CN-115551206-B - Packaging substrate, preparation method thereof, packaging substrate heat dissipation detection system and method

CN115551206BCN 115551206 BCN115551206 BCN 115551206BCN-115551206-B

Abstract

The invention provides a packaging substrate, a preparation method thereof, a system and a method for detecting heat dissipation of the packaging substrate, wherein the preparation method of the packaging substrate comprises the following steps of S11, providing a supporting plate with a dissociable film; the manufacturing method comprises the steps of S12, preparing a first metal block on a dissociable film by adopting a dry method, S13, forming a first dielectric layer on the dissociable film and the first metal block to carry out plastic package on the first metal block to obtain a packaging substrate structure, S14, forming a first metal seed layer on the surface of the packaging substrate structure, S15, forming a first metal disc and a first circuit on the first metal seed layer, S16, removing a supporting plate through the dissociable film and reversing the packaging substrate structure, and S17, sequentially forming a second metal seed layer, a second metal disc and a second circuit on the surface of the packaging substrate structure. Compared with the manual copper block burying method in the traditional process, the method can effectively and fully avoid the problems of low alignment precision, layering of the substrate, reduction of the yield of the explosion plate and the like, is environment-friendly, has low cost and is beneficial to popularization.

Inventors

LUO YONGHONG
DU LINGLING
LI JUNHONG
ZHA XIAOGANG
WANG JIANBIN
ZHANG JUN

Assignees

安捷利美维电子(厦门)有限责任公司
上海美维科技有限公司

Dates

Publication Date: 20260512
Application Date: 20220923

Claims (5)

1. The preparation method of the packaging substrate is characterized by comprising the following steps of: S11, providing a support plate with a dissociable film; s12, preparing a first metal block on the dissociable film by adopting a dry method, wherein the height range of the first metal block is 5-80 mu m, the cross section length multiplied by the width range is 1 mm multiplied by 1 mm-20 mm multiplied by 20 mm so as to play a role in heat dissipation, the dry method is a 3D printing technology, the printing material used for preparing the first metal block by adopting the 3D printing technology comprises one of mixed slurry of conductive particle silver and copper or pure metal nano slurry, and when the first metal block is printed by adopting the 3D printing technology, printing and laser sintering are simultaneously carried out, or after the first printing is carried out, sintering and curing are carried out; S13, forming a first dielectric layer on the dissociable film and the first metal block to mold the first metal block to obtain a packaging substrate structure, wherein the method for preparing the first metal block further comprises the following steps: Firstly, when the first dielectric layer is formed, the top of the first dielectric layer is higher than the first metal block, then a penetrating radiating hole is formed in the first dielectric layer above the first metal block, and a metallization layer is formed, or a circle of printing ink fence is formed around the first metal block to be printed, then the printing of the first metal block is performed, and the printing ink fence is removed, or a dry film is stuck on the dissociable film, and then the printing of the first metal block is performed after exposure and development, and then the dry film is removed; s14, forming a first metal seed layer on the surface of the packaging substrate structure; s15, forming a first metal disc and a first circuit on the first metal seed layer; s16, removing the supporting plate through the dissociable film, and reversing the packaging substrate structure; S17, sequentially forming a second metal seed layer, a second metal disc and a second circuit on the surface of the packaging substrate structure, wherein the first metal seed layer, the first metal disc, the first circuit, the second metal seed layer, the second metal disc and the second circuit are positioned on two opposite sides of the packaging substrate structure to obtain the packaging substrate; Repeating steps S12 to S15 at least once after step S15 when the height of the packaging substrate is smaller than the preset height of the packaging substrate until the packaging substrate with the preset height is formed; The preparation method of the packaging substrate further comprises the step of performing a solder resist process on the upper surface and the lower surface of the packaging substrate to protect the outer layer structure of the packaging substrate from oxidation.
2. The method of manufacturing a package substrate according to claim 1, wherein the first metal bump is a copper bump.
3. A package substrate, characterized in that the package substrate comprises the package substrate prepared by the method for preparing a package substrate according to any one of claims 1-2.
4. A package substrate heat dissipation detection system is characterized by comprising a package substrate, a heating element, a thermocouple, a computer and a thermal infrared imager according to claim 3, wherein one end of the thermocouple is connected with the heating element attached to the package substrate, and the other end of the thermocouple is connected with the computer.
5. The package substrate heat dissipation detection method is characterized by comprising the following steps: s21, providing the package substrate heat dissipation detection system of claim 4; s22, the thermocouple collects heat energy of the heating element and device, and converts the heat energy into electric quantity to be displayed on a computer; S23, collecting temperature data of the heating components by using the thermal infrared imager; and S24, recording and arranging the data, and comparing and analyzing the data.

Description

Packaging substrate, preparation method thereof, packaging substrate heat dissipation detection system and method Technical Field The invention relates to the field of manufacturing of printed circuit boards, in particular to a packaging substrate, a manufacturing method thereof, and a packaging substrate heat dissipation detection system and method. Background With the development of modern society, particularly with the advent of the 5G age, electronic products gradually become multifunctional and highly integrated, and high-power electronic components such as high-frequency radio frequency and power amplifier have higher and higher requirements on the heat dissipation capability of the package substrate, which promotes the development of high-density and diversified substrate heat dissipation structure designs. High-frequency high-speed substrates with high-speed, low-consumption and high-quality signal transmission function are more required to be suitable for high-power consumption performance of high-frequency high-power elements. If the power consumption in the substrate is large, the heat dissipation structure is small, the whole heat of the substrate can be rapidly increased, even because of different thermal expansion coefficients of different materials in the substrate, the materials can expand to different degrees after absorbing the heat, different internal stresses are induced, and thus the problems of layering, bubbling, board explosion and the like are generated, and the electrical performance of the substrate is easily reduced or even damaged during long-term work. Therefore, it is particularly important to solve the heat dissipation problem of the package substrate. Therefore, a copper block embedding technology is generated, and the technology is used for directly embedding high-thermal-conductivity metal blocks such as copper blocks and the like into the substrate board, so that the heat dissipation problem of the packaging substrate is solved. The substrate with the embedded copper block structure comprises the core steps of material cutting, preparation of an embedded copper groove, embedding of a copper block, pressing and glue overflow cutting. The copper block burying technology can improve the heat dissipation problem of the substrate to a certain extent, but some problems also occur in the manufacturing process, such as: 1) Burying copper blocks in a substrate for manual operation, so that the production efficiency is low, alignment during burying is difficult to accurately control, and height difference between two ends of the copper blocks and a plate surface is easy to occur, such as concave and convex of the copper blocks, so that stable control is difficult to realize; 2) In the lamination process, the prepreg or the dielectric layer has flowing property under the high temperature condition, after the copper block is embedded and laminated, a layer of resin adhesive is covered around the copper block, the resin adhesive cannot be completely removed in the subsequent process, and the residual resin adhesive can influence the reliability of the product; 3) The binding force between the high-thermal conductivity copper block and the base material in the dielectric layer or the core plate is poor, and after heat dissipation and temperature rise, the stress is increased due to the difference of thermal expansion coefficients of materials, so that the hidden quality hazards such as layering, board explosion and the like are easy to occur. In view of the above, it is necessary to provide a package substrate, a method for manufacturing the same, and a system and a method for inspecting heat dissipation of the package substrate, so as to solve the problems of product performance caused by the copper block burying technology in the prior art, such as quality problems of height difference, glue overflow, delamination, and explosion of the copper block and the carrier. Disclosure of Invention In view of the above-mentioned drawbacks of the prior art, the present invention is directed to a package substrate, a method for manufacturing the same, and a system and a method for inspecting heat dissipation of the package substrate, so as to solve the problems of product performance caused by the copper block burying technology in the prior art, such as quality problems of height difference, glue overflow, delamination, and board explosion of the copper block and the carrier plate in the conventional copper block burying technology. To achieve the above and other related objects, the present invention provides a method for manufacturing a package substrate, the method comprising: S11, providing a support plate with a dissociable film; S12, preparing a first metal block on the dissociable film by adopting a dry method; S13, forming a first dielectric layer on the dissociable film and the first metal block to mold the first metal block, so as to obtain a packaging substrate structure; s14, formin