CN-115458494-B - Component packaging for high power ASIC thermal management

Abstract

The present application relates to a component package for high power ASIC thermal management, and more particularly, to a cooling plate for cooling a microchip with redundant cooling fluid circulation, the cooling plate comprising a primary fluid cooling loop that removes heat directly from the microchip, and a secondary cooling loop that removes heat indirectly from the microchip by a condenser acting as a two-phase unit. The cooling plate may be manufactured in two parts, a lower plate and an upper plate, wherein the primary cooling circuit is formed in the lower plate and the secondary cooling circuit is formed in the upper plate. The separate two-phase unit can be immersed in the primary cooling loop and functions to transfer heat from the microchip to the secondary cooling loop.

Inventors

• GAO TIANYI

Assignees

• 百度（美国）有限责任公司

Dates

Publication Date

20260505

Application Date

20220211

Priority Date

20210608

Claims (14)

1. 1. A cooling plate for cooling a microchip, comprising: a lower plate comprising a main fluid cooling arrangement comprising a plurality of two-phase cooling units and a main cooling channel formed in the lower plate, wherein the plurality of two-phase cooling units are immersed in the main cooling channel; an upper plate attached to the lower plate and having a secondary fluid cooling arrangement fluidly separate from the primary fluid cooling arrangement, wherein the secondary fluid cooling arrangement comprises a secondary cooling channel formed in the upper plate, a fluid inlet port fluidly coupled to the secondary cooling channel, and a fluid outlet port fluidly coupled to the secondary cooling channel; wherein the primary cooling channel comprises cooling fins, the two-phase cooling unit comprises a wicking structure, and the cooling fins and the two-phase cooling unit are alternately arranged.
2. 2. The cooling plate of claim 1, wherein the primary fluid cooling arrangement further comprises: a primary fluid inlet port fluidly coupled to the primary cooling channel, and A primary fluid outlet port fluidly coupled to the primary cooling channel.
3. 3. The cooling plate of claim 1, wherein the secondary cooling channels comprise fins.
4. 4. The cooling plate of claim 1, further comprising a sealing ring disposed between the upper plate and the lower plate.
5. 5. The cooling plate of claim 1, further comprising a leak sensor.
6. 6. A method for manufacturing a cooling plate for a microchip, comprising: Providing a first metal plate, forming a main cooling channel and a plurality of two-phase cooling units in the first metal plate, and immersing the two-phase cooling units in the main cooling channel, thereby manufacturing a lower plate; providing a second metal plate and forming a secondary cooling channel, thereby manufacturing an upper plate; Fabricating a first set of access ports in the upper plate, the first set of access ports having fluid passages leading to the secondary cooling passages; Fabricating a second set of access ports in the upper plate, the second set of access ports having openings at a bottom surface of the upper plate to form fluid passages leading to the primary cooling passage after the upper plate is attached to the lower plate, and Cooling fins are formed in the main cooling passage, a wicking structure is provided inside the two-phase cooling unit, and the cooling fins and the two-phase cooling unit are alternately arranged.
7. 7. The method of claim 6, wherein attaching the upper plate to the lower plate comprises welding, brazing or bonding the upper plate to the lower plate.
8. 8. The method of claim 6, further comprising disposing a sealing ring between the upper plate and the lower plate.
9. 9. The method of claim 8, further comprising attaching a leak detector to one of the upper plate and the lower plate to detect a fluid leak between the upper plate and the lower plate.
10. 10. The method of claim 6, further comprising forming cooling fins in the secondary cooling channels.
11. 11. The method of claim 10, further comprising attaching the two-phase cooling unit to a bottom surface of the upper plate.
12. 12. A method of cooling a microchip using the cooling plate of any one of claims 1-5, comprising: attaching the cooling plate to the microchip; Circulating a primary cooling fluid through primary cooling channels in the cooling plate to partially remove heat generated by the microchip; A secondary cooling fluid is circulated through secondary cooling channels in the cooling plate to further remove heat generated by the microchip.
13. 13. The method of claim 12, further comprising removing a portion of the heat generated by the microchip by evaporating a fluid within the two-phase cooling unit and transferring the removed portion of the heat to the secondary cooling fluid by condensing the evaporated fluid.
14. 14. The method of claim 12, wherein the primary cooling fluid is used to partially remove heat directly from the microchip and the secondary cooling fluid is used to indirectly remove heat from the microchip.

Description

Component packaging for high power ASIC thermal management Technical Field Embodiments of the present invention generally relate to enhanced and reliable cooling of advanced microchips, such as ASICs and other microchips used in servers within data centers. Background Cooling is an important factor in the design of computer systems and data centers. The number of high performance electronic components, such as high performance processors, packaged inside servers has steadily grown, increasing the amount of heat generated and removed during normal operation of the servers. Proper operation of these processors is highly dependent on reliable removal of the heat generated by them. Thus, proper cooling of the processor may provide higher overall system reliability. Electronics cooling is extremely important for computing hardware and other electronic devices, such as CPU servers, GPU servers, storage servers, network devices, edge and mobile systems, in-vehicle computing boxes, and the like. All of these devices and computers are used for critical business and are the basis for business day-to-day business operations. The design of hardware components and electronics packages needs to be improved to continuously support performance requirements. Cooling of these electronic devices is becoming more and more challenging, ensuring their proper operation by continually providing a properly designed and reliable thermal environment. Many advanced chips, especially high power density chips, require liquid cooling. These chips are extremely expensive and therefore efforts are made to ensure that heat is properly removed from the chips. In addition, the liquid cooling device must be highly reliable because any irregular heat removal may result in chip loss, resulting in a loss of available computing power during replacement operations, and may even potentially impact the service level agreement handled by the lost chip. Importantly, existing electronics cooling and heat pipe understanding solutions for processors do not provide module level redundancy, meaning that they are a single point of failure in the system. In particular, failure of the cooling fluid to properly circulate within the cooling plate may cause the corresponding processor to fail. Thus, enhanced reliability may be achieved by developing a complete end-to-end redundant cooling solution for the chip, so that a single failure may be backed up by a redundant design. While liquid cooling solutions must provide the required thermal performance and reliability, the cost of the liquid cooling system must remain acceptable because data centers may have thousands of chips that require liquid cooling. The cost of the liquid cooling system may include the cost of introducing redundancy to enhance reliability. In addition, since different chips have different cooling requirements, it would be desirable to provide an adaptable and scalable cooling design to accommodate different server architectures and to be compatible with different chip packages. Drawings Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals refer to similar elements. Fig. 1 is a block diagram showing an example of a cold plate configuration according to one embodiment. Fig. 2 is a schematic diagram showing a cross section of a cooling plate according to an embodiment. Fig. 3 shows an embodiment of manufacturing a cold plate prior to final assembly to a package design. Fig. 4 shows another embodiment of manufacturing a cold plate prior to final assembly to a package design. Fig. 5 shows yet another embodiment of manufacturing a cold plate prior to final assembly to a package design. Fig. 6 shows a top view of a cooling plate according to an embodiment. Fig. 7 is a schematic diagram showing the flow of cooling fluid in a cooling plate according to an embodiment. Fig. 8 is a conceptual diagram illustrating a cooling function of a cold plate according to an embodiment. Fig. 9 is a conceptual diagram illustrating the manufacture of a cold plate according to an embodiment. Detailed Description Various embodiments and aspects of the invention will be described with reference to details discussed below, and the accompanying drawings will illustrate the various embodiments. The following description and drawings are illustrative of the invention and are not to be construed as limiting the invention. Numerous specific details are described to provide a thorough understanding of various embodiments of the invention. However, in some instances, well-known or conventional details are not described in order to provide a concise discussion of embodiments of the present inventions. Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodime