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CN-115406222-B - Mounting leveling device, semiconductor process equipment and mounting leveling method

CN115406222BCN 115406222 BCN115406222 BCN 115406222BCN-115406222-B

Abstract

The application discloses a mounting leveling device, a mounting leveling method and semiconductor process equipment, and relates to the field of semiconductors. The mounting leveling device comprises a base mounting piece, a bearing piece, a plurality of driving mechanisms and a plurality of first detection elements, wherein the base mounting piece and the bearing piece are arranged at intervals, a through hole is formed in the base mounting piece, a process chamber penetrates through the through hole and is in butt joint with the bearing piece, the driving mechanisms are distributed on the base mounting piece, the driving ends of the driving mechanisms are connected with the bearing piece, the first detection elements are distributed on one of the base mounting piece and the bearing piece, the detection ends of the first detection elements face to the other, and the driving mechanisms and the first detection elements are electrically connected with a control device. A semiconductor processing apparatus includes the above-described mounting leveling device. An installation leveling method is used for installing and leveling a process chamber of semiconductor process equipment. The application at least can solve the problems of complex current leveling mode, high working difficulty, low precision and the like.

Inventors

  • MA YONGCHANG
  • ZHOU LIYING
  • SHI LEI
  • SONG XINFENG
  • YANG SHUAI

Assignees

  • 北京北方华创微电子装备有限公司

Dates

Publication Date
20260512
Application Date
20220826

Claims (11)

  1. 1. The semiconductor process equipment is characterized by comprising a lifting device (300), a process door (400), a process chamber (200) and a mounting and leveling device (100) for mounting and leveling the process chamber (200), wherein the mounting and leveling device (100) comprises a basic mounting piece (110), a bearing piece (120), a plurality of driving mechanisms (130) and a plurality of first detection elements (140); The base mounting piece (110) is arranged at intervals with the bearing piece (120), the base mounting piece (110) is provided with a through hole (111), and the process chamber (200) is used for penetrating through the through hole (111) and abutting against the bearing piece (120); the driving mechanisms (130) are distributed on the basic mounting piece (110), and the driving end of each driving mechanism (130) is connected with the bearing piece (120) respectively; the plurality of first detection elements (140) are distributed on one of the base mounting piece (110) and the bearing piece (120), and the detection ends of the first detection elements (140) are arranged towards the other and are used for detecting the distances between the corresponding positions of the base mounting piece (110) and the bearing piece (120); a plurality of the driving mechanisms (130) and a plurality of the first detection elements (140) are electrically connected with a control device of the semiconductor process equipment; The process chamber (200) is provided with a first opening, the bearing piece (120) is provided with a second opening (122), one end of the process chamber (200) provided with the first opening penetrates through the through hole (111) and is abutted with one side of the bearing piece (120), and the first opening is communicated with the second opening (122); The process door (400) is connected with the lifting end of the lifting device (300) and is located on one side, away from the process chamber (200), of the bearing piece (120), the lifting device (300) is used for driving the process door (400) to move towards or away from the base mounting piece (110), and in the process that the process door (400) moves towards the base mounting piece (110), the process door (400) can support the bearing piece (120) so that the bearing piece (120) is close to the base mounting piece (110).
  2. 2. The semiconductor processing apparatus of claim 1, wherein the mounting leveling device (100) further comprises a plurality of second detecting elements (150), the plurality of second detecting elements (150) being distributed on the carrier (120) for detecting the levelness of the carrier (120).
  3. 3. The semiconductor process apparatus of claim 1, wherein the driving mechanism (130) comprises a support (131) as the driving end, the support (131) being movably disposed between the base mount (110) and the carrier (120); the support (131) is adapted to be connected to the carrier (120).
  4. 4. A semiconductor process apparatus according to claim 3, wherein said drive mechanism (130) further comprises a rotary drive (132) and a screw (133), said rotary drive (132) being provided to said base mount (110), said screw (133) being in driving connection with said rotary drive (132) and extending between said base mount (110) and said carrier (120), said support (131) being in threaded connection with said screw (133); Or the driving mechanism (130) further comprises a telescopic driving piece and a telescopic rod, the telescopic driving piece is arranged on the base mounting piece (110), the telescopic rod is fixedly connected with the telescopic driving piece and extends to the position between the base mounting piece (110) and the bearing piece (120), and the supporting piece (131) is fixedly connected with the telescopic rod.
  5. 5. A semiconductor processing apparatus according to claim 3, wherein the mounting leveling device (100) further comprises a photoelectric sensor (161) and a shutter (162) cooperating with each other; One of the photoelectric sensor (161) and the shielding member (162) is provided to the base mounting member (110), and the other is provided to the supporting member (131); The photosensor (161) is electrically connected to a control device of the semiconductor processing apparatus.
  6. 6. A semiconductor process apparatus according to claim 3, characterized in that the support (131) is detachably connected to the carrier (120) by means of screws.
  7. 7. A semiconductor process equipment according to any one of claims 1 to 3, characterized in that a plurality of protrusions (121) are provided at the outer edge of the carrier (120); At least one of the first detection element (140), the second detection element (150) and the support (131) is arranged on one side of the protruding part (121) facing the base mounting piece (110).
  8. 8. The semiconductor processing apparatus of claim 1, wherein the mounting leveling device (100) further comprises a flexibly deformable heating element (170); The heating element (170) is arranged between the base mounting element (110) and the bearing element (120), surrounds the through hole (111) and is used for wrapping the periphery of the process chamber (200).
  9. 9. A mounting and leveling method for mounting and leveling a process chamber (200) of a semiconductor process apparatus according to any one of claims 1 to 8, characterized in that the mounting and leveling method comprises: the lifting device (300) drives the bearing piece (120) and the process chamber (200) to move upwards to a first preset position through the process door (400) and stops; The driving ends of the driving mechanisms (130) move downwards and are engaged with the bearing piece (120), and the driving mechanisms (130) drive the bearing piece (120) and the process chamber (200) to move upwards to a second preset position and stop; Detecting distances between corresponding positions of a base mounting piece (110) and the bearing piece (120) through a plurality of first detection elements (140), and starting at least part of the driving mechanism (130) to roughly adjust the levelness of the bearing piece (120) under the condition that the distances between the corresponding positions are unequal; the levelness of the bearing piece (120) is detected through a plurality of second detection elements (150), and under the condition that the levelness of the bearing piece (120) does not meet the level standard, at least part of the driving mechanism (130) is started, and the corresponding position of the bearing piece (120) is driven to move slightly through at least part of the driving mechanism (130) so as to finely adjust the levelness of the bearing piece (120).
  10. 10. The mounting leveling method according to claim 9, wherein the lifting device (300) drives the carrier (120) and the process chamber (200) to move upwards to a first preset position through the process door (400) at a first speed; The speed at which the plurality of driving mechanisms (130) drive the carrier (120) and the process chamber (200) to move upwards to a second preset position is a second speed; The first speed is greater than the second speed.
  11. 11. The mounting leveling method according to claim 9, characterized in that the mounting leveling device (100) comprises a photoelectric sensor (161) and a shutter (162) that are mutually matched, one of the photoelectric sensor (161) and the shutter (162) being provided to the base mount (110), the other being provided to the driving end of the driving mechanism (130); the driving mechanism (130) stops working under the condition that the shielding piece (162) shields the light of the photoelectric sensor (161) so as to prevent the driving end from colliding with the base mounting piece (110).

Description

Mounting leveling device, semiconductor process equipment and mounting leveling method Technical Field The application belongs to the technical field of semiconductors, and particularly relates to an installation leveling device, semiconductor process equipment and an installation leveling method. Background When some vertical furnace equipment performs a heat treatment process, byproducts are generated in the chamber and attached to the chamber wall, and long-term accumulation can affect the yield of products, so that after the products are subjected to several groups of processes, the chamber is disassembled for cleaning, such as a SIN machine. The cleaned chamber needs to be installed again, and the process is performed after the installation is completed, so that the installation convenience and rapidity are very important to the production rate of the machine, and meanwhile, the chamber is not damaged in the installation process. The leveling of the bottom of the cavity is an important step in installation, the leveling is used for tightly attaching the cavity opening to a process door for closing the cavity opening, the temperature in the cavity is high, the attachment is poor, cold points can be formed at the bottom of the cavity, byproducts can be attached to the cold points, product particles can be directly caused to exceed standards, meanwhile, heat loss can be caused due to poor attachment, and the quality of products in the cavity can be affected. The process chamber of the semiconductor process equipment in the related art is mainly provided with structures such as a chamber, a plurality of connecting blocks, a process door, a top plate, a flange, a gasket and the like, in the actual installation process of the chamber, the plurality of connecting blocks and the flange are connected, and then the connected mechanism moves upwards, so that the chamber passes through a central hole of the top plate, when workers observe that the upper surfaces of the plurality of connecting blocks are in contact with the lower surface of the top plate, the chamber stops rising, and then the screw is adopted for fixing. However, due to manufacturing dimensional errors, assembly errors, etc., the bottom of the flange is not level after the fixing is completed, and thus, it is necessary to insert a gasket between the connection block and the top plate and measure levelness in real time by using a level gauge to ensure the bottom level of the flange. The leveling process has human errors, is complex, has high working difficulty and reduces the installation efficiency of the process chamber. Disclosure of Invention The embodiment of the application aims to provide a mounting and leveling device, semiconductor process equipment and a mounting and leveling method, which at least can solve the problems of complex current leveling mode, high working difficulty, low precision and the like. In order to solve the technical problems, the application is realized as follows: The embodiment of the application provides a mounting and leveling device which is used for mounting and leveling a process chamber of semiconductor process equipment, and comprises a basic mounting piece, a bearing piece, a plurality of driving mechanisms and a plurality of first detection elements; The base mounting piece is arranged at intervals with the bearing piece, the base mounting piece is provided with a through hole, and the process chamber is used for penetrating through the through hole and abutting against the bearing piece; the driving mechanisms are distributed on the basic mounting piece, and the driving end of each driving mechanism is connected with the bearing piece respectively; The plurality of first detection elements are distributed on one of the base mounting piece and the bearing piece, and the detection ends of the first detection elements are arranged towards the other and are used for detecting the distances between the corresponding positions of the base mounting piece and the bearing piece; the driving mechanisms and the first detection elements are electrically connected with a control device of the semiconductor process equipment. The embodiment of the application also provides semiconductor process equipment, which comprises a lifting device, a process door, a process chamber and the installation leveling device; The process chamber is provided with a first opening, the bearing piece is provided with a second opening, one end of the process chamber provided with the first opening penetrates through the through hole of the base mounting piece and is abutted to one side of the bearing piece, and the first opening is communicated with the second opening; The process door is connected with the lifting end of the lifting device and is positioned on one side, away from the process chamber, of the bearing piece, the lifting device is used for driving the process door to move towards or away from the base mounting piece, and in th