CN-115528147-B - Tin brushing and die bonding method and device and electronic element

CN115528147BCN 115528147 BCN115528147 BCN 115528147BCN-115528147-B

Abstract

The present invention relates to the field of circuit board manufacturing technology, and in particular, to a method and an apparatus for soldering and die bonding, and an electronic device. The invention provides a tin brushing and die bonding method, which is used for brushing tin and die bonding on a substrate and comprises the following steps of identifying at least four bonding pads on the substrate, which are close to the outer edge of the substrate; the method comprises the steps of obtaining a plurality of distance values between two adjacent bonding pads along the outer edge of a substrate, classifying the distance values according to whether the difference value between the distance values and the preset size meets a preset precision range, substituting classification results into a preset algorithm to obtain mesh sizes of a steel mesh, covering the substrate with the steel mesh which meets the sizes of the steel mesh, brushing tin on the steel mesh, and then solidifying the steel mesh. The invention also provides a device and an electronic element. Solves the problem of poor precision of brushing tin when the size of the substrate is not uniform.

Inventors

CHEN ZHENLIN
LEI HAO
CHEN YONGMING
SANG JIAN
CHEN YANMING

Assignees

广州市鸿利显示电子有限公司

Dates

Publication Date: 20260508
Application Date: 20220823

Claims (8)

1. A tin brushing and die bonding method is used for brushing tin and die bonding on a substrate and is characterized by comprising the following steps: identifying at least four bonding pads on the substrate near the outer edge of the substrate; Acquiring a plurality of distance values between two adjacent bonding pads along the outer edge of the substrate; Classifying the distance values according to whether the difference value between the distance values and the preset size meets a preset precision range or not, and substituting the classification result into a preset algorithm to obtain the mesh size of the steel mesh, wherein the preset precision comprises a first preset precision and a second preset precision; The method comprises the steps of classifying the distance value according to whether the difference value between the distance value and the preset size meets the preset precision range or not, wherein the step of screening out the substrate meeting the first preset precision based on the difference value between the distance value and the preset size; Substituting the classification result into the preset algorithm to obtain the mesh size of the steel mesh comprises the steps of obtaining the number of preset bonding pads on the substrate, substituting the distance value classification result and the number of bonding pads into a VB macro to obtain the mesh size of the steel mesh; and covering the substrate with a steel mesh which meets the size of the steel mesh, brushing tin on the steel mesh, and then solidifying.
2. The method for bonding tin film according to claim 1, wherein the step of identifying the at least four bonding pads on the substrate near the outer edge of the substrate comprises the steps of identifying the positions of the center points of the at least four bonding pads on the outer edge of the substrate by a preset identification device, and connecting the center points by a preset measurement device.
3. The method for solder bump bonding according to claim 2, wherein the step of obtaining the plurality of distance values between two adjacent pads along the outer edge of the substrate comprises the steps of measuring the distance values between the center points of two adjacent pads on the connection line and obtaining at least four distance values.
4. The method of claim 1, wherein the first predetermined accuracy is-0.7 to 0.7 mm and the second predetermined accuracy is-0.05 to 0.05 mm.
5. The method for brushing tin and solidifying the crystal according to claim 1, wherein the step of brushing tin on the steel mesh comprises the steps of forming a tin paste layer on one side of the steel mesh far away from the substrate in a coating mode, and removing the steel mesh to enable the tin paste layer to fill the bonding pad to form a connecting point for solidifying the crystal.
6. An apparatus for applying the method for tin-brushing and die-bonding according to any one of claims 1 to 5, characterized in that the apparatus comprises: The identification equipment is used for identifying the positions of at least four bonding pads close to the outer edge of the substrate; the measuring equipment is used for measuring the distance value between two adjacent bonding pads along the outer edge of the substrate in at least four bonding pads; The computing equipment is used for classifying the distance value according to whether the difference value between the distance value and the preset size meets a preset precision range or not and substituting a classification result into a preset algorithm to obtain the mesh size of the steel mesh, wherein the preset precision comprises a first preset precision and a second preset precision, the classifying of the distance value according to whether the difference value between the distance value and the preset size meets the preset precision range or not comprises screening a substrate meeting the first preset precision based on the difference value between the distance value and the preset size value, classifying the substrate meeting the first preset precision based on the second preset precision, and substituting the classification result into the preset algorithm to obtain the mesh size of the steel mesh comprises the steps of obtaining the number of preset bonding pads on the substrate, substituting the distance value classification result and the number of bonding pads into a VB macro to obtain the mesh size of the steel mesh; And the tin brushing equipment is used for covering the substrate with a steel mesh which accords with the mesh size calculated by the calculation equipment and fixing the crystal after brushing tin on the steel mesh.
7. The apparatus of the method for solder bump bonding as claimed in claim 6, wherein the predetermined algorithm is VB macro.
8. An electronic component prepared by the method for tin-brushing and die-bonding according to any one of claims 1 to 5.

Description

Tin brushing and die bonding method and device and electronic element [ Field of technology ] The present invention relates to the field of circuit board manufacturing technology, and in particular, to a method and an apparatus for soldering and die bonding, and an electronic device. [ Background Art ] As the size of LED chips is smaller, the bonding pads on the substrate are smaller, and the spacing between adjacent bonding pads is smaller. In the existing tin brushing method, a steel mesh is paved on a substrate and then tin brushing is carried out, if the steel mesh is not adopted in the tin brushing process, after solder paste is brushed on a bonding pad, through reflow soldering, a pole Yi Lianxi between bonding pads is adopted, so that an LED is short-circuited, and poor display is formed. In the solder paste printing process, the spacing between adjacent bonding pads is smaller and smaller, so that the spacing between the openings of the steel mesh is smaller, and the accuracy of the steel mesh can influence whether the solder paste can fully fill the bonding pads. However, the existing substrate is generally rectangular, and has a swelling phenomenon, namely, the shape of the substrate is not completely symmetrical up and down, so that the size of the substrate is difficult to unify, and if the distance between adjacent bonding pads on each substrate is measured, a steel mesh suitable for different substrates is designed correspondingly, which takes time and labor. Therefore, the problem of poor tin brushing precision caused by non-uniform substrate sizes is solved. [ Invention ] In order to solve the problem that the size of a substrate is not uniform and the precision of brushing tin is poor, the invention provides a method for brushing tin and fixing a crystal and an electronic element. The invention provides a tin brushing and die bonding method for brushing tin on a substrate to bond the die, which comprises the following steps of identifying at least four bonding pads on the substrate, which are close to the outer edge of the substrate; Acquiring a plurality of distance values between two adjacent bonding pads along the outer edge of the substrate; Classifying the distance values according to whether the difference value between the distance values and the preset size meets a preset precision range or not, and substituting the classification result into a preset algorithm to obtain the mesh size of the steel mesh; and covering the substrate with a steel mesh which meets the size of the steel mesh, brushing tin on the steel mesh, and then solidifying. Preferably, the step of identifying the at least four bonding pads on the substrate close to the outer edge of the substrate comprises the steps of identifying the positions of the central points of the at least four bonding pads on the outer edge of the substrate through a preset identification device, and connecting the central points through a preset measurement device. Preferably, the acquiring the plurality of distance values between two adjacent bonding pads along the outer edge of the substrate comprises the steps of measuring the distance values between the center points of the two adjacent bonding pads on the connecting line and obtaining at least four distance values. Preferably, the preset precision comprises a first preset precision and a second preset precision, wherein the range of the first preset precision is-0.7 mm, and the range of the second preset precision is-0.05 mm. Preferably, the classifying the distance value according to the preset precision range comprises the steps of screening out the substrate meeting the first preset precision based on the difference value between the distance value and the preset size value, and classifying the substrate meeting the first preset precision based on the second preset precision. Preferably, substituting the classification result into the preset algorithm to obtain the mesh size of the steel mesh comprises the steps of obtaining the number of preset bonding pads on the substrate, substituting the distance value classification result and the number of bonding pads into the VB macro to obtain the mesh size of the steel mesh. Preferably, the step of brushing tin on the steel mesh comprises the steps of forming a tin paste layer on one side of the steel mesh away from the substrate in a coating mode, and removing the steel mesh to enable the tin paste layer to fill the bonding pad to form a connecting point for die bonding. The invention provides a device for the tin brushing and die bonding method, which aims to solve the technical problems and comprises the following steps: The identification equipment is used for identifying the positions of at least four bonding pads close to the outer edge of the substrate; measuring equipment is used for measuring the distance value between two adjacent bonding pads along the basic outer edge in at least four bonding pads; the computing equipment is