952469-B - Method for grinding plate-like workpiece
Abstract
The invention provides a grinding method of a plate-shaped workpiece, which can shorten the grinding time in the grinding process of the plate-shaped workpiece when the creep feed grinding is performed after the cut grinding. In the plunge grinding and the gentle feed grinding, the same grinding tool is used. Therefore, it is not necessary to position the chuck table holding the plate-like workpiece with respect to two different grinding tools. Therefore, the grinding time can be shortened. In addition, in the plunge grinding, the lower surface of the grinding tool is used, while in the creep feed grinding, the side surface of the grinding tool is used. Therefore, the consumption amount of the grinding tool can be reduced as compared with a case where a plate-shaped workpiece is ground to a predetermined thickness by only plunge grinding or creep feed grinding.
Inventors
- Shan Zhongcong
- HIROKI MIYAMOTO
- NAKANO KEISUKE
- Shimazu Tomb
Assignees
- 株式会社迪思科
- 株式会社迪思科
Dates
- Publication Date
- 20260421
- Application Date
- 20220218
- Priority Date
- 20210222
Claims (2)
- 1. A method for grinding a plate-like workpiece by an annular grinding tool, wherein the plate-like workpiece held by a holding surface of a chuck table is ground, The method for grinding a plate-like workpiece comprises a plunge grinding step and a slow feed grinding step, The plunge grinding process includes the following operations: rotating the chuck table about a table rotation axis passing through a center of the holding surface holding the plate-like workpiece; Positioning the grinding tool above the holding surface in such a manner that the lower surface of the grinding tool passes through the center of the holding surface, rotating the grinding tool about a tool rotation axis passing through the center of the grinding tool, and The grinding tool and the chuck table are relatively moved in a direction perpendicular to the holding surface, thereby grinding the upper surface of the plate-like workpiece through the lower surface of the grinding tool, The creep feed grinding step includes the following operations: after the plunge grinding step, positioning a lower surface of the grinding tool used for plunge grinding at a position that is outside an outer periphery of the plate-shaped workpiece and that is lower than an upper surface of the plate-shaped workpiece; stopping the rotation of the chuck table, and The plate-shaped workpiece and the grinding tool are relatively moved in a direction parallel to the holding surface, thereby grinding the upper surface of the plate-shaped workpiece by the side surface of the grinding tool rotating, The method for grinding a plate-like workpiece further includes a progressive grinding step performed before the plunge grinding step, The advancing and gradually feeding grinding step includes the following operations: positioning the lower surface of the grinding tool used in the plunge grinding at a position outside the outer periphery of the plate-shaped workpiece and lower than the upper surface of the plate-shaped workpiece, and The plate-shaped workpiece and the grinding tool are relatively moved in a direction parallel to the holding surface, whereby the upper surface of the plate-shaped workpiece is ground by the side surface of the grinding tool that rotates.
- 2. The method for grinding a plate-like workpiece according to claim 1, wherein, The method for grinding a plate-shaped workpiece further includes a tilt changing step performed after the plunge grinding step and before the creep feed grinding step is started, wherein the grinding tool rotation axis of the grinding tool is tilted slightly to the moving direction side with respect to the vertical direction with respect to the direction of relative movement of the plate-shaped workpiece and the grinding tool in the creep feed grinding step.
Description
Method for grinding plate-like workpiece Technical Field The present invention relates to a method for grinding a plate-shaped workpiece. Background Patent document 1 discloses a method for grinding a wafer by performing plunge grinding after performing plunge grinding. Patent document 1 Japanese patent laid-open No. 63-077647 However, in the above-described grinding method, a grinding tool for cut-in grinding is used for cut-in grinding, and a grinding tool for jog-feed grinding is used for jog-feed grinding. Thus, two grinding tools are used, and thus time is wasted in positioning the chuck table holding the wafer with respect to the two grinding tools. Disclosure of Invention Accordingly, an object of the present invention is to shorten a grinding time in grinding a plate-like workpiece in the case of performing plunge grinding followed by creep feed grinding. The present invention provides a method for grinding a plate-like workpiece by an annular grinding tool, wherein the grinding method for the plate-like workpiece includes a plunge grinding step of rotating the chuck table about a table rotation axis passing through the center of the holding surface holding the plate-like workpiece, positioning the grinding tool above the holding surface so that the lower surface of the grinding tool passes through the center of the holding surface, rotating the grinding tool about the tool rotation axis passing through the center of the grinding tool, and relatively moving the grinding tool and the chuck table in a direction perpendicular to the holding surface, thereby grinding the upper surface of the plate-like workpiece by the lower surface of the grinding tool, and a creep feed grinding step of positioning the lower surface of the grinding tool used in the plunge grinding step outside the outer periphery of the plate-like workpiece and at a position lower than the upper surface of the plate-like workpiece after the plunge grinding step, thereby moving the grinding tool and the grinding tool in a direction parallel to the upper surface of the plate-like workpiece by the holding surface. Preferably, the method for grinding a plate-like workpiece further includes a progressive grinding step performed before the plunge grinding step, the progressive grinding step including an operation of positioning a lower surface of the grinding tool used for the plunge grinding at a position that is lower than an upper surface of the plate-like workpiece and is located outside an outer periphery of the plate-like workpiece, and relatively moving the plate-like workpiece and the grinding tool in a direction parallel to the holding surface, thereby grinding the upper surface of the plate-like workpiece by a side surface of the grinding tool that rotates. Preferably, the method for grinding a plate-shaped workpiece further includes a tilt changing step performed after the plunge grinding step and before the creep feed grinding step is started, wherein the grinding tool rotation axis of the grinding tool is tilted slightly to the moving direction side with respect to the vertical direction with respect to the direction of relative movement between the plate-shaped workpiece and the grinding tool in the creep feed grinding step. In the present grinding method, the same grinding tool is used for the plunge grinding and the creep feed grinding. Therefore, it is not necessary to position the chuck table holding the plate-like workpiece with respect to two different grinding tools. Therefore, the grinding time can be shortened. In addition, the lower surface of the grinding tool is used for the plunge grinding, while the side surface of the grinding tool is used for the creep feed grinding. Therefore, the consumption amount of the grinding tool can be reduced as compared with a case where a plate-shaped workpiece is ground to a predetermined thickness by only plunge grinding or creep feed grinding. Drawings Fig. 1 is a perspective view showing the structure of a grinding apparatus. Fig. 2 (a) to 2 (c) are cross-sectional views showing a grinding method. Fig. 3 is a partial cross-sectional side view illustrating a plunge grinding process. Fig. 4 is a partially cut-away side view showing a creep feed grinding process. Fig. 5 is a plan view showing the positional relationship between the grinding tool and the plate-like workpiece at the time of plunge grinding. Fig. 6 is a schematic view showing a cut-in grinding mark. Fig. 7 is a schematic view showing creep feed grinding marks. Fig. 8 (a) to 8 (d) are cross-sectional views showing other grinding methods. Fig. 9 is a cross-sectional view showing a tilt change step of tilting the grinding wheel rotation axis of the grinding wheel. Description of the reference numerals 1, A grinding device; 7 parts of a control part, 10 parts of a base table, 11 parts of a column, 12 parts of a fold cover, 13 parts of an opening part, 30 parts of a workpiece holding mechanism, 31 parts of a chuck workbench