CN-115250097-B - Method for manufacturing a plurality of vibration devices

Abstract

Provided is a method for manufacturing a vibration device, which can be manufactured with a small number of steps. The method for manufacturing the vibration device includes preparing a base wafer including a plurality of singulation regions, disposing a vibration element on a1 st surface side of the base wafer, bonding a lid wafer to the base wafer to obtain a device wafer having a housing portion for housing the vibration element for each singulation region, forming a1 st groove extending from the lid wafer side to a2 nd surface side of a bonding portion between the base wafer and the lid wafer at a boundary portion of adjacent singulation regions of the device wafer, disposing a resin material in the 1 st groove, and forming a2 nd groove penetrating the device wafer and having a width smaller than a width of the 1 st groove at the boundary portion, and singulating the device wafer for each singulation region to obtain a plurality of vibration devices.

Inventors

• MURATA AKIHIRO

Assignees

• 精工爱普生株式会社

Dates

Publication Date

20260505

Application Date

20220424

Priority Date

20210426

Claims (10)

1. 1. A method of manufacturing a plurality of vibration devices, the method comprising: Preparing a base wafer having a1 st face and a2 nd face with surfaces opposite to each other, and including a plurality of 1 st singulation areas, with a1 st boundary portion between adjacent 1 st singulation areas of the plurality of 1 st singulation areas; Disposing a vibration element on the 1 st surface side of the base wafer for each 1 st singulation zone of the plurality of 1 st singulation zones; Bonding a cover wafer to the 1 st face of the base wafer via a plurality of metal layers, the cover wafer having a plurality of 2 nd singulation regions corresponding to the plurality of 1 st singulation regions, each 2 nd singulation region of the plurality of 2 nd singulation regions having a recess for receiving the vibrating element, respectively, a2 nd boundary portion being provided between adjacent 2 nd singulation regions of the plurality of 2 nd singulation regions, the 1 st boundary portion being aligned with the 2 nd boundary portion, each metal layer of the plurality of metal layers surrounding the vibrating element in plan view, a gap being formed between adjacent metal layers of the plurality of metal layers, and between an end of the 1 st boundary portion and an end of the 2 nd boundary portion; Forming a1 st slot at the 1 st boundary portion and the 2 nd boundary portion, the 1 st slot completely penetrating the 2 nd boundary portion of the lid wafer and penetrating at least a portion of the 1 st boundary portion of the base wafer; Disposing a resin material in the 1 st slot in such a manner that the resin material fills the gap and the 1 st slot, and And forming a 2 nd groove with a width smaller than that of the 1 st groove along the 1 st boundary part and the 2 nd boundary part, thereby obtaining the plurality of vibration devices.
2. 2. The method for manufacturing a plurality of vibration devices according to claim 1, wherein, The 1 st slot is bottomed.
3. 3. The method for manufacturing a plurality of vibration devices according to claim 1, wherein, The 1 st slot penetrates the 1 st boundary portion of the base wafer.
4. 4. The method for manufacturing a plurality of vibration devices according to any one of claims 1 to 3, wherein, In the step of disposing the resin material, the resin material is also disposed on a top surface of the lid wafer opposite to the base wafer.
5. 5. The method for manufacturing a plurality of vibration devices according to any one of claims 1 to 3, wherein, An outer edge of each of the plurality of metal layers is located inside an outer edge of each of the 1 st singulation areas of the plurality of 1 st singulation areas in a plan view.
6. 6. The method for manufacturing a plurality of vibration devices according to claim 5, wherein, After bonding the cap wafer to the base wafer, and before forming the 1 st slot, the gap is surrounded by the base wafer, the cap wafer, and adjacent metal layers of the plurality of metal layers.
7. 7. The method for manufacturing a plurality of vibration devices according to any one of claims 1 to 3, wherein, In the step of bonding the lid wafer, the base wafer and the lid wafer are subjected to surface-active bonding.
8. 8. The method for manufacturing a plurality of vibration devices according to any one of claims 1 to 3, wherein, The 1 st groove is formed in a state where the holding member holds the 2 nd surface of the base wafer.
9. 9. The method for manufacturing a plurality of vibration devices according to any one of claims 1 to 3, wherein, The base wafer is a semiconductor substrate, An oscillating circuit is disposed in each 1 st singulation zone of the plurality of 1 st singulation zones of the base wafer.
10. 10. The method for manufacturing a plurality of vibration devices according to claim 9, wherein, The cap wafer is a semiconductor substrate and is electrically connected to the base wafer by being bonded to the base wafer in the step of bonding the cap wafer.

Description

Method for manufacturing a plurality of vibration devices Technical Field The present invention relates to a method of manufacturing a vibration device. Background The piezoelectric vibrator described in patent document 1 includes a package in which a lid and a base are joined via a joining member, a vibrating element housed in a housing portion that is an internal space of the package, and a cover member that covers the joining portion of the lid and the base to protect the portion from moisture. The cover member is formed by dividing piezoelectric vibrators in a wafer state into individual pieces, and then coating each piezoelectric vibrator with a resin material. Patent document 1 Japanese patent application laid-open No. 2018-117243 However, in the method of forming the cover member by applying the resin material to each of the individual piezoelectric vibrators, there is a problem that the manufacturing time of the cover member becomes large. Disclosure of Invention The method for manufacturing a vibration device is characterized by comprising the steps of preparing a base wafer having a1 st surface and a2 nd surface in a positive-negative relationship and comprising a plurality of singulation regions, disposing a vibration element on the 1 st surface side of the base wafer for each singulation region, preparing a cap wafer comprising a plurality of singulation regions, bonding the cap wafer to the 1 st surface of the base wafer to obtain a device wafer having a housing portion for housing the vibration element for each singulation region, forming a1 st groove extending from the cap wafer side to the 2 nd surface side than the bonding portion between the base wafer and the cap wafer at the boundary portion, and forming a2 nd groove penetrating the device wafer and having a width narrower than the 1 st groove at the boundary portion, and bonding the plurality of devices to the singulation wafer for each singulation region. Drawings Fig. 1 is a cross-sectional view showing a vibration device according to embodiment 1, and is a cross-sectional view taken along line A-A in fig. 2. Fig. 2 is a plan view showing the upper surface of the susceptor. Fig. 3 is a process diagram showing a process of manufacturing the vibration device. Fig. 4 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 5 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 6 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 7 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 8 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 9 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 10 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 11 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 12 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 13 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 14 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 15 is a cross-sectional view showing a vibration device according to embodiment 2. Fig. 16 is a process diagram showing a process of manufacturing the vibration device. Fig. 17 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 18 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 19 is a sectional view for explaining a manufacturing method of the vibration device. Fig. 20 is a cross-sectional view showing a vibration device according to embodiment 3. Fig. 21 is a cross-sectional view showing a vibration device according to embodiment 4. Description of the reference numerals 1, A vibration device; 1A, a device; 10, packaging; 100 parts of the device wafer, 110 parts of the 1 st groove, 120 parts of the 2 nd groove, 2 parts of the 2 nd base, 2a parts of the 2a upper surface, 2c1 parts of the 2c2 parts of the 2c side, 20 parts of the base wafer, 20a parts of the upper surface, 20b parts of the lower surface, 21 parts of the through hole, 210 parts of the through hole, 22 parts of the through hole, 220 parts of the through hole, 25 parts of the external terminal, 26 parts of the insulating film, 27 parts of the step, 28 parts of the wiring, 29 parts of the wiring, 3 parts of the 3a parts, 3b parts of the lower surface, 3c parts, 30 parts of the cover wafer, 30 parts of the 3b parts, 31 parts of the recess, 4 parts of the vibration element, 41 parts of the vibration substrate, 42 parts, 421 parts, the excitation electrode, 422 parts, 423 parts of the terminal, 424 parts of the terminal, the wiring, 426 parts of the 6 parts of the integrated circuit, 6 parts of the oscillating circuit, 60 parts of the laminated body, 62 parts, 63 par