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CN-115004192-B - Detecting component temperature in a system

CN115004192BCN 115004192 BCN115004192 BCN 115004192BCN-115004192-B

Abstract

There is provided a method of detecting a temperature of a component of a support system for a semiconductor processing apparatus, the method comprising applying a radio frequency identification tag to the component, the radio frequency identification tag having a serial number, reading the radio frequency identification tag with a reader, the reader being arranged to read the serial number of the radio frequency identification tag and to identify a resonant frequency of the radio frequency identification tag, and converting the resonant frequency of the radio frequency tag to a temperature of the radio frequency identification tag.

Inventors

  • B.E. Faulkner

Assignees

  • 爱德华兹真空泵有限责任公司

Dates

Publication Date
20260505
Application Date
20210205
Priority Date
20200206

Claims (11)

  1. 1. A method of detecting a temperature of a process line (110; 310) of a semiconductor processing apparatus, the method comprising: applying (420) a radio frequency identification tag to the process line (110; 310), the radio frequency identification tag (200; 202;204; 300) having a serial number; Reading (430) the radio frequency identification tag (200; 202;204; 300) with a reader (500), the reader (500) being arranged to read a serial number of the radio frequency identification tag (200; 202;204; 300) and to identify a resonance frequency of the radio frequency identification tag (200; 202;204; 300), and Converting (440) the resonant frequency of the radio frequency tag (200; 202;204; 300) to a temperature of the radio frequency identification tag (200; 202;204; 300), The method further comprises the steps of: Recording (410) the serial number and the installation location of the radio frequency identification tag (200; 202;204; 300) in a database when the radio frequency identification tag (200; 202;204; 300) is applied to the process line (110; 310), and When a temperature reading is subsequently obtained, the location of the temperature reading is determined (450) by looking up the serial number of the radio frequency identification tag (200; 202;204; 300) in a database, Wherein the radio frequency identification tag (200; 202;204; 300) comprises an antenna (220; 222) in heat exchange with the process line (110; 310), and wherein a resonance frequency shift of the antenna (220; 222) caused by the heat exchange between the process line (110; 310) and the antenna (220; 222) is used to determine the temperature of the process line (110; 310) and the resonance frequency range of the antenna (220; 222) is associated with a specific set point.
  2. 2. The method of claim 1, wherein the temperature of the process line (110; 310) is determined to be the same as the temperature of the radio frequency identification tag (200; 202;204; 300).
  3. 3. A process line of a semiconductor processing apparatus comprising a radio frequency identification tag (200; 202;204; 300) for detecting a temperature of the process line (110; 310), the radio frequency identification tag (200; 202;204; 300) comprising: An antenna (220; 222) in heat exchange with the process line (110; 310); an electrically insulating pad (240), the electrically insulating pad (240) separating the antenna (220; 222) from the process line (110; 310), and A memory for storing a serial number which is emitted by the radio frequency identification tag (200; 202;204; 300) when the radio frequency identification tag (200; 202;204; 300) is interrogated, Wherein a shift in resonant frequency of the antenna (220; 222) caused by heat exchange between the process line (110; 310) and the antenna (220; 222) is used to determine the temperature of the process line (110; 310) and the resonant frequency range of the antenna (220; 222) is associated with a specific set point.
  4. 4. The process line of claim 3, wherein the radio frequency identification tag (200; 202;204; 300) further comprises an electrical component (224) comprising the memory and electrically coupled to the antenna (220; 222) and spaced apart from the antenna (220; 222).
  5. 5. The process line of claim 4, further comprising an insulating layer (260), the insulating layer (260) separating the electrical part (224) of the radio frequency identification tag (200; 202;204; 300) from the antenna (220; 222), the electrically insulating pad (240) and the process line (110; 310).
  6. 6. The process line according to claim 4 or 5, wherein the antenna (220; 222) and the electrical component (224) are housed in a housing (230).
  7. 7. The process line according to any of claims 3 to 5, further comprising a rubber pad (250) for attaching an electrically insulating pad (240) to the process line (110; 310).
  8. 8. The process line according to any one of claims 3 to 5, wherein the electrically insulating mat (240) is an electrical insulator and is thermally conductive.
  9. 9. Process line according to any of claims 3 to 5, wherein the radio frequency identification tag (200; 202;204; 300) is one of the following: the tag may be a tag that is not a passive tag, An active tag, and Battery assisted passive tags.
  10. 10. A computer program product comprising one or more programs, the one or more programs being arranged such that when executed by a computer system or one or more processors cause the computer system or the one or more processors to operate in accordance with the method of any of claims 1 to 2.
  11. 11. A machine readable storage medium storing one or more programs of the computer program product of claim 10.

Description

Detecting component temperature in a system Technical Field The present invention relates to a method of detecting a temperature of a component of a support system (support system) for a process line of a semiconductor processing apparatus, a reader for detecting a temperature of a component of a support system for a semiconductor processing apparatus, a radio frequency identification tag (radio frequency IDENTITY TAG) for detecting a temperature of a component of a support system for a semiconductor processing apparatus, one or more programs, and a machine readable storage medium. Background Pipelines to and from semiconductor equipment for various processes and applications may accumulate deposits, which can adversely affect the operation of the pipeline. Such semiconductor devices may include semiconductor fabrication equipment. Deposits may accumulate due to condensation at cold spots. Monitoring the temperature of the pipeline at various points along the line can help identify cold spots or whether the temperature of the fluid in the pipeline falls below an optimal level to minimize the formation of condensate or sediment. Furthermore, when heating the pipeline, for example in order to prevent condensation from forming inside the pipeline, it is important to ensure that the pipeline does not become too hot beyond the safe operating temperature of the pipeline contents, pipeline materials, heating components and any insulation materials. Monitoring the temperature of the pipeline at various points along the pipeline may help identify hot spots, which may be caused by heater failure or exothermic reactions within the pipeline. Such hot spots can lead to equipment failure. Identification of hot spots may be used to initiate remedial action, such as turning off a heater, turning off a process, or activating a quench function. Similarly, the vacuum pump and abatement system (abatement system) for semiconductor processing equipment may be part of an integrated system for semiconductor manufacturing. Such systems require a power distribution system to deliver power, typically at high voltage, to the various modules of the system. Such integrated systems are becoming more complex, smaller and more limited in the access for repair and maintenance activities. Thus, complex and integrated high voltage electrical components take up less space and are migrating to a system area with very few maintenance channels. Faults in the power distribution system may cause it to power down equipment (e.g., semiconductor processing equipment) at a high cost. Early signs of failure in such electrical systems may be determined by detecting elevated temperatures in components of the power distribution system. Typically, electronic temperature sensors are used to monitor the temperature of components such as process lines of semiconductor equipment. This may include a thermocouple connected to a suitable detection circuit. However, each such thermocouple is a relatively expensive device. In addition, each thermocouple requires additional wiring and control circuitry, the complexity of which increases installation costs. These factors make such electrical temperature sensors unsuitable for mass deployment. Furthermore, where insulating and/or heating jackets are applied to the pipeline, these may interfere with the deployment and wiring of the sensor. In power distribution systems, such wiring must be well insulated and protected from high voltage components. Alternative electronic temperature sensing devices may use any of thermistors, resistance Temperature Detectors (RTDs), and infrared sensors. While some of these may be cheaper than thermocouple, they still require cumbersome wiring and/or additional expense of communication circuitry. A mechanical switch indicator such as a thermostat or capillary probe may also be used to detect temperature. However, these typically only give low resolution readings and have other challenges in monitoring and relaying to the monitoring device. There is a need for improved arrangements for measuring component temperatures of support systems for semiconductor processing equipment, such as process lines and power distribution systems. Disclosure of Invention Radio Frequency Identification (RFID) tags have been found to have a resonant frequency response that is dependent on temperature. A cost-effective method of detecting the temperature of a component such as a pipeline by applying RFID tags on the pipeline itself along the length of the pipeline is described herein. A reader with resonant frequency detection capability is able to scan the component and determine the temperature of the RFID tag attached thereto. This provides a cost effective way to monitor multiple components within the system, each with an RFID tag attached. There is provided a method of detecting a temperature of a component of a support system for a semiconductor processing apparatus, the method comprising applying a radi