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CN-115135004-B - Circuit manufacturing equipment and circuit manufacturing method

CN115135004BCN 115135004 BCN115135004 BCN 115135004BCN-115135004-B

Abstract

The invention discloses a circuit manufacturing device and a circuit manufacturing method. The circuit manufacturing equipment comprises a printing spray head, a position and distance monitoring component, a driving mechanism and a control unit, wherein the position and distance monitoring component is used for carrying out position alignment and distance confirmation between a nozzle of the printing spray head and a target area on a printing surface, the driving mechanism is used for driving the printing spray head to carry out at least one of moving along a first direction on a horizontal plane, moving along a second direction perpendicular to the first direction on the horizontal plane, moving along a vertical direction, inclining to form a required included angle between an own axis and the vertical direction and rotating around the own axis, and the control unit is connected with at least the printing spray head, the position and distance monitoring component and the driving mechanism. Compared with the prior art, the invention can effectively consider the accuracy and the production efficiency of the printing circuit by adjusting the angles in a grading way, greatly reduce the production cost and obviously improve the product quality.

Inventors

  • LIN JIAN
  • MA CHANGQI

Assignees

  • 中国科学院苏州纳米技术与纳米仿生研究所

Dates

Publication Date
20260508
Application Date
20210324

Claims (7)

  1. 1. A circuit manufacturing method, the method being implemented on the basis of a circuit manufacturing apparatus, the circuit manufacturing apparatus comprising: The printing nozzle is used for printing conductive ink on a printing surface of an object to be printed to form a required circuit, wherein the object to be printed is placed on the supporting mechanism, and the supporting mechanism at least can drive the object to be printed to rotate and/or move along the vertical direction and/or the horizontal direction; a position and distance monitoring assembly for performing position alignment and distance confirmation between the nozzles of the print head and a target area on the printing surface; A driving mechanism for driving the printing nozzle to at least one of move along a first direction on a horizontal plane, move along a second direction perpendicular to the first direction on the horizontal plane, move along a vertical direction, incline to have a required included angle between the self axis and the vertical direction and rotate around the self axis, and The control unit is at least connected with the printing spray head, the position and distance monitoring assembly and the driving mechanism; The method comprises the following steps: Providing a printing nozzle for printing conductive ink on a printing surface of an object to be printed to form a required circuit; performing position alignment and distance confirmation between a nozzle of the printing nozzle and a target area on the printing surface, enabling the vertical distance between the nozzle and the target area to be 0.5-10mm, and enabling the linear deviation between the nozzle and the target area in the horizontal direction to be less than or equal to 5mm; Calculating an included angle formed between the target area and the horizontal plane according to the vertical distance between the nozzle and the target area and the linear deviation value in the horizontal direction; When the included angle formed between the target area and the horizontal plane is smaller than or equal to a critical value, the object to be printed and the printing nozzle are kept in a relatively static state, and when the included angle formed between the target area and the horizontal plane is larger than the critical value, the object to be printed is driven to move until the included angle formed between the target area and the horizontal plane is smaller than the critical value, and the included angle formed between the target area and the horizontal plane is calculated again; And according to the included angle formed between the target area and the horizontal plane, at least one of the following actions is performed on the printing spray head, wherein the printing spray head moves along a first direction on the horizontal plane, moves along a second direction which is perpendicular to the first direction on the horizontal plane, moves along the vertical direction, inclines to a required included angle between the axis of the printing spray head and the vertical direction and rotates around the axis of the printing spray head, so that the printing ink spraying direction of the printing spray head is always perpendicular to the target area.
  2. 2. The method of manufacturing a circuit of claim 1, wherein the position and distance monitoring assembly comprises a multi-point ranging sensor and a visual identification feature distributed around the print head.
  3. 3. The method of manufacturing a circuit according to claim 1, comprising achieving positional alignment and distance confirmation between the nozzle and the target area by visual identification feature marks and multi-point ranging sensors distributed around the print head.
  4. 4. The method of manufacturing a circuit according to claim 1, wherein the critical value is 1 DEG to 30 deg.
  5. 5. The circuit manufacturing method according to claim 1, comprising calculating an angle formed between the target area and a horizontal plane by using a trigonometric function method based on a vertical distance between the nozzle and the target area and a linear deviation value in a horizontal direction.
  6. 6. The method of manufacturing a circuit according to claim 1, wherein the initial velocity of the ink droplets of the printing ink ejected from the nozzle is 2 to 100 m/s.
  7. 7. The method of manufacturing a circuit according to claim 6, wherein the initial velocity of the ink droplets of the printing ink ejected from the nozzle is 4 to 50 m/s.

Description

Circuit manufacturing equipment and circuit manufacturing method Technical Field The invention relates to a circuit manufacturing method, in particular to a method for manufacturing a circuit by adopting a printing method, and belongs to the technical field of additive manufacturing. Background With the development of additive manufacturing technology, it is becoming possible to directly manufacture conductive parts such as circuits and antennas on various surfaces by using a printing method. At present, remarkable results are achieved in the material and process research of printing various conductors, semiconductors and dielectric layers, but most of the time, the material and process research cannot replace the traditional semiconductor integrated circuits. Thus, an important mainstream method is Hybrid Electronics, i.e. "hybrid manufacturing electronics". In short, the conventional electronic components, such as capacitors, resistors, inductors, chips, light Emitting Diodes (LEDs), etc., are connected by wires manufactured by a printing method. In another aspect, such circuits are more similar to PCB or FPC boards, but the manufacturing process has revolutionized, particularly with printed wire or other conductive features instead of conductive features that have been etched from a single piece of copper foil. To more specifically illustrate the features of the hybrid manufacturing electronics described above, a printed antenna RFID tag may be used as a specific example. It is common practice to print the antenna and heat treat it before fixing the chip to a reserved location and ensuring the connection between the chip and the antenna. Other complex hybrid manufacturing circuits are also produced by a similar process in which the circuit is printed and then the various components are fixed in place and the connection between the components and the circuit is completed. Although the method can be matched with the existing circuit production process to the greatest extent, the method improves the efficiency of mass production on a large scale, and has some defects. One of the most prominent problems is that the process flow substantially limits the advantages of printing as an additive manufacturing technique in terms of special circuit customization. For example, an important requirement of "hybrid manufacturing electronics" is to print conductive materials directly on relatively complex 3D surfaces to form conductive parts such as wires, electrodes, antennas, etc., or to overprint electronic components with other semiconductor, dielectric, etc. materials. In principle, the printing method does allow direct customization of the circuit on irregular surfaces. However, if a circuit board-like manufacturing process is used, the method is limited to thin film or sheet manufacturing, wasting the potential of the printing process to produce circuits. However, in practice, this concept of directly printing fine conductive patterns on surfaces to be printed with horizontal angles also presents technical challenges. Because the initial velocity of ink drops of the ink jet printing, air jet printing and other devices reaches about 4-50 m/s and undergoes a gravity acceleration process for a certain time, the ink drops can generate considerable lateral movement velocity when striking the surface to be printed in a non-vertical direction, thereby affecting the accuracy of printed patterns, and such deviation is a factor which cannot be ignored in high-resolution printing operation. In addition, the liquid on the surface to be printed with a large horizontal included angle gradually moves downwards under the combined action of gravity and the inclination angle, and the liquid is also an important factor affecting the printing effect for ink drops which cannot be instantaneously dried. For this reason, new manufacturing equipment and processes need to be developed to meet the circuit additive manufacturing in special scenarios as an important complement to the mainstream approach. For example, for some small 3D complex surfaces, a print head is generally used to fix, and the surface to be printed moves, so that the local horizontal state of the printing surface is ensured by the movement of a mechanical arm with 5-6 degrees of freedom, and the circuit printing of the 3D surface is realized. For circuits fabricated on complex 3D surfaces, the current processes of pasting, dispensing, local heating, etc. are also capable of being matched after being properly improved, and finally, a circuit capable of working is produced on the surfaces. The most challenging application scenario today is how to print conductive ink on 3D complex surfaces of larger size. For example, when the material of the entire object to be printed is a high-density material such as metal, and the size exceeds 1 meter, the total mass will easily exceed 100 kg, even more than 1 ton. For the application scene, the existing solution for adjusting the le