CN-115462190-B - Heat radiating device and antenna assembly using same

CN115462190BCN 115462190 BCN115462190 BCN 115462190BCN-115462190-B

Abstract

The invention discloses a heat dissipation device and an antenna assembly using the same. According to an embodiment of the invention, a heat dissipating device configured to cool a circuit board including at least one heat generating element includes a plate disposed to face the circuit board, a plurality of first heat dissipating fins disposed along a first direction on a side of the plate spaced apart from the circuit board, and a blowing portion disposed to face the side of the plate and including at least one fan configured to blow air toward the side of the plate, a space between two adjacent first heat dissipating fins being defined as a side passage configured to guide air blown by the at least one fan.

Inventors

JIN DELONG
ZHANG ZAIHAO
CUI GUIZHE
Cui Renhua
Zhao Yinzun
Pu Caixuan
Di Jiaoxing
Jin Huilian
LIU ZHIBAI
Cui Jingjuan

Assignees

株式会社KMW

Dates

Publication Date: 20260508
Application Date: 20210426
Priority Date: 20200429

Claims (12)

1. A heat sink configured to cool a circuit substrate including at least one heat generating element, comprising: A plate material arranged to face the circuit substrate; A plurality of first heat sinks arranged along a first direction on one side of the plate material spaced from the circuit substrate, and An air blowing portion disposed to face one side of the plate material and including a plurality of fans configured to blow air toward the one side of the plate material, The space between two adjacent first heat sinks is defined as a side channel, which is arranged to guide air blown by at least one of the fans, The air blowing part is arranged to face the second direction middle area of the plate material and is arranged along the first direction, Wherein the heat dissipating device further comprises a duct portion arranged to cover at least a portion of the plurality of first heat dissipating fins, the duct portion being provided to open and close at least one face of the side passage, The duct portion includes a first duct and a second duct spaced apart from the first duct in the second direction, the air supply portion is disposed between the first duct and the second duct, The duct portion further includes a plurality of duct pins arranged in a second direction on the first duct and the second duct, each of the duct pins extending in the first direction on the first duct and the second duct, the plurality of duct pins being exposed to the outside and being cooled by natural convection.
2. The heat sink as recited in claim 1, wherein: Each of the plurality of first heat sinks extends on one face of the plate along a second direction perpendicular to the first direction, The side channels are arranged to direct air blown by the at least one fan in the second direction.
3. The heat sink as recited in claim 1, wherein: The plurality of first cooling fins includes a plurality of first side cooling fins arranged along the first direction and a plurality of second side cooling fins arranged along the first direction and spaced apart from the first side cooling fins in a second direction, The space between two adjacent first side fins defines a first side channel, which is arranged to guide air blown by the at least one fan, The space between two adjacent second side fins defines a second side channel arranged to direct air blown by the at least one fan.
4. A heat sink according to claim 3, wherein: the spaces between the plurality of first side fins and the plurality of second side fins define an intermediate passage, the intermediate passage communicating with the first side passage and the second side passage, The intermediate passage is configured to direct air blown by the at least one fan in the first direction.
5. The heat sink as recited in claim 4, wherein: Further comprising a plurality of second heat sinks arranged along the second direction between the plurality of first side heat sinks and the plurality of second side heat sinks, Each of the plurality of second fins extends along the first direction.
6. The heat sink as recited in claim 5, wherein: the plurality of first side fins and the plurality of second side fins have a first height, The plurality of second fins have a second height that is less than the first height.
7. The heat sink as recited in claim 6, wherein: The intermediate passage includes a plurality of secondary passages defined by spaces between adjacent two of the second fins, and a primary passage communicating with the plurality of secondary passages.
8. A heat sink according to claim 3, wherein: Further comprising a plurality of protrusions protruding from one face of the plate between the plurality of first side fins and the plurality of second side fins.
9. The heat sink as recited in claim 1, wherein: The air supply part comprises a plurality of first fans rotating along a first rotating direction and a plurality of second fans rotating along a second rotating direction which is opposite to the first rotating direction, The first fans and the second fans are alternately arranged along the first direction.
10. The heat sink as recited in claim 1, wherein: The air supply part comprises a plurality of third fans arranged along the first direction and a plurality of fourth fans arranged along the first direction, The plurality of third fans and the plurality of fourth fans are adjacently arranged toward a second direction perpendicular to the first direction.
11. An antenna assembly, comprising: The heat dissipating apparatus of any one of claims 1 to 10, and The circuit substrate including the at least one heating element.
12. An antenna assembly as in claim 11, wherein: the heat generating element includes an RF element.

Description

Heat radiating device and antenna assembly using same Technical Field The invention relates to a heat dissipation device and an antenna assembly using the same. Background The statements in this section merely provide background information related to the present disclosure and may not constitute prior art. In the conventional antenna device, a convection cooling system using a heat sink and a fan is used to cool a heating element such as an RF element. Specifically, the conventional convection cooling method is a method in which a fin extends in a vertical direction, and a fan is disposed at an upper portion of the fin or a lower portion of the fin and cools the fin. However, such a conventional convection cooling method inevitably causes a problem in that the travel distance of air flowing between the fins is increased, and thus the cooling efficiency is lowered. For example, assuming that a fan is disposed at the lower portion of the heat sink, air blown by the fan cools the upper region of the heat sink after cooling the lower region of the heat sink. At this time, a part of the flowing air may leak to the outside, and thus the amount of air transferred to the upper region of the fin is smaller than the amount of air transferred to the lower region of the fin. In addition, since the air transferred to the upper region of the fin is already in a heated state due to other regions of the fin, it may be already in a high temperature state. Therefore, the conventional convection cooling method not only causes a decrease in the overall cooling efficiency, but also causes serious variation in the cooling performance of each region of the fin. Disclosure of Invention First, the technical problem to be solved In view of the above, a primary object of the present invention is to provide a heat sink capable of effectively cooling a heating element by convection and an antenna assembly using the heat sink. (II) technical scheme According to an embodiment of the invention, a heat dissipating device configured to cool a circuit board including at least one heat generating element includes a plate disposed to face the circuit board, a plurality of first heat dissipating fins disposed along a first direction on a side of the plate spaced apart from the circuit board, and a blower disposed to face the side of the plate and including at least one fan configured to blow air toward the side of the plate, a space between two adjacent first heat dissipating fins being defined as a side passage configured to guide the air blown by the at least one fan. (III) beneficial effects As described above, according to the present embodiment, the heat sink and the antenna assembly using the heat sink can effectively cool the heating element, and have the effect of minimizing problems that may occur in the heating element in a high temperature state, such as performance degradation of the heating element, damage to the heating element, and the like. Drawings Fig. 1 is a perspective view of an antenna assembly according to an embodiment of the present invention. Fig. 2 is a rear perspective view of an antenna assembly according to an embodiment of the present invention. Fig. 3 is an exploded perspective view of an antenna assembly according to an embodiment of the present invention. Fig. 4 is a rear exploded perspective view of an antenna assembly according to one embodiment of the present invention. Fig. 5 is a rear perspective view of air flowing along a side channel in an antenna assembly according to an embodiment of the present invention. Fig. 6 is an exploded rear perspective view of an antenna assembly according to a second embodiment of the present invention. Fig. 7 is a rear view of an antenna assembly according to a second embodiment of an embodiment of the present invention. Fig. 8 is a rear view of an antenna assembly according to a third embodiment of the present invention. Fig. 9 is a bottom view of an antenna assembly according to a third embodiment of the present invention. Fig. 10 is a rear perspective view of an antenna assembly according to a fourth embodiment of the present invention. Fig. 11 is a rear view of an antenna assembly according to a fifth embodiment of the present invention. Fig. 12 is a rear view of an antenna assembly according to a sixth embodiment of the present invention. Detailed Description Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When reference is made to the drawings in which like reference numerals are used to the extent possible, even though the same constituent elements appear in different drawings. In the entire specification, if it is considered that a specific description of related known constituent elements and functions may cause the subject matter of the present invention to be unclear, a detailed description thereof will be omitted. In describing the constituent elements according to the embodiment of the