CN-115481596-B - Method, device, equipment and medium for correcting assembly printed circuit board model offset

CN115481596BCN 115481596 BCN115481596 BCN 115481596BCN-115481596-B

Abstract

The application provides a correction method, a correction device, electronic equipment and a storage medium for an assembled printed circuit board model, wherein the method comprises the steps of constructing the assembled printed circuit board model based on printed circuit board production files, determining each bonding pad group and target components thereof through the assembled printed circuit board model, determining whether the assembled printed circuit board model is subjected to integral offset based on the position relation between the bonding pad groups and the target components, and correcting the assembled printed circuit board model according to a preset flow if the assembled printed circuit board model is subjected to integral offset. Therefore, the method and the device for detecting the whole deviation of the printed circuit board judge whether the whole deviation occurs or not based on the model of the assembled printed circuit board constructed by the printed circuit board production file before production, correct the model of the assembled printed circuit board with the whole deviation, ensure the normal operation of the simulation detection work of the assembled printed circuit board, and reduce unnecessary time loss.

Inventors

XIE GUOQING
DENG DONGYU
CHEN WEILIN

Assignees

深圳市云采网络科技有限公司

Dates

Publication Date: 20260505
Application Date: 20220829

Claims (9)

1. A method for correcting an offset of an assembly printed circuit board model, comprising: constructing an assembled printed circuit board model based on the printed circuit board production file; determining a bonding pad group and a target component corresponding to the bonding pad group based on the assembled printed circuit board model; determining whether the assembly printed circuit board model has overall offset based on the positional relationship between the pad group and the target component; If the assembled printed circuit board model is subjected to integral deviation, correcting the assembled printed circuit board model according to a preset flow; The determining whether the assembly printed circuit board model has an overall offset based on the positional relationship of the pad group and the target component includes: determining a pad group center point of the pad group and a component center point of the target component; determining the center point distance between the center point of the bonding pad group and the center point of the target component; Determining whether the assembled printed circuit board model has an overall offset based on the center point distance.
2. The method of claim 1, wherein the determining a pad group center point of the pad group and a component center point of the target component comprises: Determining four vertexes of the bonding pad group, wherein the vertexes comprise an upper left vertex, an upper right vertex, a lower left vertex and a lower right vertex; Determining two intersecting lines based on the four vertexes, determining an intersection point of the two intersecting lines as the center point of the pad group, and And determining a plurality of corner points of the component, and determining a component center point based on the corner points.
3. The method of claim 1, wherein the determining whether the assembled printed circuit board model has an overall offset based on the center point distance comprises: If the distance between the center points is smaller than or equal to the preset distance, determining that the assembly printed circuit board model does not generate integral deviation; And if the center point distance is larger than the preset distance, determining that the assembly printed circuit board model is subjected to overall deviation.
4. A method according to claim 3, wherein said correcting said assembled printed circuit board model in a predetermined flow comprises: determining a first bonding pad group, a first component, a second bonding pad group and a second component from the bonding pad groups, determining a first bottom center point of the first bonding pad group, a first bonding pad group center point and a first component center point of the first component, and determining a second bottom center point of the second bonding pad group, a second bonding pad group center point and a second component center point of the second component; generating a first straight line based on the first bottom center point and the second bottom center point, establishing a first coordinate axis by taking the first bottom center point as a coordinate origin, and determining a first included angle between the first straight line and an x-axis in the first coordinate axis; Generating a second straight line based on the first component center point and the second component center point, establishing a second coordinate axis by taking the first component center point as a coordinate origin, and determining a second included angle between the second straight line and an x-axis in the second coordinate axis; Comparing the first included angle with the second included angle; if the first included angle is the same as the second included angle, the second component is translated to finish correction; and if the angles of the first included angle and the second included angle are different, rotating the second component by taking the central point of the first component as the original point until the angles of the first included angle and the second included angle are the same, and then translating the second component to finish correction.
5. The method of claim 1, wherein the determining, by the assembled printed circuit board model, a group of pads and a target component corresponding to the group of pads comprises: Identifying the bit numbers around each bonding pad group through a character identification technology; confirming whether the sizes of the bonding pad group and the component represented by the bit number are matched or not; and if the bonding pad group is matched with the component represented by the bit number, determining the component represented by the bit number as a target component of the bonding pad group.
6. The method of claim 1, wherein the printed circuit board production file comprises a Gerber file, a bill of materials file, and a coordinate file, and wherein constructing the assembled printed circuit board model based on the printed circuit board production file and the bill of materials file comprises: obtaining model data of the printed circuit board according to the Gerber file; Acquiring parameter information of the components assembled on the printed circuit board according to the bill of materials file, and matching and searching model data of the components assembled on the printed circuit board in a component model database according to the parameter information of the components assembled on the printed circuit board; Acquiring the position information of the component mounted on the printed circuit board according to the coordinate file, and And generating the assembly printed circuit board model according to the model data of the printed circuit board, the model data of the components assembled on the printed circuit board and the position information of the components assembled on the printed circuit board on the circuit board.
7. An apparatus for assembling correction of printed circuit board pattern offset, comprising: The model building module is used for building an assembled printed circuit board model based on the printed circuit board production file; a first determining module, configured to determine a pad group and a target component corresponding to the pad group based on the assembled printed circuit board model; The second determining module is used for determining whether the assembly printed circuit board model is subjected to integral deviation based on the position relation between the bonding pad group and the target component, wherein the determining whether the assembly printed circuit board model is subjected to integral deviation based on the position relation between the bonding pad group and the target component comprises determining a bonding pad group center point of the bonding pad group and a component center point of the target component, determining a center point distance between the bonding pad group center point and the target component center point, and determining whether the assembly printed circuit board model is subjected to integral deviation based on the center point distance; and the correction module is used for correcting the assembly printed circuit board model according to a preset flow if the assembly printed circuit board model is subjected to overall deviation.
8. An electronic device, the electronic device comprising: processor, and A memory for storing the processor-executable information; Wherein the processor is adapted to perform the method of correction of the pattern offset of the assembled printed circuit board of any of the preceding claims 1-6.
9. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a correction program for an offset of an assembled printed circuit board model, which correction program, when being executed by a processor, implements the steps of the method according to any of claims 1-6.

Description

Method, device, equipment and medium for correcting assembly printed circuit board model offset Technical Field The present application relates to the field of printed circuit boards, and in particular, to a method and apparatus for correcting an offset of an assembled printed circuit board model, an electronic device, and a storage medium. Background With the progress of society, various electronic products are layered endlessly, the electronic products have novel appearance, some electronic products also have novel functions, the functions are generated by the electronic products, the electronic products are not separated from a built-in assembly printed circuit board (Printed Circuit Board Assembly, PCBA), the assembly printed circuit board consists of electronic components and a circuit board, the electronic components are assembled on the circuit board through equipment such as a chip mounter and the like, the assembly process is complex, once a production file is wrong, a finished product of the assembly printed circuit board can be manually modified, even scrapped directly, some software exists in the market at present, simulation detection can be carried out on the production of the assembly printed circuit board in advance, and potential problems and risks in the production file can be checked. However, when the existing software analyzes the simulation model, errors occur occasionally, for example, when the model circuit board and the components are wholly deviated, the pins and the bonding pads of the components are misplaced, and therefore manufacturability analysis of the circuit board cannot be carried out, and the production progress is affected. Disclosure of Invention In view of the above, the present application provides a method, an apparatus, a storage medium and an electronic device for correcting an offset of an assembled printed circuit board model, which solve the technical problem that it is difficult to realize detection of an overall offset of an assembled printed circuit board model in the prior art. According to an aspect of the present application, there is provided a correction method of an offset of a model of an assembled printed circuit board, comprising: constructing an assembled printed circuit board model based on the printed circuit board production file; Determining a bonding pad group and a target component corresponding to the bonding pad group through the assembly printed circuit board model; determining whether the assembly printed circuit board model has overall offset based on the positional relationship between the pad group and the target component; And if the assembly printed circuit board model is subjected to overall deviation, correcting the assembly printed circuit board model according to a preset flow. In one possible embodiment, the determining whether the global offset of the assembled printed circuit board model occurs based on the positional relationship between the pad group and the target component includes: determining a pad group center point of the pad group and a component center point of the target component; determining the center point distance between the center point of the bonding pad group and the center point of the target component; Determining whether the assembled printed circuit board model has an overall offset based on the center point distance. In one possible embodiment, the determining the pad group center point of the pad group and the component center point of the target component includes: Determining four vertexes of the bonding pad group, wherein the vertexes comprise an upper left vertex, an upper right vertex, a lower left vertex and a lower right vertex; Determining two intersecting lines based on the four vertexes, determining an intersection point of the two intersecting lines as the center point of the pad group, and Determining a plurality of corner points of the component, and determining a component center point based on the corner points In one possible embodiment, the determining whether the overall offset of the assembled printed circuit board model based on the center point distance includes: If the distance between the center points is smaller than or equal to the preset distance, determining that the assembly printed circuit board model does not generate integral deviation; And if the center point distance is larger than the preset distance, determining that the assembly printed circuit board model is subjected to overall deviation. In one possible embodiment, the correcting the assembled printed circuit board model according to the preset process includes: determining a first bonding pad group, a first component, a second bonding pad group and a second component from the bonding pad groups, determining a first bottom center point of the first bonding pad group, a first bonding pad group center point and a first component center point of the first component, and determining a second bottom center point of th