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CN-115373490-B - Computing system with support rack for liquid cooled cold plate mechanism

CN115373490BCN 115373490 BCN115373490 BCN 115373490BCN-115373490-B

Abstract

The invention discloses a computing system with a support frame for a liquid cooling cold plate mechanism, wherein the computing system comprises a shell, a circuit board, a fixing frame, a support frame and a cold plate. The circuit board comprises at least one electronic element. The fixing frame is fixed on the shell. The support frame is pivotally coupled to the fixing frame. The cold plate is coupled to the support frame. The support frame is pivotable between a first configuration and a second configuration. The cold plate contacts the at least one electronic component in the first configuration. The cold plate is released from contact with the at least one electronic component in the second configuration.

Inventors

  • CHEN CHAORONG
  • LIU KUNPEI

Assignees

  • 广达电脑股份有限公司

Dates

Publication Date
20260505
Application Date
20211208
Priority Date
20210901

Claims (11)

  1. 1.A computing system, comprising: a housing; the circuit board is arranged in the shell and comprises at least one electronic element; The fixing frame is fixed on the shell; a support pivotally coupled to the mount, the support being pivotable about a pivot axis between a first configuration and a second configuration, and A cold plate coupled to the lower side of the supporting frame, Wherein, in the first configuration, the support frame is parallel to the bottom plate of the casing, and the cold plate contacts the at least one electronic component for heat exchange; in the second configuration, the support bracket is angled relative to the bottom panel of the housing to disengage the cold plate from the at least one electronic component, thereby exposing the at least one electronic component for access, Wherein, the pivot of the supporting frame is separated from the bottom plate of the shell by a distance; wherein the height of the pivot of the support frame is adjustable to increase or decrease the distance from the bottom plate of the cabinet, said increase or decrease contributing to the variation in cold plate thickness.
  2. 2. The computing system of claim 1, wherein the mount is secured to a floor of the chassis.
  3. 3. The computing system of claim 1, wherein the mount includes a rim that prevents the support from pivoting when the support pivots from the first configuration to the second configuration.
  4. 4. The computing system of claim 1, wherein contact between the cold plate and at least one electronic component prevents the support shelf from rotating further toward the circuit board when in the first configuration.
  5. 5. The computing system of claim 1, further comprising: an inlet pipe coupled to the cold plate, and An outlet tube coupled to the cold plate, the inlet tube and the outlet tube being longitudinally routed in the support frame.
  6. 6. The computing system of claim 5, wherein the support frame includes a tube cover to maintain positioning of the inlet tube and the outlet tube when the support frame is pivoted between the first configuration and the second configuration.
  7. 7. The computing system of claim 1, wherein the support frame comprises a narrow frame portion and a wide frame portion, the narrow frame portion having a width less than a width of the wide frame portion, the narrow frame portion having a length greater than a length of the wide frame portion.
  8. 8. The computing system of claim 7, wherein the cold plate is coupled to the support frame at the wide frame portion of the support frame.
  9. 9. The computing system of claim 1, wherein the cold plate includes a plurality of flanges to which the support bracket is secured via fasteners received by the flanges.
  10. 10. The computing system of claim 1, wherein the circuit board is a motherboard and the at least one electronic component is a processor.
  11. 11. The computing system of claim 1, wherein the support bracket includes a handle to facilitate pivoting the support bracket between the first configuration and the second configuration.

Description

Computing system with support rack for liquid cooled cold plate mechanism Technical Field The present invention relates to thermal management (HEAT MANAGEMENT) in a plurality of computing systems, and in particular to a liquid-cooled cold plate mechanism for improving access to a plurality of electronic components in a plurality of computing systems. Background Computing systems typically have electronic components mounted in a housing. Examples of computing systems include desktop computers, blade servers, rack-mounted servers, and the like. Computing systems generally generate heat in typical operation, and therefore employ thermal management. Thermal management may be directed to some elements in a local computing system and/or to air that is common to all elements. Localized thermal management has focused on specific hardware elements of the computing system that generate heat, such as processors, mechanical disks (MECHANICAL DISK), power supplies, and the like. Common thermal management includes reducing the ambient temperature in the enclosure, such as by exhausting warmer air from the enclosure to the environment and extracting cooler air from the environment into the enclosure. The goal of thermal management is to cool the electronic components of the computing system so that such components do not operate outside of their respective ratings and/or are not damaged by overheating. Cooling the electronic component allows the computing system to operate at peak efficiency (PEAK EFFICIENCY). A heat sink (HEAT SINKS), a fan, a liquid cooling system using a heat exchanger, or the like is used in a specific electronic component. Components such as processors may be difficult to replace in the field as the liquid cools. Such elements are typically in contact with the cold plate. The cold plate should be removed initially to physically access PHYSICAL ACCESS such components. The present invention provides solutions that at least reduce the difficulty associated with physically accessing components of a computing system. Disclosure of Invention The term embodiment (embodiment) and similar terms are intended to broadly refer to all subject matter of the invention and claims hereinafter, similar terms being exemplified by implementation (configuration), aspect (aspect), example (instance), and option (option). The description including such terms should be understood not to limit the subject matter described herein, or to limit the meaning and scope of the claims that follow. Several embodiments of the invention covered herein are defined by the following claims and are not part of this disclosure. This summary is a high-level overview of several aspects of the present invention and introduces some concepts that are further described in the embodiments below. This summary is not intended to identify key or essential features of the claimed subject matter. This summary is not intended to be used solely to determine the scope of the claimed subject matter. The subject matter should be understood by reference to appropriate portions of the entire specification, any or all of the accompanying drawings, and claims. According to a particular aspect of the present invention, a computing system includes a housing, a circuit board, a mount, a support frame, and a cold plate. The circuit board comprises at least one electronic element. The fixing frame is fixed on the shell. The support frame is pivotally coupled to the fixing frame. The cold plate is coupled to the support frame. The support frame is pivotable between a first configuration and a second configuration. The cold plate contacts the at least one electronic component in a first configuration and the cold plate releases the at least one electronic component in a second configuration. In one embodiment, the fixing frame is fixed on a bottom plate of the casing, and the supporting frame is parallel to the bottom plate of the casing in the first configuration. In one embodiment, the mount includes an edge that prevents the support from pivoting when the support is changed from the first configuration to the second configuration. In one embodiment, the contact between the cold plate and the at least one electronic component prevents the support from over-rotating. In one embodiment, the computing system further includes an inlet tube and an outlet tube, both coupled to the cold plate. The inlet and outlet pipes are routed longitudinally in the support frame. In one embodiment, the support bracket includes a tube cover for maintaining the positioning of the inlet tube and the outlet tube when the support bracket is pivoted between the first configuration and the second configuration. In one embodiment, the support frame includes a narrow frame portion and a wide frame portion. The width of the narrow frame portion is smaller than that of the wide frame portion, and the length of the narrow frame portion is larger than that of the wide frame portion. In one embodime