CN-115173011-B - Coupler
Abstract
The application relates to a coupler, which comprises a substrate, a first laminated spiral inductor arranged in the substrate and a second laminated spiral inductor arranged in the substrate. The first laminated spiral inductor comprises a first spiral coil and a second spiral coil which are arranged in a laminated mode, the second laminated spiral inductor is mutually coupled with the first laminated spiral inductor, and the second laminated spiral inductor comprises a third spiral coil and a fourth spiral coil which are arranged in a laminated mode. The application realizes energy transmission through electromagnetic coupling between the first laminated spiral inductor and the second laminated spiral inductor, thereby forming the coupler. The application can integrate the inductor into a ceramic matrix by adopting a low-temperature co-firing ceramic process to form a monolithic structure, thereby not only greatly reducing the volume of the coupler, but also improving the integration level, environmental adaptability and consistency of the coupler.
Inventors
- TANG DAN
- LIU JICHAO
- XIAO QIAN
- LIN YAMEI
- ZHOU LIJIE
- NING HUAN
- HU ZHIMING
Assignees
- 深圳振华富电子有限公司
- 深圳振华富电子有限公司
Dates
- Publication Date
- 20260421
- Application Date
- 20220721
- Priority Date
- 20220721
Claims (9)
- 1. A kind of coupler, characterized by comprising the following steps: a base; The first laminated spiral inductor is arranged in the substrate, the first laminated spiral inductor comprises a first spiral coil and a second spiral coil which are laminated, an outer ring port of the first spiral coil is a first port of the coupler, the substrate is connected between an inner ring port of the first spiral coil and an inner ring port of the second spiral coil through a first through hole, an outer ring port of the second spiral coil is a second port of the coupler, and The second laminated spiral inductor is arranged in the substrate and is mutually coupled with the first laminated spiral inductor, the second laminated spiral inductor comprises a third spiral coil and a fourth spiral coil which are arranged in a laminated mode, an outer ring port of the third spiral coil is a third port of the coupler, the substrate is connected between an inner ring port of the third spiral coil and an inner ring port of the fourth spiral coil through a first through hole, and an outer ring port of the fourth spiral coil is a fourth port of the coupler; The pattern of the second spiral coil is obtained by rotating the pattern of the first spiral coil by 180 degrees along the height direction, the pattern of the third spiral coil is obtained by rotating the pattern of the second spiral coil by 180 degrees along the length direction, and the pattern of the fourth spiral coil is obtained by rotating the pattern of the third spiral coil by 180 degrees along the height direction.
- 2. The coupler of claim 1, wherein the first helical coil, the second helical coil, the third helical coil, and the fourth helical coil are stacked in sequence from top to bottom within the matrix.
- 3. The coupler of claim 1, wherein the first port is disposed on a front surface of the base, and the length direction is parallel to the front surface.
- 4. A coupler according to any one of claims 1 to 3, wherein the first spiral coil, the second spiral coil, the third spiral coil and the fourth spiral coil are each double-layer spiral coils, and the first spiral coil, the second spiral coil, the third spiral coil and the fourth spiral coil are each composed of two parallel 1/8 wavelength planar coils.
- 5. The coupler of claim 4, wherein the 1/8 wavelength planar coil has a linewidth of 100 μm to 130 μm and a thickness of 7 μm to 13 μm.
- 6. The coupler of claim 4, wherein a pitch between the first stacked spiral inductor and the second stacked spiral inductor is 0.65mm to 0.75mm, a pitch between spiral coils in the same spiral inductor is 100 μm to 135 μm, and a pitch between 1/8 wavelength planar coils in the same spiral coil is 5 μm to 15 μm.
- 7. A coupler according to any one of claims 1 to 3, further comprising a first shield layer and a second shield layer disposed within the matrix, the first shield layer and the second shield layer each being parallel to the first stacked spiral inductor and the second stacked spiral inductor, the first shield layer being disposed above the first stacked spiral inductor and the second shield layer being disposed below the second stacked spiral inductor.
- 8. A coupler according to any one of claims 1 to 3, wherein the outer surface of the base body is further provided with a first external electrode, a second external electrode, a third external electrode and a fourth external electrode, the first external electrode being connected to the first port, the second external electrode being connected to the second port, the third external electrode being connected to the third port, and the fourth external electrode being connected to the fourth port.
- 9. A coupler according to any one of claims 1 to 3, wherein the outer surface of the base body is further provided with a ground shield for connection to ground.
Description
Coupler Technical Field The application belongs to the technical field of microwave systems, and particularly relates to a coupler. Background Currently, in microwave technology, a microwave coupler is one of the main passive microwave components, which is an important component in a microwave system for separating or combining signals of various frequencies. With the continuous development of miniaturization, light weight and high performance of electronic systems, the electronic systems put higher demands on the performance of microwave couplers, such as size and power. The traditional coupler is formed by winding a coil on a magnetic core, and the problems of large volume, poor environmental adaptability, high cost and low consistency of the product exist, so that the requirements of the modern technology on the small volume, low cost, high performance and high consistency of the product can not be well met. Disclosure of Invention The application aims to provide a coupler, which aims to solve the problems of larger volume, poor environmental adaptability, high cost and low consistency of the traditional coupler. The first aspect of the embodiment of the application provides a coupler, which comprises a substrate, a first laminated spiral inductor arranged in the substrate, and a second laminated spiral inductor arranged in the substrate, wherein the first laminated spiral inductor comprises a first spiral coil and a second spiral coil which are laminated, an outer ring port of the first spiral coil is a first port of the coupler, the substrate is connected between an inner ring port of the first spiral coil and an inner ring port of the second spiral coil through a first through hole, an outer ring port of the second spiral coil is a second port of the coupler, the second laminated spiral inductor is arranged in the substrate, the second laminated spiral inductor is mutually coupled with the first laminated spiral inductor, the second laminated spiral inductor comprises a third spiral coil and a fourth spiral coil which are laminated, an outer ring port of the third spiral coil is a third port of the coupler, the substrate is connected between the inner ring port of the third spiral coil and the inner ring port of the fourth spiral coil through the first through hole, and the port of the fourth spiral coil is a fourth port of the coupler. In one embodiment, the first spiral coil, the second spiral coil, the third spiral coil and the fourth spiral coil are sequentially stacked in the base body from top to bottom. In one embodiment, the pattern of the second spiral coil is obtained by rotating the pattern of the first spiral coil by 180 degrees in the height direction, the pattern of the third spiral coil is obtained by rotating the pattern of the second spiral coil by 180 degrees in the length direction, and the pattern of the fourth spiral coil is obtained by rotating the pattern of the third spiral coil by 180 degrees in the height direction. In one embodiment, the first port is disposed on a front surface of the base, and the length direction is parallel to the front surface. In one embodiment, the first spiral coil, the second spiral coil, the third spiral coil and the fourth spiral coil are double-layer spiral coils, and each of the first spiral coil, the second spiral coil, the third spiral coil and the fourth spiral coil is composed of two parallel 1/8 wavelength plane coils. In one embodiment, the line width of the 1/8 wavelength planar coil is 100-130 μm, and the thickness of the 1/8 wavelength planar coil is 7-13 μm. In one embodiment, the distance between the first laminated spiral inductor and the second laminated spiral inductor is 0.65-0.75 mm, the distance between spiral coils in the same spiral inductor is 100-135 μm, and the distance between 1/8 wavelength plane coils in the same spiral coil is 5-15 μm. In one embodiment, the device further comprises a first shielding layer and a second shielding layer which are arranged in the substrate, the first shielding layer and the second shielding layer are parallel to the first laminated spiral inductor and the second laminated spiral inductor, the first shielding layer is arranged above the first laminated spiral inductor, and the second shielding layer is arranged below the second laminated spiral inductor. In one embodiment, the outer surface of the substrate is further provided with a first external electrode, a second external electrode, a third external electrode and a fourth external electrode, the first external electrode is connected with the first port, the second external electrode is connected with the second port, the third external electrode is connected with the third port, and the fourth external electrode is connected with the fourth port. In one embodiment, the outer surface of the substrate is further provided with a grounding shielding layer, and the grounding shielding layer is used for being connected with a ground terminal