CN-115566115-B - Chip mass transfer method, chip substrate and positioning plate

Abstract

The invention provides a chip mass transfer method which comprises the following steps of placing chips in liquid, solidifying the liquid wrapping the chips to form spheres, wrapping a chip to be transferred in each sphere, placing the spheres on a target substrate, enabling each hole on the target substrate to fall on the spheres wrapping the chips, removing solid substances except the chips in the spheres, and enabling the chips to fall in the holes on the target substrate, so that the chips are enveloped by the holes on the target substrate. The solid substances in the spheres are removed, the chips are arranged in the holes of the target substrate, whether the complete transfer is finished or not can be quickly obtained through detection of the solidified or gelled liquid, and the untransferred parts are timely repaired at fixed points, so that the transfer speed and yield of the mass transfer technology are improved.

Inventors

• Ding Fanxing

Assignees

• 丁繁星

Dates

Publication Date

20260505

Application Date

20221110

Claims (8)

1. 1. A method for transferring a plurality of chips, comprising the steps of: s1, placing a chip to be transferred in a specific liquid, solidifying or gelling the liquid wrapping the chip to form spheres, and wrapping one chip to be transferred in each sphere; S2, placing the spheres on a target substrate, enabling each open hole on the target substrate to fall on the sphere wrapping the chip, and determining whether the sphere wrapping the chip exists on the hole or not through fluorescence detection or illumination; And S3, removing other solid substances except the chip in the sphere, and enabling the chip to fall into the hole of the target substrate so that the chip is completely enveloped by the hole on the target substrate.
2. 2. The method of claim 1, wherein between step S1 and step S2, there is further included the step of providing a locating plate on the target substrate, the locating plate having an array of locating holes aligned with corresponding holes on the target substrate, wherein the diameter of the inscribed circle of the locating holes is set to be smaller than the diameter of the sphere, the locating holes enabling the chip to pass through.
3. 3. The method of claim 1, wherein if the chips with different types are required to be transferred onto the same substrate, the method comprises the steps of setting the chips with different types and the holes of the chips with the largest size in the chips to be transferred into different sizes according to different types before the step S1, the step S2 comprises the steps of placing spheres corresponding to the chips with the largest size in the chips to be transferred on the target substrate, and the step S3 further comprises the step S2 of removing the chips which do not completely fall into the holes and continuing to transfer the chips with the largest size in the chips to be transferred until all the chips are transferred.
4. 4. The method of claim 2, wherein if transferring different kinds of chips onto the same substrate is required, the step S1 is preceded by setting the diameters of spheres wrapping the different kinds of chips to be different sizes, setting the diameters of corresponding positioning holes to be different sizes, enabling the spheres to just fall on the target positioning holes and pass through the larger non-corresponding positioning holes, the step S2 is repeated until the spheres wrapping the chips are placed on the positioning plate, enabling each positioning hole of the positioning plate to fall on the sphere wrapping the chips, continuing to place spheres with a diameter larger than one level until the positioning holes are all spheres, and executing the step S3 after aligning the positioning holes with the holes corresponding to the substrate.
5. 5. The method of claim 2, wherein if transferring different kinds of chips onto the same substrate is required, the step S2 is preceded by obtaining a plurality of positioning plates, each of which has the same positioning hole array as the expected transfer position of the target kind of chips on the target substrate, and the step S3 is followed by replacing the positioning plates and proceeding to the step S2 to continue transferring chips to be transferred until all the chip transfers are completed.
6. 6. The method according to any one of claims 1 to 5, wherein if the chip to be transferred is to be distinguished from the front side and the back side, step S2 comprises adjusting the orientation of the chips which have fallen on the holes to be uniform if the orientation is required.
7. 7. The method of claim 6, wherein the orientation of the chip is adjusted to be uniform using a method of magnetic force, electrostatic force or gravity, the chip adopting a barycentric shift geometric barycentric design, or imparting magnetism or static electricity on the same plane.
8. 8. The method of claim 1, wherein step S1 comprises solidifying or gelling the liquid surrounding the chip to form spheres using microfluidic techniques.

Description

Chip mass transfer method, chip substrate and positioning plate Technical Field The invention relates to the technical field of manufacturing of conductor display devices, in particular to a chip mass transfer method, a chip substrate and a positioning plate. Background The Micro-LED (Micro light emitting diode) display technology has great prospect, and the current obstruction of the Micro-LED industrialization comprises the huge transfer of semiconductor chips. Conventional mass transfer techniques are generally limited by the production of chips, and the need for production transfer requires continuous processing, resulting in inefficient transfer. The fluid assembly can separate the production and transfer links, but the semiconductor is irregular in shape and uncontrollable in fluid, so that whether the complete transfer is difficult to detect or not is difficult to detect, the transfer precision of the chip cannot be guaranteed, and the yield is low. It should be noted that the information disclosed in the above background section is only for understanding the background of the application and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art. Disclosure of Invention The invention aims to solve the problem of improving the yield under the condition of ensuring the speed of a mass transfer technology, and provides a mass transfer method, a chip substrate and a positioning plate. In order to achieve the above purpose, the present invention adopts the following technical scheme: the invention provides a chip mass transfer method, which comprises the following steps: s1, placing a chip to be transferred in a specific liquid, solidifying or gelling the liquid wrapping the chip to form spheres, and wrapping one chip to be transferred in each sphere; s2, placing the spheres on a target substrate, and enabling each open hole on the target substrate to fall on the sphere wrapping the chip; And S3, removing other solid substances except the chip in the sphere, and enabling the chip to fall into the hole of the target substrate so that the chip is completely enveloped by the hole on the target substrate. In some embodiments, between step S1 and step S2, a positioning plate is provided on the target substrate, the positioning plate having an array of positioning holes aligned with corresponding holes on the target substrate, wherein the diameter of the inscribed circle of the positioning holes is set smaller than the diameter of the sphere, and the positioning holes enable the chip to pass through. In some embodiments, if chips of different types are required to be transferred onto the same substrate, the step S1 is preceded by setting the chips of different types and the holes of the chips to be dropped into the target substrate to different sizes according to different types, the step S2 includes placing spheres corresponding to the chips with the largest sizes in the chips to be transferred on the target substrate, and the step S3 is followed by the step S2 of removing the chips which do not completely drop into the holes, and continuing to transfer the chips with the largest sizes in the chips to be transferred until all the chip transfers are completed. In some embodiments, if different types of chips need to be transferred to the same substrate, the step S1 is preceded by setting the diameters of spheres wrapping the different types of chips to be different sizes, setting the diameters of corresponding positioning holes to be different sizes, enabling the spheres to just fall on the target positioning holes and pass through larger non-corresponding positioning holes, the step S2 is repeated by placing spheres with smaller diameters on the positioning plate, enabling each positioning hole of the positioning plate to fall on the sphere wrapping the chip, continuing to place spheres with a diameter larger than one level after the placement of the spheres until the positioning holes are all spheres, and executing the step S3 after aligning the positioning holes with the holes corresponding to the substrate. In some embodiments, if transferring different kinds of chips onto the same substrate is required, the step S2 is preceded by obtaining a plurality of positioning plates, wherein the positioning hole array of each positioning plate is the same as the expected transfer position of the target kind of chips on the target substrate, and the step S3 is followed by replacing the positioning plates and proceeding to the step S2 to continue transferring the chips to be transferred until all the chip transfers are completed. In some embodiments, if the chip to be transferred is to distinguish the front side from the back side, step S2 includes adjusting the orientation of the chips that have fallen on the holes to be uniform if the orientation is to be adjusted. In some embodiments, the orientation of the chip is adjusted to be uniform using magn