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CN-115274502-B - Wafer de-bonding device

CN115274502BCN 115274502 BCN115274502 BCN 115274502BCN-115274502-B

Abstract

The invention relates to the technical field of wafers, in particular to a wafer de-bonding device which comprises a de-bonding machine body table, a de-bonding head, a de-bonding seat, a wafer, a discharging seat, a separating seat, a rotating disc, three connecting plates, three carrying rings and a sliding frame, wherein the discharging seat and the separating seat are all fixed on the upper side of the de-bonding machine body table, the rotating disc is arranged on the upper side of the de-bonding machine body table, a dual driving assembly is arranged between the rotating disc and the de-bonding machine body table, the three connecting plates are all fixed on the outer side of the rotating disc, the carrying rings are respectively fixed on one side of the connecting plates, the de-bonding seat, the discharging seat and the separating seat can be arranged on the inner side of the carrying rings, and the sliding frame can slide on the upper side of the de-bonding machine body table. According to the invention, the automatic material changing, continuous processing, automatic discharging, automatic sorting and automatic stacking functions are realized by arranging the material placing seat, the separating seat, the rotating disk, the connecting plate, the carrying ring, the sliding frame, the positioning frame and the fixed cover.

Inventors

  • QIU XINZHI

Assignees

  • 苏州芯睿科技有限公司

Dates

Publication Date
20260512
Application Date
20220725

Claims (6)

  1. 1. The wafer de-bonding device comprises a de-bonding machine body table (1), a de-bonding head (2), a de-bonding seat (3) and a wafer (4), and is characterized by further comprising: The device comprises a discharging seat (5) and a separating seat (6), wherein the discharging seat (5) and the separating seat (6) are fixed on the upper side of a de-bonding machine body table (1); The rotary disc (7) is arranged on the upper side of the de-bonding machine body table (1), and a double driving assembly is arranged between the rotary disc (7) and the de-bonding machine body table (1); the three connecting plates (8), the connecting plates (8) are all fixed on the outer side of the rotating disc (7); The three carrying rings (9), the carrying rings (9) are respectively fixed on one side of the connecting plate (8), and the de-bonding seat (3), the discharging seat (5) and the separating seat (6) can be arranged on the inner side of the carrying rings (9); The automatic material taking and discharging device comprises a sliding frame (10), wherein the sliding frame (10) can slide on the upper side of a de-bonding machine body table (1), an automatic sliding component is arranged on one side of the sliding frame (10), a material taking and discharging component is arranged on one side of the sliding frame (10), and a sorting and material storing component is arranged on the upper side of the de-bonding machine body table (1); The dual drive assembly comprises a fixed cover (12), the upper side at keyless entry (1) is fixed to fixed cover (12), fixed cover (12) upside is equipped with the through-hole, fixed cover (12) top inboard is fixed and is equipped with A servo motor (13), A servo motor (13) need pass through external drive control ware of wire and power, the fixed square pole (14) that is equipped with of axle head of A servo motor (13), square pole (14) outside slidable is equipped with uide bushing (15), rotary disk (7) one side is equipped with the square hole, uide bushing (15) are fixed in the square hole inboard, fixed cover (12) upside is fixed and is equipped with supporting ring frame (16), supporting ring frame (16) upside is equipped with a plurality of mounting holes, the inboard all is fixed and is equipped with A electric telescopic push rod (17), A electric telescopic push rod (17) all need be through wire external power supply switch, rotary disk (7) downside rotatable be equipped with swivel ring (18), the lower swivel ring (18) of all is fixed at the swivel ring (18) of A electric shaft end (17).
  2. 2. The wafer de-bonding device according to claim 1, wherein a plurality of evenly distributed positioning frames (11) are fixedly arranged on the outer side of the discharging seat (5).
  3. 3. A wafer debonding apparatus according to claim 1, wherein the carriage (10) is of a Z-type configuration.
  4. 4. The wafer bonding-releasing device according to claim 1, wherein the automatic sliding component comprises a B servo motor (19), the B servo motor (19) is fixed on the upper side of the bonding-releasing machine body table (1), the B servo motor (19) is required to be externally connected with a driving controller and a power supply through a wire, a threaded rod (20) is fixedly arranged at the shaft end of the B servo motor (19), a plurality of connecting seats (21) are rotatably arranged on the outer side of the threaded rod (20), the connecting seats (21) are all fixed on the upper side of the bonding-releasing machine body table (1), a threaded hole is formed in one side of the sliding frame (10), and the threaded rod (20) is connected on the inner side of the threaded hole through threads.
  5. 5. The bonding device for removing wafers according to claim 1, wherein the material taking and placing assembly comprises a square box (22), a through hole is formed in the upper side of the sliding frame (10), the square box (22) is fixed on the inner side of the through hole, a connecting hole is formed in the upper side of the square box (22), a B electric telescopic push rod (23) is fixedly arranged on the inner side of the connecting hole, the B electric telescopic push rod (23) is required to be externally connected with a power supply and a switch through a wire, a lifting column (24) is fixedly arranged at the shaft end of the B electric telescopic push rod (23), the lifting column (24) can slide on the inner side of the square box (22), a material taking frame (25) is fixedly arranged on the lower side of the lifting column (24), a plurality of material taking holes are formed in the upper side of the material taking frame (25), vacuum sucking discs (26) are fixedly arranged on the inner sides of the material taking holes, and the vacuum sucking discs (26) are required to be externally connected with a vacuum generator through air pipes.
  6. 6. The wafer de-bonding device according to claim 1, wherein the sorting stock assembly comprises a fixed column (27), the fixed column (27) is fixed on the upper side of the de-bonding machine body table (1), a stock plate (28) is slidably arranged on the outer side of the fixed column (27), a driving hole is formed in the upper side of the stock plate (28), a C-shaped electric telescopic push rod (29) is fixedly arranged on the inner side of the driving hole, the C-shaped electric telescopic push rod (29) is externally connected with a power supply and a switch through wires, and the shaft end of the C-shaped electric telescopic push rod (29) is fixed on the upper side of the de-bonding machine body table (1).

Description

Wafer de-bonding device Technical Field The invention relates to the technical field of wafers, in particular to a wafer de-bonding device. Background Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer. Domestic wafer lines are mainly 8 inches and 12 inches. The bonding-off is an important step in the wafer production process, and is mainly used for separating bonded silicon wafers from glass plates, and the current bonding-off machine can send out laser through the bonding-off head and then separate the silicon wafers from the glass plates through the laser. The prior art can separate the silicon chip from the glass plate, but after the separation is completed, the silicon chip and the glass plate are manually taken away and classified, then the wafer to be processed is placed on a de-bonding seat of the de-bonding machine, and then the separation processing can be continued. Disclosure of Invention The invention aims to solve the problems that a bonding machine in the prior art can separate a silicon wafer from a glass plate, but after the separation is completed, the silicon wafer and the glass plate are manually taken away and classified, then a wafer to be processed is placed on a bonding-releasing seat of the bonding machine, and then the separation processing can be continued, and the mode of changing materials is slower, so that the defect of lower working efficiency is caused. In order to achieve the above purpose, the present invention adopts the following technical scheme: the wafer debonding device comprises a debonding machine body table, a debonding head, a debonding seat and a wafer, and further comprises: The device comprises a discharging seat and a separating seat, wherein the discharging seat and the separating seat are fixed on the upper side of a de-bonding machine body table; the rotary disc is arranged on the upper side of the bonding-off machine body table, and a double driving assembly is arranged between the rotary disc and the bonding-off machine body table; The three connecting plates are fixed on the outer side of the rotating disc; the three carrying rings are respectively fixed on one side of the connecting plate, and the de-bonding seat, the discharging seat and the separating seat can be arranged on the inner side of the carrying rings; the sliding frame is arranged on the upper side of the de-bonding machine body table in a sliding mode, an automatic sliding component is arranged on one side of the sliding frame, a material taking and discharging component is arranged on one side of the sliding frame, and a sorting material storing component is arranged on the upper side of the de-bonding machine body table. Preferably, a plurality of evenly distributed positioning frames are fixedly arranged on the outer side of the discharging seat. Preferably, the dual drive assembly includes fixed cover, fixed cover fixes the upside at the machine body platform of unbuckling, fixed cover upside is equipped with the through-hole, fixed cover top inboard is fixed to be equipped with A servo motor, A servo motor needs to pass through external drive control ware of wire and power, the fixed square pole that is equipped with of axle head of A servo motor, square pole outside slidable is equipped with the uide bushing, rotary disk one side is equipped with the square hole, the uide bushing is fixed in the square hole inboard, fixed cover upside is fixed and is equipped with the supporting ring frame, the supporting ring frame upside is equipped with a plurality of mounting holes, the inboard all is fixed and is equipped with A electric telescopic push rod of mounting hole, A electric telescopic push rod all need be through the external power switch of wire, rotary disk downside rotatable be equipped with rotatory ring, the axle head of A electric telescopic push rod all is fixed in the downside of rotatory ring. Preferably, the sliding frame is of a Z-shaped structure. Preferably, the automatic sliding assembly comprises a B servo motor, the B servo motor is fixed on the upper side of the de-bonding machine body table, the B servo motor is required to be externally connected with a driving controller and a power supply through a wire, a threaded rod is fixedly arranged at the shaft end of the B servo motor, a plurality of connecting seats are rotatably arranged on the outer side of the threaded rod, the connecting seats are all fixed on the upper side of the de-bonding machine body table, a threaded hole is formed in one side of the sliding frame, and the threaded rod is connected on the inner side of the threaded hole through threads. Preferably, get blowing suba