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CN-114975198-B - Wafer conveying mechanical arm, wafer manufacturing equipment and wafer conveying method

CN114975198BCN 114975198 BCN114975198 BCN 114975198BCN-114975198-B

Abstract

The invention discloses a wafer conveying mechanical arm, wafer manufacturing equipment and a wafer conveying method, belongs to the technical field of semiconductor processes, and solves the problem that various pollutants in the atmosphere environment can pollute the wafer in the conveying process of the wafer conveying mechanical arm to cause bad production of the wafer in the subsequent manufacturing process in the prior art. The wafer conveying mechanical arm comprises a blade substrate and an air supply unit for providing protective air, wherein the blade substrate is provided with a through hole connected with the air supply unit, so that the protective air is blown to the upper surface of the blade substrate through the through hole. The wafer conveying method comprises the following steps that protective gas is sprayed on the upper surface of a blade substrate of a wafer conveying mechanical arm, a wafer is conveyed to the blade substrate from a front end module of equipment, the wafer is always protected by the protective gas, and the wafer is conveyed into a conveying module by the blade substrate. The wafer conveying mechanical arm, the wafer manufacturing equipment and the wafer conveying method can be used for manufacturing wafers.

Inventors

  • JIN DAZHEN
  • LI JUNJIE
  • LI LIN
  • WANG JIA

Assignees

  • 中国科学院微电子研究所
  • 真芯(北京)半导体有限责任公司

Dates

Publication Date
20260512
Application Date
20210224

Claims (8)

  1. 1. The wafer conveying mechanical arm is characterized by comprising a blade substrate and an air supply unit for providing protective air, wherein the blade substrate is provided with a through hole connected with the air supply unit, so that the protective air is blown to the upper surface of the blade substrate through the through hole; The blade comprises a blade body, a plurality of through holes, a plurality of connecting pipelines, a plurality of connecting rods and a plurality of connecting rods, wherein the through holes are arranged at the connecting end of the blade body; The air outlets of the through holes and/or the air outlets of the blind holes are provided with rotating sheets which rotate in real time under the action of the protective gas flow, and the direction of the protective gas flow is changed, so that the protective gas flow covers the adjacent two through holes and/or the gaps between the adjacent two blind holes; The upper surface of the blade matrix is provided with a groove for containing a wafer, the through hole is formed in the groove wall of the groove close to the connecting end of the blade matrix, and the blind hole is formed in the groove wall of the groove close to the suspension end of the blade matrix; the groove wall of the groove close to the connecting end of the blade base body is obliquely arranged, so that a gap is reserved between one end of the wafer close to the connecting end of the blade base body and the groove bottom of the groove.
  2. 2. The wafer transfer robot of claim 1, wherein the number of through holes is a plurality.
  3. 3. The wafer transfer robot of claim 1, wherein the blowing directions of the air outlets of the plurality of through holes are different in both the width direction and the thickness direction of the blade base.
  4. 4. The wafer transfer robot of claim 3, wherein the blowing directions of the air outlets of the plurality of through holes are fan-shaped in the width direction of the blade base.
  5. 5. A wafer transfer robot according to claim 3, wherein the plurality of through holes are arranged in a plurality of rows in the thickness direction of the blade base.
  6. 6. A wafer manufacturing apparatus, comprising an apparatus front end module, a transfer module, and a wafer transfer robot disposed between the apparatus front end module and the transfer module, wherein the wafer transfer robot is the wafer transfer robot according to any one of claims 1 to 5.
  7. 7. The wafer manufacturing apparatus according to claim 6, further comprising a handling module and a processing module, wherein the handling module, the apparatus front end module, the transfer module, and the processing module are connected in sequence.
  8. 8. A wafer transfer method, characterized in that the wafer manufacturing apparatus according to claim 6 or 7 is employed, comprising the steps of: the protective gas is sprayed on the upper surface of the blade matrix of the wafer conveying mechanical arm; the wafer is transmitted to the blade matrix from the front end module of the equipment, and the wafer is always protected by the protection gas; the blade substrate conveys the wafer into the transfer module, thereby completing the wafer conveyance.

Description

Wafer conveying mechanical arm, wafer manufacturing equipment and wafer conveying method Technical Field The invention belongs to the technical field of semiconductor processes, and particularly relates to a wafer conveying mechanical arm, wafer manufacturing equipment and a wafer conveying method. Background In a semiconductor processing Process, a wafer manufacturing apparatus generally includes a Load Port Module (LPM), an equipment front end Module (Equipment Front End Module Interlock, EFEM), a Transfer Module (TM), and a Process Module (PM) connected in order. The wafer transfer robot is used for transferring the wafer between the equipment front-end module and the transmission module. In the prior art, in the process of conveying a wafer on a wafer conveying mechanical arm, various pollutants in the atmospheric environment can pollute the wafer all the time, and meanwhile, oxygen in the atmospheric environment can oxidize the wafer, so that the wafer is bad in the subsequent manufacturing process. Disclosure of Invention In view of the above analysis, the present invention aims to provide a wafer transfer robot, a wafer manufacturing apparatus and a wafer transfer method, which solve the problem that various contaminants in the atmosphere during the transfer process of the wafer on the wafer transfer robot in the prior art pollute the wafer to cause the wafer to be bad in the subsequent manufacturing process. The aim of the invention is mainly realized by the following technical scheme: The invention provides a wafer conveying mechanical arm which comprises a blade substrate and an air supply unit for providing protective air, wherein the blade substrate is provided with a through hole connected with the air supply unit, so that the protective air is blown to the upper surface of the blade substrate through the through hole. Further, the number of the through holes is plural. Further, the number of through holes is 42 or more. Further, the blowing directions of the air outlets of the plurality of through holes are different in both the width direction and the thickness direction of the blade base body. Further, the blowing directions of the air outlets of the plurality of through holes are distributed in a fan shape in the width direction of the blade matrix. Further, the plurality of through holes are arranged in a plurality of rows in the thickness direction of the blade base body. Further, the plurality of through holes are arranged at the connecting end of the blade base body. Further, a plurality of blind holes are formed in the suspension end of the blade substrate, connecting pipelines are arranged in the blade substrate, and the blind holes are connected with the through holes through the connecting pipelines. Further, a rotating plate is arranged at the air outlet of the through hole and/or the air outlet of the blind hole. Further, the wafer conveying mechanical arm further comprises a rotating shaft, two ends of the rotating shaft are respectively and rotatably connected with the inner wall of the through hole and/or the blind hole, and one end of the rotating plate is fixedly connected with the rotating shaft. Further, the upper surface of the blade matrix is provided with a groove for accommodating the wafer, the through hole is formed in the groove wall of the groove close to the connecting end of the blade matrix, and the blind hole is formed in the groove wall of the groove close to the suspension end of the blade matrix. Further, the groove wall of the groove close to the connecting end of the blade base body is obliquely arranged, so that a certain gap is formed between one end of the wafer close to the connecting end of the blade base body and the groove bottom of the groove. Further, the through hole is zigzag in shape. The invention also provides wafer manufacturing equipment, which comprises an equipment front end module, a transmission module and a wafer transmission mechanical arm arranged between the equipment front end module and the transmission module, wherein the wafer transmission mechanical arm is provided with the wafer transmission mechanical arm. Further, the wafer casting equipment further comprises a loading and unloading module and a processing module, and the loading and unloading module, the equipment front end module, the transmission module and the processing module are sequentially connected. The invention also provides a wafer conveying method, which comprises the following steps: the protective gas is sprayed on the upper surface of the blade matrix of the wafer conveying mechanical arm; the wafer is transmitted to the blade matrix from the front end module of the equipment, and the wafer is always protected by the protection gas; the blade substrate conveys the wafer into the transfer module, thereby completing the wafer conveyance. Further, the blowing direction of the shielding gas is different in the width direction and the thickness direction of the bl