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CN-115023799-B - Wafer conveying unit and wafer conveying method

CN115023799BCN 115023799 BCN115023799 BCN 115023799BCN-115023799-B

Abstract

The wafer carrying unit carries a wafer while holding the wafer in a semiconductor failure analysis device, and includes a mounting table for fixing the wafer to a predetermined observation position, and a wafer chuck for holding the wafer and carrying the wafer to the observation position, the wafer chuck having a plurality of holding members (protruding portions) provided so as to face a side surface of the wafer, and holding the wafer by sandwiching a peripheral portion of the wafer (W) by the plurality of holding members.

Inventors

  • Dao Lailang
  • Shi Zhonglidao
  • Live Island government

Assignees

  • 浜松光子学株式会社
  • 浜松光子学株式会社

Dates

Publication Date
20260421
Application Date
20201109
Priority Date
20200123

Claims (7)

  1. 1. A wafer carrying unit, wherein, A wafer carrying unit for carrying a wafer while holding the wafer in a semiconductor failure analysis apparatus, The device is provided with: A fixing part for fixing the wafer at a predetermined observation position, and A transport unit that transports the wafer to the observation position while holding the wafer, The conveying part is provided with a conveying part, A plurality of holding members provided so as to face the side surface of the wafer, the wafer being held by the plurality of holding members by sandwiching the peripheral portion of the wafer, The wafer holding device includes a ring portion that defines a receiving space for receiving the wafer, and the ring portion is provided with the plurality of holding members that protrude toward the receiving space and are in contact with only a peripheral portion of the wafer but are not in contact with a back surface and a front surface of the wafer.
  2. 2. The wafer carrier unit of claim 1, wherein, The plurality of holding members includes at least 3 protruding portions that are in contact with the peripheral portion of the wafer.
  3. 3. The wafer carrier unit of claim 2, wherein, The plurality of holding members includes at least 4 of the protruding portions.
  4. 4. The wafer carrier unit of any one of claims 1 to 3, wherein, The plurality of holding members has a1 st holding member including one or more protruding portions abutting on a peripheral portion of the wafer, and a2 nd holding member including one or more of the protruding portions, The direction of the force applied to the wafer by the 1 st holding member holding the wafer and the direction of the force applied to the wafer by the 2 nd holding member holding the wafer are mutually opposite directions.
  5. 5. The wafer carrier unit of claim 4, wherein, The wafer clamping device is further provided with a stopper part, wherein the stopper part is configured to enable the separation distance between the 1 st holding member and the 2 nd holding member to be changed by fixing only the position of any one of the 1 st holding member and the 2 nd holding member, thereby releasing the clamping state of the 1 st holding member and the 2 nd holding member on the wafer.
  6. 6. The wafer handling unit of claim 5 wherein, The conveying unit includes: a base portion; a ring part including a1 st part connected to the base part via an elastic member, a pair of 2 nd parts continuous with the 1 st part and opposed to each other and extending in the 1 st direction, and a 3 rd part continuous with front ends of the pair of 2 nd parts and formed in a ring shape so as to divide an accommodation space accommodating a wafer, and A core portion continuous with the base portion and extending in the 1 st direction between the pair of 2 nd portions, In the 3 rd part of the ring part, the 1 st holding member protruding toward the accommodation space is provided, At the front end of the core, the 2 nd holding member protruding toward the accommodation space is provided, A hole portion configured to be engageable with the stopper portion is formed in the pair of 2 nd portions of the ring portion, The stopper portion is engaged with the hole portion to fix the position of the ring portion, thereby fixing the position of the 1 st holding member.
  7. 7. A wafer conveying method, wherein, A wafer transfer method for transferring a wafer while holding the wafer in a semiconductor failure analysis apparatus, Comprising: Providing a ring part having an accommodation space for accommodating the wafer, wherein the ring part is provided with a conveying part of a plurality of holding members protruding towards the accommodation space and only contacting with the periphery of the wafer but not contacting with the back surface and the front surface of the wafer; A step of clamping a peripheral portion of the wafer by the plurality of holding members provided so as to face the side surface of the wafer, and And a step of conveying the wafer to a predetermined observation position in a state where the peripheral portion of the wafer is held by the plurality of holding members.

Description

Wafer conveying unit and wafer conveying method Technical Field The present invention relates to a wafer transfer unit and a wafer transfer method for transferring a wafer while holding the wafer in a semiconductor fault analysis apparatus. Background In a semiconductor failure analysis apparatus, a mechanism (wafer transfer mechanism) for transferring a wafer while holding the wafer is known (for example, refer to patent document 1). Prior art literature Patent literature Patent document 1 U.S. patent application publication No. 2010/0315617 Disclosure of Invention Problems to be solved by the invention As the Wafer transfer mechanism, a Wafer chuck (Wafer chuck) is known, which includes a Wafer placed and transferred thereon. Conventionally, as a method for strongly holding a wafer on a wafer chuck, there is a method for fixing a wafer on a wafer chuck with an adhesive tape. In recent years, in order to automatically perform failure analysis on a plurality of wafers, there are cases where wafers are moved from a wafer cassette (WAFER CASSETTE) to a wafer chuck by a wafer transfer robot, but in the case of using this wafer transfer robot, it is difficult to adopt a method of fixing the wafers to the wafer chuck by an adhesive tape. Therefore, a method other than the fixation by an adhesive tape is required to strongly hold the wafer during conveyance. In the semiconductor failure analysis apparatus described above, a special lens called a solid immersion lens, in which a hemispherical member is mounted on the front end, is brought into close contact with the rear surface of the wafer while the wafer is held by a wafer chuck or the like, so that a high-resolution image may be obtained. In order to bring the solid immersion lens into close contact to analyze any chip in the wafer, the entire back surface of the wafer must be exposed. Therefore, in the structure in which the solid immersion lens is brought into close contact with the back surface side of the wafer, a structure for strongly holding the wafer during conveyance must be provided outside the back surface side of the wafer. Further, in the semiconductor failure analysis apparatus described above, although the pins of the probe card are brought into contact with the pads of the wafer (Touchdown) from the front surface side of the wafer and the wafer is biased, if a holder for strongly holding the wafer during conveyance is provided on the front surface side of the wafer, the holder may interfere with the contact processing of the pins of the probe card or may damage the pins of the probe card. As described above, in the wafer conveyance mechanism, the wafer under conveyance is strongly held by a method other than the tape, but the position, thickness, and the like of the holding mechanism are limited in realizing each function of the semiconductor failure analysis device, and no suitable holding mechanism is found. One aspect of the present invention has been made in view of the above-described circumstances, and an object of the present invention is to provide a wafer transfer unit and a wafer transfer method capable of properly holding a wafer during transfer without interfering with the functions of a semiconductor failure analysis device. Means for solving the problems The wafer carrying unit according to one embodiment of the present invention is a unit for carrying a wafer while holding the wafer in a semiconductor failure analysis device, and includes a fixing portion for fixing the wafer at a predetermined observation position, and a carrying portion for carrying the wafer to the observation position while holding the wafer, wherein the carrying portion includes a plurality of holding members provided so as to face a side surface of the wafer, and holds the wafer by sandwiching a peripheral portion of the wafer by the plurality of holding members. In the wafer transfer unit according to one embodiment of the present invention, the wafer is transferred to the observation position to which the wafer is fixed by the transfer unit. The transfer unit holds the peripheral portion of the wafer by a plurality of holding members provided so as to face the side surface of the wafer. In this way, by adopting a structure in which the holding member of the conveying section holds the peripheral portion of the wafer from the side surface of the wafer, there is no need to provide a new structure for strongly holding the wafer during conveyance on the back surface side and the front surface side of the wafer. This makes it possible to properly hold the wafer during conveyance without interfering with the functions of the semiconductor failure analysis apparatus. The plurality of holding members may include at least 3 protruding portions that abut on the peripheral portion of the wafer. Thus, the wafer can be held stably. The plurality of holding members may be constituted by including at least 4 protruding portions. This enables the wafer to be held more st