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CN-115621181-B - Turnover device

CN115621181BCN 115621181 BCN115621181 BCN 115621181BCN-115621181-B

Abstract

The invention provides a turnover device which comprises a support body, a rotary driver and a clamping device, wherein a plurality of separation plates are formed on the inner side surfaces of two side walls of the support body, slide grooves for placing wafers are formed between adjacent separation plates, rotary shafts are formed on the outer side surfaces of the two side walls of the support body, the rotary driver is connected with at least one rotary shaft to drive the support body to rotate, and the clamping device is arranged on the side walls of the support body and used for compressing or releasing the wafers placed in the slide grooves. According to the wafer clamping device, the clamping device is arranged on the support body for holding the wafer, and the wafer is fixed by the clamping device when the support body rotates, so that fragments or surface scratches caused by the fact that the wafer shakes in the support body when the posture of the wafer is changed along with the support body can be effectively avoided.

Inventors

  • WANG HE
  • LI YAZHOU
  • JIA SHENA
  • TAO XIAOFENG
  • WANG HUI

Assignees

  • 盛美半导体设备(上海)股份有限公司

Dates

Publication Date
20260512
Application Date
20210713

Claims (13)

  1. 1. A flipping device, comprising: The wafer carrier comprises a bracket body, wherein a plurality of partition plates are formed on the inner side surfaces of two side walls of the bracket body, slide grooves for placing wafers are formed between adjacent partition plates, and rotating shafts are formed on the outer side surfaces of the two side walls of the bracket body; A rotary driver connected with at least one rotary shaft to drive the bracket body to rotate, and The clamping device is arranged on the side wall of the bracket body and used for compressing or releasing the wafer placed in the slide glass groove; Wherein, clamping device includes: The shell is fixed on the side wall of the bracket body; the piston is arranged in the shell in a sliding manner and is provided with a driving force by an air source; The telescopic rod is arranged in the shell in a sliding way, and one end of the telescopic rod is fixedly connected with the piston; the return spring is arranged at the other end of the shell and connected with the other end of the telescopic rod, and is used for resetting the piston and the telescopic rod; the limiting grooves are formed in one side of the shell and are arranged along the length direction of the telescopic rod; and one end of each limiting rod is fixed on the corresponding telescopic rod, and the other end of each limiting rod penetrates through the corresponding limiting groove, and the limiting rods are driven to slide in the limiting grooves through the telescopic rods to compress or release the wafers placed in the slide glass grooves.
  2. 2. The turnover device of claim 1, wherein the clamping device further comprises an air port provided at one end of the housing for connecting to an air source; The plurality of limit grooves are arranged at equal intervals along the length direction of the telescopic rod.
  3. 3. The flip device of claim 2, wherein the clamping device further comprises a drainage chamber for collecting and draining liquid accumulated inside the housing.
  4. 4. The tilting device according to claim 2, wherein the clamping device is further provided with a displacement sensor for measuring the displacement of the telescopic rod.
  5. 5. The turnover device of claim 2, wherein the partition plate of the bracket body is provided with a receiving groove for receiving the limit rod.
  6. 6. The turnover device of claim 1, wherein the bottom of the slide groove of the bracket body is provided with a plurality of drain holes.
  7. 7. The apparatus of claim 1, further comprising a housing, wherein the housing is provided with a load port.
  8. 8. The turnover device of claim 7, further comprising an exhaust device arranged on the rear wall of the box body, wherein the exhaust device comprises a first air exhausting plate, a second air exhausting plate, a liquid collecting cavity and an exhaust outlet which are sequentially arranged along the airflow flowing direction, the first air exhausting plate is provided with a plurality of first air holes, the second air exhausting plate is provided with a plurality of second air holes, a gap is reserved between the first air exhausting plate and the second air exhausting plate, the first air holes and the second air holes are arranged in a staggered mode, and the exhaust outlet is used for being connected with a fan.
  9. 9. The turnover device of claim 8, wherein the second ventilation holes and the air outlet are disposed obliquely upward.
  10. 10. The turning device of claim 8 wherein the first exhaust plate is disposed obliquely to the second exhaust plate.
  11. 11. The turnover device of claim 8, wherein the bottom of the liquid collecting cavity is provided with a liquid outlet.
  12. 12. The apparatus of claim 1 further comprising a lifting mechanism comprising a lifting rod and a support fixed to the lifting rod, the support being moved up and down by the lifting rod to assist in transferring the wafer from the transfer robot to the carrier body.
  13. 13. The flipping unit of claim 1, further comprising a plurality of nozzles disposed about the carrier body for spraying a liquid onto the wafer held within the carrier body.

Description

Turnover device Technical Field The invention relates to the field of semiconductor equipment, in particular to a turnover device. Background In semiconductor device manufacturing, a plurality of different processes are involved, and the different processes are different in the placing posture of the wafer for realizing the respective processing purposes. For example, with the continuous reduction of semiconductor manufacturing process, the requirement on the cleanliness of the wafer surface is higher and higher, and in order to consider the cleaning effect and efficiency of the wafer surface, the skilled person develops a groove type single-chip combined cleaning machine, i.e. the groove type cleaning machine and the single-chip cleaning machine are integrated in the same equipment. As is well known, in a tank type cleaning machine, a wafer is immersed in a cleaning tank in a vertical posture to perform a cleaning process, whereas in a single-wafer type cleaning machine, the wafer is held on a carrier table in a horizontal posture to perform a cleaning process. Because general manipulator only has the function of snatching, can easily snatch the wafer of vertical or horizontal gesture, and can't realize the upset function, if the manipulator disposes the upset function, will increase its structure and control the complexity, consequently, set up tilting mechanism in the wafer conveying process of different gesture generally, as the intermediate platform, change the attitude of putting of wafer to adapt to different technologies, make things convenient for the transmission of manipulator. Referring to fig. 1, the robot 101 grips the wafer 103 after the end of the previous process and transfers the wafer 103 into the wafer holder 111 in the flipping mechanism 110. The flipping mechanism 110 further includes a receiving chamber 113 and a driver 115, the wafer support 111 is installed in the receiving chamber 113, and the driver 115 drives the wafer support 111 to rotate in the receiving chamber 113 so that the wafer 103 held in the wafer support 111 is converted from a vertical posture to a horizontal posture. Then, another robot 102 is extended into the loading port 114 opened from the accommodation chamber 113, and the wafer 103 is taken out from the flipping mechanism 110 in a horizontal posture and transferred to the next process, see fig. 2. Referring to fig. 3, the wafer support 111 has one or more groups of slide grooves 112 for receiving one or more wafers 103, and for facilitating loading and unloading of the wafers 103, the width of the notch of the slide groove 112 on the wafer support 111 is set to be greater than the thickness of the wafers 103, typically the notch is about 4mm, and the thickness of the wafers 103 is about 0.7mm. When the wafer is rotated from the vertical posture to the horizontal posture, since the thickness of the wafer is smaller than the width of the notch, the wafer may shake (see the direction indicated by the arrow in fig. 3) in the slide groove 112 under the action of self-gravity during the rotation, so that scratches and even fragments may be generated on the surface of the wafer. Disclosure of Invention The invention aims to provide a turnover device which can solve the problem that scratches or fragments are generated when wafers shake in the process of transferring in a groove-type and single-chip combined cleaning machine. To achieve the above and other related objects, the present invention provides a flipping device comprising: The wafer carrier comprises a bracket body, wherein a plurality of partition plates are formed on the inner side surfaces of two side walls of the bracket body, slide grooves for placing wafers are formed between adjacent partition plates, and rotating shafts are formed on the outer side surfaces of the two side walls of the bracket body; A rotary driver connected with at least one rotary shaft to drive the bracket body to rotate, and And the clamping device is arranged on the side wall of the bracket body and used for compressing or releasing the wafer placed in the slide glass groove. Preferably, in the turning device, the clamping device includes: The shell is fixed on the side wall of the bracket body; The air receiving port is arranged at one end of the shell and is used for connecting an air source; the piston is arranged in the shell in a sliding manner and is provided with a driving force by an air source; The telescopic rod is arranged in the shell in a sliding way, and one end of the telescopic rod is fixedly connected with the piston; the return spring is arranged at the other end of the shell and connected with the other end of the telescopic rod, and is used for resetting the piston and the telescopic rod; the limiting grooves are formed in one side of the shell and are arranged at equal intervals along the length direction of the telescopic rod; and one end of each limiting rod is fixed on the corresponding telescopic rod, an