CN-115298775-B - Double-winding embedded solenoid inductor constructed by layering process

Abstract

A method for constructing a solenoid inductor includes positioning an inner winding substantially around a magnetic core, positioning an outer winding substantially around the inner winding, and performing the positioning of the inner and outer windings using a layering process. The layering process includes machining the first conductive layer as a bottom layer of the outer winding, machining the first dielectric layer thereon, machining the second conductive layer thereon as a bottom layer of the inner winding, machining the second dielectric layer thereon, machining the magnetic core layer thereon, machining the third dielectric layer thereon, machining the third conductive layer thereon as a top layer of the inner winding, machining the fourth dielectric layer thereon, machining the fourth conductive layer thereon as a top layer of the outer winding, machining the fifth dielectric layer thereon, and the inner winding is electrically connected to the outer winding.

Inventors

• Alexei S. Henkin
• DAVID PATTEN
• YAN JUN

Assignees

• 思睿逻辑国际半导体有限公司

Dates

Publication Date

20260508

Application Date

20210310

Priority Date

20210211

Claims (20)

1. 1. A method for constructing a solenoid inductor, comprising: positioning the inner winding substantially around the magnetic core; positioning an outer winding substantially around the inner winding, and The positioning of the inner winding and the outer winding is performed using a layering process, Wherein the using a layering process comprises: Processing a first conductive layer as a bottom layer of the outer winding; processing a first dielectric layer over the first conductive layer; Processing a second conductive layer over the first dielectric layer as a bottom layer of the inner winding; Processing a second dielectric layer over the second conductive layer; Processing a magnetic core layer over the second dielectric layer; Processing a third dielectric layer over the magnetic core layer; Processing a third conductive layer over the third dielectric layer that is a top layer of the inner winding; processing a fourth dielectric layer over the third conductive layer; Processing a fourth conductive layer over the fourth dielectric layer that is a top layer of the outer winding; Processing a fifth dielectric layer over the fourth conductive layer, and Wherein the inner winding and the outer winding are electrically connected.
2. 2. The method of claim 1, wherein the using a layering process further comprises: processing vertical conductors through the first, second, third and fourth dielectric layers to electrically connect bottom and top layers of the outer winding, and Vertical conductors are fabricated through the second and third dielectric layers to electrically connect the bottom and top layers of the inner winding.
3. 3. The method of claim 2, wherein the using a layering process further comprises: for the first conductive layer, the second conductive layer each of the third conductive layer and the fourth conductive layer: Separating the conductive layer into a plurality of conductors; Wherein the processing the vertical conductors through the first, second, third, and fourth dielectric layers to electrically connect the bottom and top layers of the outer winding includes electrically connecting corresponding ones of the plurality of conductors of the bottom and top layers of the outer winding to form corresponding turns of the outer winding, and Wherein the processing the vertical conductors through the second and third dielectric layers to electrically connect the bottom and top layers of the inner winding includes electrically connecting corresponding ones of the plurality of conductors of the bottom and top layers of the inner winding to form corresponding turns of the inner winding.
4. 4. The method of claim 1, wherein the inner and outer windings are electrically connected in series and in a manner that generates a non-opposing magnetic field in the magnetic core.
5. 5. The method of claim 4, further comprising: Positioning an additional winding substantially around the inner winding and the outer winding using the layering process; wherein each successive additional winding of the additional windings is positioned substantially around the previous additional winding, and Wherein the inner and outer windings and the additional winding are electrically connected in series and in a manner that generates a non-opposing magnetic field in the magnetic core.
6. 6. The method of claim 1, wherein the inner winding and the outer winding are electrically connected in a manner that generates a reverse magnetic field in the magnetic core.
7. 7. The method of claim 6, wherein the inner winding and the outer winding have different numbers of turns.
8. 8. The method of claim 7, wherein the different number of turns provides substantially matched respective inductance values of the inner winding and the outer winding.
9. 9. The method of claim 6, further comprising: Positioning an even number of additional windings substantially around the inner winding and the outer winding using the layering process; wherein each successive additional winding of the additional windings is positioned substantially around the previous additional winding, and Wherein the inner and outer windings and the additional winding are electrically connected in such a way that the outer halves of all winding layers generate a magnetic field in the magnetic core that is opposite to the magnetic field generated in the magnetic core by the inner halves of all winding layers.
10. 10. The method of claim 6, wherein the inner winding and the outer winding have the same number of turns.
11. 11. The method of claim 1, wherein the solenoid inductor is implemented as an integrated circuit device.
12. 12. The method of claim 1, wherein the solenoid inductor is constructed as a discrete device.
13. 13. The method of claim 1, wherein the solenoid inductor is constructed as part of an integrated circuit package having one or more active or passive devices.
14. 14. The method of claim 1, wherein the solenoid inductor is constructed as a component of a multi-layer laminate printed circuit board.
15. 15. A solenoid inductor constructed in accordance with the method of claim 1.
16. 16. A solenoid inductor constructed in accordance with the method of claim 2.
17. 17. A solenoid inductor constructed in accordance with the method of claim 3.
18. 18. A solenoid inductor constructed in accordance with the method of claim 4.
19. 19. A solenoid inductor constructed in accordance with the method of claim 5.
20. 20. A solenoid inductor constructed in accordance with the method of claim 6.

Description

Double-winding embedded solenoid inductor constructed by layering process Cross Reference to Related Applications The present application is based on U.S. provisional application Ser. No. 62/989,076, titled LAYERED PROCESS-CONSTRUCTED DOUBLE-WINDING EMBEDDED SOLENOID INDUCTOR, filed on 3/13 of 2020, the entire contents of which are incorporated herein by reference in their entirety. Background Inductors are an important element in many electronic applications. Historically, inductors have been used for applications such as radio frequency and mechanical related applications. Recently, inductors are used in, for example, cell phones, notebook computers, and medical devices. In many of these applications, embedded inductors are desirable. Inductors come in a variety of shapes and sizes such as planar inductors, toroidal inductors, spiral inductors, and the like. One type of inductor that is in increasing demand is an embedded solenoid inductor with a magnetic core. Due to the space requirements of many applications, a need has arisen for embedded solenoid inductors with increased inductance to size ratios. Disclosure of Invention Embodiments of a method for constructing an embedded solenoid inductor using a layering process for positioning an inner winding around a magnetic core and an outer winding around the inner winding are described. The layering process includes machining a bottom conductive layer of the outer winding, machining a first dielectric layer over it, machining a bottom conductive layer of the inner winding over it, machining a second dielectric layer over it, machining a magnetic core layer over it, machining a third dielectric layer over it, machining a top conductive layer of the inner winding over it, machining a fourth dielectric layer over it, machining a top conductive layer of the outer winding over it, machining a fifth dielectric layer over it, and the inner and outer windings are electrically connected. The process may further include machining vertical conductors through the first, second, third, and fourth dielectric layers to electrically connect the bottom and top layers of the outer winding, and machining vertical conductors through the second and third dielectric layers to electrically connect the bottom and top layers of the inner winding. For each conductive layer, the process may further include separating the conductive layer into a plurality of conductors, electrically connecting corresponding ones of the plurality of conductors of the bottom and top layers of the outer winding using some of the vertical conductors to form corresponding turns of the outer winding, and electrically connecting corresponding ones of the plurality of conductors of the bottom and top layers of the inner winding using some of the vertical conductors to form corresponding turns of the inner winding. The inner and outer windings may be connected to generate a non-opposing magnetic field in the magnetic core, or they may be connected to generate an opposing magnetic field in the magnetic core. In the case of a reverse magnetic field, the inner and outer windings may have different numbers of turns to provide substantially matched inductance values. A layering process may be used to position an even number of additional windings around the inner and outer windings such that each successive additional winding is positioned substantially around the previous additional winding. The layering process may be used to build solenoid inductors as part of an integrated circuit device, a discrete device, an integrated circuit package with one or more active or passive devices, or as part of a multi-layer laminated Printed Circuit Board (PCB). In one embodiment, the present disclosure provides a method for constructing a solenoid inductor, the method comprising positioning an inner winding substantially around a magnetic core, positioning an outer winding substantially around the inner winding, and performing the positioning of the inner and outer windings using a layering process. The method may further include processing a first conductive layer as a bottom layer of the outer winding, processing a first dielectric layer over the first conductive layer, processing a second conductive layer over the first dielectric layer as a bottom layer of the inner winding, and processing a second dielectric layer over the second dielectric layer, processing a magnetic core layer over the second dielectric layer, processing a third dielectric layer over the magnetic core layer, processing a third conductive layer over the third dielectric layer as a top layer of the inner winding, processing a fourth dielectric layer over the third conductive layer, processing a fourth conductive layer over the fourth dielectric layer as a top layer of the outer winding, processing a fifth dielectric layer over the fourth conductive layer, and the inner and outer windings are electrically connected. The method may further include electric