CN-115213684-B - Object processing method and object processing system

Abstract

The present invention relates to an object processing method and an object processing system. The object processing method includes a polishing step of polishing a portion of the object from the surface to a predetermined polishing position, and a laser processing step of forming one or more rows of modified regions along the line prior to the polishing step. The laser processing step includes a data acquisition step of acquiring measurement data related to the displacement of the laser light incident surface, a converging step of causing the converging position of the laser light to follow the displacement of the laser light incident surface based on the measurement data, and a monitoring step of monitoring, in the optical axis direction of the converging lens, whether or not a modified region formed by converging the laser light to the converging position exceeds an error detection position determined between a scheduled formation position of the modified region closest to the scheduled polishing position and the scheduled polishing position on the scheduled polishing position side, in the case where the converging position is caused to follow the displacement of the laser light incident surface based on the measurement data.

Inventors

• Sakamoto Gangzhi

Assignees

• 浜松光子学株式会社

Dates

Publication Date

20260505

Application Date

20220330

Priority Date

20210331

Claims (16)

1. 1. A method for processing an object, wherein, The device is provided with: a polishing step of polishing a portion of the object from the surface to a predetermined polishing position; A laser processing step of irradiating the object with laser light along a line through a condenser lens before the polishing step, forming one or more rows of modified regions along the line between the surface of the interior of the object and the predetermined polishing position, The laser processing procedure comprises the following steps: A data acquisition step of acquiring measurement data related to displacement of a laser light incident surface of the object; A condensing step of moving a condensing position of the laser beam along the line and causing the condensing position to follow a displacement of the laser beam incident surface based on the measurement data; And a monitoring step of monitoring, in a case where the condensed position is caused to follow the displacement of the laser light incident surface based on the measurement data, whether or not the modified region formed by the condensed light of the laser light to the condensed position exceeds, on the side of the planned grinding position, an error detection position determined between a planned forming position of the modified region closest to the planned grinding position and the planned grinding position in the optical axis direction of the condensed lens.
2. 2. The object processing method according to claim 1, wherein, In the step of monitoring the operation of the device, When the condensed position is caused to follow the displacement of the laser light incident surface based on the measurement data, a detour amount corresponding to the amount of shift in the optical axis direction when the position of the modified region formed by condensing the laser light to the condensed position is shifted from the position where the modified region is formed, Monitoring whether the detour amount exceeds a distance in the optical axis direction from the formation predetermined position to the error detection position.
3. 3. The object processing method according to claim 1, wherein, The measurement data is a voltage value corresponding to the reflected light of the distance measuring laser light reflected by the laser light incident surface, which is acquired by a sensor that receives the reflected light.
4. 4. The object processing method according to claim 2, wherein, The measurement data is a voltage value corresponding to the reflected light of the distance measuring laser light reflected by the laser light incident surface, which is acquired by a sensor that receives the reflected light.
5. 5. The object processing method according to claim 3, wherein, The monitoring process includes: The condensing position is made to follow the displacement of the laser light incident surface by performing feedback control to move the condensing lens in the optical axis direction so that the measurement data becomes a target voltage value; in the result of the feedback control, whether the modified region exceeds the error detection position on the polishing scheduled position side is monitored based on a difference between a feedback voltage value, which is a voltage value obtained by the sensor, and the target voltage value.
6. 6. The object processing method according to claim 4, wherein, The monitoring process includes: The condensing position is made to follow the displacement of the laser light incident surface by performing feedback control to move the condensing lens in the optical axis direction so that the measurement data becomes a target voltage value; in the result of the feedback control, whether the modified region exceeds the error detection position on the polishing scheduled position side is monitored based on a difference between a feedback voltage value, which is a voltage value obtained by the sensor, and the target voltage value.
7. 7. The method for processing an object according to any one of claims 1 to 6, wherein, The laser processing step includes an input step of inputting the error detection position via an input unit.
8. 8. The method for processing an object according to any one of claims 1 to 6, wherein, In the light-condensing step, When the light condensing position in the direction along the line is in an error region when the modified region exceeds the error detection position on the polishing scheduled position side in the monitoring step, the position of the light condensing lens in the optical axis direction is fixed.
9. 9. The object processing method according to claim 7, wherein, In the light-condensing step, When the light condensing position in the direction along the line is in an error region when the modified region exceeds the error detection position on the polishing scheduled position side in the monitoring step, the position of the light condensing lens in the optical axis direction is fixed.
10. 10. The method for processing an object according to any one of claims 1 to 6, wherein, In the light-condensing step, When the light collecting position in the direction along the line is in an error region when the modified region exceeds the error detection position on the polishing scheduled position side in the monitoring step, a control parameter related to the follow-up of the light collecting position is changed so as to make the follow-up dull.
11. 11. The object processing method according to claim 7, wherein, In the light-condensing step, When the light collecting position in the direction along the line is in an error region when the modified region exceeds the error detection position on the polishing scheduled position side in the monitoring step, a control parameter related to the follow-up of the light collecting position is changed so as to make the follow-up dull.
12. 12. The method for processing an object according to any one of claims 1 to 6, wherein, In the light-condensing step, When the condensed position in the direction along the line is in an error region when the modified region exceeds the error detection position on the side of the planned grinding position in the monitoring step, the irradiation of the laser beam onto the object is stopped.
13. 13. The object processing method according to claim 7, wherein, In the light-condensing step, When the condensed position in the direction along the line is in an error region when the modified region exceeds the error detection position on the side of the planned grinding position in the monitoring step, the irradiation of the laser beam onto the object is stopped.
14. 14. The method for processing an object according to any one of claims 1 to 6, wherein, In the monitoring step, when it is determined that the modified region exceeds the error detection position on the side of the planned polishing position, an error display is displayed on a display unit.
15. 15. The object processing method according to claim 7, wherein, In the monitoring step, when it is determined that the modified region exceeds the error detection position on the side of the planned polishing position, an error display is displayed on a display unit.
16. 16. A system for processing an object, wherein, The device is provided with: a polishing device for polishing a portion of the object from the surface to a polishing target position; A laser processing device for irradiating the object with laser light along a line through a condenser lens before polishing by the polishing device, forming one or more lines of modified regions along the line between the surface of the object and the predetermined polishing position, The laser processing device comprises: A support unit that supports the object; an irradiation unit that irradiates the laser beam on the object through the condenser lens; a moving mechanism that moves at least one of the support portion and the irradiation portion to move a condensed position of the laser beam; an actuator that drives the condenser lens in an optical axis direction of the condenser lens; a measurement data acquisition unit that acquires measurement data related to displacement of a laser light incident surface on which the laser light is incident in the object; a control unit that controls the irradiation unit, the movement mechanism, and the actuator, The control section performs a condensing process and a monitoring process, In the light condensing processing, at least one of the support part and the irradiation part is moved along the line so as to move the light condensing position of the laser light along the line, and at least one of the support part and the light condensing lens is moved along the optical axis direction based on the measurement data so as to make the light condensing position follow the displacement of the laser light incident surface, In the monitoring process, when at least one of the support portion and the condensing lens is moved in the optical axis direction based on the measurement data so that the condensed position follows the displacement of the laser light incident surface, it is monitored whether or not the modified region formed by the condensed light of the laser light to the condensed position exceeds an error detection position determined between a planned formation position of the modified region closest to the planned polishing position side and the planned polishing position on the planned polishing position side in the optical axis direction.

Description

Object processing method and object processing system Technical Field The present invention relates to an object processing method and an object processing system. Background There is known a method for processing an object, which comprises a polishing step of polishing a portion of the object from a surface to a predetermined polishing position, and a laser processing step of irradiating the object with laser light along a line before the polishing step via a condenser lens to form a modified region along the line between the surface of the interior of the object and the predetermined polishing position (for example, refer to japanese patent application laid-open No. 2009-131942). In the laser processing step of such an object processing method, a condensed position of the laser light condensed inside the object is moved along a line, and the condensed position is caused to follow the displacement of the laser light incident surface. Disclosure of Invention In the above-described technique, when a laser beam condensing position (hereinafter, also simply referred to as "condensing position") is caused to follow a laser beam incident surface, the condensing position may be greatly displaced locally in the optical axis direction of the condensing lens due to, for example, vibration, irregularities, reflectance changes, cracks, and the like of an object. In this case, a modified region may be formed in a portion of the object that exceeds a predetermined polishing position (i.e., a portion that is not removed by polishing) on the opposite side to the front surface side, and the modified region may remain in the object after polishing. As a result, the quality of the polished object is deteriorated. Hereinafter, the exceeding (moving) on the opposite side to the front surface side will also be simply referred to as "exceeding". Accordingly, an object of the present invention is to provide a method and a system for processing an object, which can suppress a modified region remaining in the object after polishing. The object processing method according to one aspect of the present invention includes a polishing step of polishing a portion of an object from a surface to a predetermined polishing position, a laser processing step of irradiating the object with laser light via a condensing lens before the polishing step along a line, forming one or more rows of modified regions along the line between the surface inside the object and the predetermined polishing position, the laser processing step including a data acquisition step of acquiring measurement data concerning displacement of a laser light incident surface of the object, a condensing step of moving a condensing position of the laser light along the line while irradiating the condensing position with displacement of the laser light incident surface based on the measurement data, and a monitoring step of monitoring, in a case where the condensing position is made to follow the displacement of the laser light incident surface based on the measurement data, whether or not a modified region formed by condensing the laser light toward the condensing position exceeds an error detection position determined between a predetermined forming position of the modified region closest to the predetermined polishing position side and the predetermined polishing position in an optical axis direction of the condensing lens. In the object processing method, when the condensed position is caused to follow the displacement of the laser light incident surface, it is monitored whether or not a modified region formed by condensing light to the condensed position exceeds an error detection position determined on the surface side of the planned polishing position. Therefore, when the modified region is determined to be beyond the error detection position as a result of the monitoring, for example, the condensed position is not brought close to the polishing target position therebetween, and thus the modified region can be processed so as not to exceed the polishing target position. That is, the modified region remaining in the object after polishing can be suppressed. In the object processing method according to the aspect of the present invention, in the monitoring step, when the condensed position is caused to follow the displacement of the laser light incident surface based on the measurement data, a detour amount corresponding to the amount of displacement in the optical axis direction when the position of the modified region formed by the condensed light of the laser light to the condensed position is displaced from the predetermined position for forming the modified region may be calculated, and whether or not the detour amount exceeds the distance in the optical axis direction from the predetermined position for forming to the error detection position may be monitored. In this case, whether the modified region exceeds the error detection position on the planned polishing posi